JPH02739U - - Google Patents
Info
- Publication number
- JPH02739U JPH02739U JP1988078455U JP7845588U JPH02739U JP H02739 U JPH02739 U JP H02739U JP 1988078455 U JP1988078455 U JP 1988078455U JP 7845588 U JP7845588 U JP 7845588U JP H02739 U JPH02739 U JP H02739U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- heat
- brought
- utility
- scope
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図はこの考案の一実施例によるＱＦＰ半導
体装置を示す外形図、第２図はこの考案の一実施
例によるＱＦＰ半導体装置を示す断面図、第３図
は従来のＱＦＰ半導体装置を示す外形図、第４図
は従来のＱＦＰ半導体装置を示す断面図である。 図中、１はパツケージ、２はリードフレーム、
３はワイヤ、４はチツプ、５はダイパツド、６は
放熱器、７は接着剤、８は接合材。尚、図中、同
一符号は同一又は相当部分を示す。
体装置を示す外形図、第２図はこの考案の一実施
例によるＱＦＰ半導体装置を示す断面図、第３図
は従来のＱＦＰ半導体装置を示す外形図、第４図
は従来のＱＦＰ半導体装置を示す断面図である。 図中、１はパツケージ、２はリードフレーム、
３はワイヤ、４はチツプ、５はダイパツド、６は
放熱器、７は接着剤、８は接合材。尚、図中、同
一符号は同一又は相当部分を示す。
Claims (1)
- 発熱する半導体において、放熱器を直接発熱部
に接触させたことを特徴とする半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988078455U JPH02739U (ja) | 1988-06-14 | 1988-06-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988078455U JPH02739U (ja) | 1988-06-14 | 1988-06-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02739U true JPH02739U (ja) | 1990-01-05 |
Family
ID=31303379
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988078455U Pending JPH02739U (ja) | 1988-06-14 | 1988-06-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02739U (ja) |
-
1988
- 1988-06-14 JP JP1988078455U patent/JPH02739U/ja active Pending