JPS6364035U - - Google Patents

Info

Publication number
JPS6364035U
JPS6364035U JP1986158925U JP15892586U JPS6364035U JP S6364035 U JPS6364035 U JP S6364035U JP 1986158925 U JP1986158925 U JP 1986158925U JP 15892586 U JP15892586 U JP 15892586U JP S6364035 U JPS6364035 U JP S6364035U
Authority
JP
Japan
Prior art keywords
bonding pad
film
view
utility
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986158925U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986158925U priority Critical patent/JPS6364035U/ja
Publication of JPS6364035U publication Critical patent/JPS6364035U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07553—Controlling the environment, e.g. atmosphere composition or temperature changes in shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/934—Cross-sectional shape, i.e. in side view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/981—Auxiliary members, e.g. spacers
    • H10W72/983—Reinforcing structures, e.g. collars

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案の一実施例の縦断面図、第２図
は本考案の他の実施例の縦断面図、第３図は従来
のボンデイングパツドの断面図、第４図は従来の
ボンデイングパツドの上面図である。 １……ボンデイングワイヤー、２……導電性膜
、３……酸化膜、４……基板、５……保護膜、１
１……ボンデイングワイヤー、１２……導電性膜
、１３……下地膜、１４……酸化膜、１５……基
板、１６……保護膜、２１……ボンデイングワイ
ヤー、２２……導電性膜、２３……酸化膜、２４
……基板、３１……ボンデイングワイヤー、３２
……導電性膜、３３……突出した導電性膜、３４
……保護膜。

Claims (1)

    【実用新案登録請求の範囲】
  1. 表面に凹凸を有するボンデイングパツドを有す
    ることを特徴とする半導体装置。
JP1986158925U 1986-10-16 1986-10-16 Pending JPS6364035U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986158925U JPS6364035U (ja) 1986-10-16 1986-10-16

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986158925U JPS6364035U (ja) 1986-10-16 1986-10-16

Publications (1)

Publication Number Publication Date
JPS6364035U true JPS6364035U (ja) 1988-04-27

Family

ID=31082874

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986158925U Pending JPS6364035U (ja) 1986-10-16 1986-10-16

Country Status (1)

Country Link
JP (1) JPS6364035U (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017041566A (ja) * 2015-08-20 2017-02-23 セイコーエプソン株式会社 半導体装置及びその製造方法、電子機器並びに移動体
JPWO2021240748A1 (ja) * 2020-05-28 2021-12-02

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017041566A (ja) * 2015-08-20 2017-02-23 セイコーエプソン株式会社 半導体装置及びその製造方法、電子機器並びに移動体
CN106469659A (zh) * 2015-08-20 2017-03-01 精工爱普生株式会社 半导体装置及其制造方法、电子设备以及移动体
CN106469659B (zh) * 2015-08-20 2021-08-10 精工爱普生株式会社 半导体装置及其制造方法、电子设备以及移动体
JPWO2021240748A1 (ja) * 2020-05-28 2021-12-02
WO2021240748A1 (ja) * 2020-05-28 2021-12-02 三菱電機株式会社 半導体装置およびその製造方法ならびに電力変換装置
US12588539B2 (en) 2020-05-28 2026-03-24 Mitsubishi Electric Corporation Semiconductor device, method for manufacturing same, and electric power converter

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