JPH0273740U - - Google Patents
Info
- Publication number
- JPH0273740U JPH0273740U JP15403388U JP15403388U JPH0273740U JP H0273740 U JPH0273740 U JP H0273740U JP 15403388 U JP15403388 U JP 15403388U JP 15403388 U JP15403388 U JP 15403388U JP H0273740 U JPH0273740 U JP H0273740U
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- thin wire
- resin
- semiconductor element
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
- H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Wire Bonding (AREA)
Description
第１図は本考案の一実施例の断面図、第２図は
従来の樹脂封止型半導体装置の断面図である。 符号の説明、１：封止用樹脂、２：細線、３：
半導体素子、４：基板、５：接着剤、６：導体パ
ターン、７：細線、８：半導体素子、９：接着剤
、１０：封止用樹脂、１１：導体パターン、１２
：基板。
従来の樹脂封止型半導体装置の断面図である。 符号の説明、１：封止用樹脂、２：細線、３：
半導体素子、４：基板、５：接着剤、６：導体パ
ターン、７：細線、８：半導体素子、９：接着剤
、１０：封止用樹脂、１１：導体パターン、１２
：基板。
Claims (1)
- 細線ボンデイング方式による樹脂封止型半導体
装置に於いて、半導体素子の側面を接着剤を介し
て基板に固定する構成としたことを特徴とする樹
脂封止型半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15403388U JPH0273740U (ja) | 1988-11-25 | 1988-11-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15403388U JPH0273740U (ja) | 1988-11-25 | 1988-11-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0273740U true JPH0273740U (ja) | 1990-06-05 |
Family
ID=31430400
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15403388U Pending JPH0273740U (ja) | 1988-11-25 | 1988-11-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0273740U (ja) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5471986A (en) * | 1977-11-18 | 1979-06-08 | Toshiba Corp | Semiconductor device and production thereof |
-
1988
- 1988-11-25 JP JP15403388U patent/JPH0273740U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5471986A (en) * | 1977-11-18 | 1979-06-08 | Toshiba Corp | Semiconductor device and production thereof |