JPH0273765U - - Google Patents

Info

Publication number
JPH0273765U
JPH0273765U JP15372388U JP15372388U JPH0273765U JP H0273765 U JPH0273765 U JP H0273765U JP 15372388 U JP15372388 U JP 15372388U JP 15372388 U JP15372388 U JP 15372388U JP H0273765 U JPH0273765 U JP H0273765U
Authority
JP
Japan
Prior art keywords
land
upper layer
wiring board
layer
printed wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15372388U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP15372388U priority Critical patent/JPH0273765U/ja
Publication of JPH0273765U publication Critical patent/JPH0273765U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図a,bは本考案の一実施例の製造方法を
説明するための工程順に示した斜視図である。 1…絶縁基板、2…ランド、3…配線、4…位
置決め穴、5…絶縁フイルム、6…ランド、7…
配線、8…位置決め穴。
FIGS. 1a and 1b are perspective views showing the order of steps for explaining a manufacturing method according to an embodiment of the present invention. DESCRIPTION OF SYMBOLS 1...Insulating board, 2...Land, 3...Wiring, 4...Positioning hole, 5...Insulating film, 6...Land, 7...
Wiring, 8...Positioning hole.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 絶縁板上に設けた下層のランドと、前記下層の
ランドに接続して設けた下層の配線を備えた印刷
配線基板と、絶縁フイルム上に前記下層のランド
の位置に対応して設けた上層のランドと前記上層
のランド間を接続する上層配線とを有し前記印刷
配線基板上に重ねて貼付け前記下層のランドと前
記上層のランドを接続した補助配線フイルムとを
備えたことを特徴とする回路基板。
A printed wiring board comprising a lower land provided on an insulating plate, a lower layer wiring connected to the lower land, and an upper layer provided on an insulating film corresponding to the position of the lower land. A circuit comprising an auxiliary wiring film which has an upper layer wiring connecting between a land and the upper layer land, and which is laminated on the printed wiring board and connects the lower layer land and the upper layer land. substrate.
JP15372388U 1988-11-25 1988-11-25 Pending JPH0273765U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15372388U JPH0273765U (en) 1988-11-25 1988-11-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15372388U JPH0273765U (en) 1988-11-25 1988-11-25

Publications (1)

Publication Number Publication Date
JPH0273765U true JPH0273765U (en) 1990-06-05

Family

ID=31429816

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15372388U Pending JPH0273765U (en) 1988-11-25 1988-11-25

Country Status (1)

Country Link
JP (1) JPH0273765U (en)

Similar Documents

Publication Publication Date Title
JPS62184775U (en)
JPH0273765U (en)
JPH0213770U (en)
JPS63127171U (en)
JPS62188180U (en)
JPH0262774U (en)
JPH01160898U (en)
JPS61100168U (en)
JPH01159397U (en)
JPS63165877U (en)
JPS6351478U (en)
JPH04774U (en)
JPS6127271U (en) Printed board
JPH02127059U (en)
JPS6245861U (en)
JPS6176994U (en)
JPS63137975U (en)
JPH0236070U (en)
JPS61173157U (en)
JPH0231175U (en)
JPS61140573U (en)
JPH02102769U (en)
JPH0351872U (en)
JPS631383U (en)
JPS6379679U (en)