JPH0273763U - - Google Patents
Info
- Publication number
- JPH0273763U JPH0273763U JP15348688U JP15348688U JPH0273763U JP H0273763 U JPH0273763 U JP H0273763U JP 15348688 U JP15348688 U JP 15348688U JP 15348688 U JP15348688 U JP 15348688U JP H0273763 U JPH0273763 U JP H0273763U
- Authority
- JP
- Japan
- Prior art keywords
- metal plate
- circuit layer
- hole
- wiring board
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
第１図は本考案実施例の製造工程を示す断面図
、第２図及び第３図はそれぞれ本考案の別の実施
例を示す断面図、第４図、第５図、第６図、第７
図はそれぞれ従来例を説明する断面図である。
主要部分の符号の説明、１，２０１，３０１…
金属板、２，２０２，３０２…絶縁層、３，２０
３，３０３…回路層、４，２０４，３０４…透孔
、５，２０５，３０５…銅メツキ層、６，２０６
，３０６…リードピン、７，２０７，３０７…半
田。
FIG. 1 is a cross-sectional view showing the manufacturing process of an embodiment of the present invention, FIGS. 2 and 3 are cross-sectional views showing other embodiments of the present invention, and FIGS. 7
Each figure is a sectional view explaining a conventional example. Explanation of symbols of main parts, 1,201,301...
Metal plate, 2,202,302...Insulating layer, 3,20
3,303...Circuit layer, 4,204,304...Through hole, 5,205,305...Copper plating layer, 6,206
, 306...Lead pin, 7,207,307...Solder.
Claims (1)
電子部品が搭載される回路層を設けた金属板ベー
スプリント配線板における回路層と金属板のアー
ス接続構造であつて、前記回路層と金属板を貫く
ように穿設した透孔に前記電子部品のリードピン
を挿入し、該リードピンと前記金属板とを前記透
孔の内壁あるいは開口部において接合したことを
特徴とする金属板ベースプリント配線板のアース
接続構造。 A ground connection structure between a circuit layer and a metal plate in a metal plate-based printed wiring board, which has a circuit layer on at least one surface of the metal plate on which electronic components are mounted via an insulating layer, the circuit layer and the metal plate A metal plate-based printed wiring board characterized in that a lead pin of the electronic component is inserted into a through hole drilled through the through hole, and the lead pin and the metal plate are joined at the inner wall or opening of the through hole. Earth connection structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15348688U JPH0273763U (en) | 1988-11-28 | 1988-11-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15348688U JPH0273763U (en) | 1988-11-28 | 1988-11-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0273763U true JPH0273763U (en) | 1990-06-05 |
Family
ID=31429368
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15348688U Pending JPH0273763U (en) | 1988-11-28 | 1988-11-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0273763U (en) |
-
1988
- 1988-11-28 JP JP15348688U patent/JPH0273763U/ja active Pending
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