JPH01107157U - - Google Patents

Info

Publication number
JPH01107157U
JPH01107157U JP1988002975U JP297588U JPH01107157U JP H01107157 U JPH01107157 U JP H01107157U JP 1988002975 U JP1988002975 U JP 1988002975U JP 297588 U JP297588 U JP 297588U JP H01107157 U JPH01107157 U JP H01107157U
Authority
JP
Japan
Prior art keywords
hole
thin film
metal thin
resin
wall surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1988002975U
Other languages
English (en)
Other versions
JPH0810207Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988002975U priority Critical patent/JPH0810207Y2/ja
Priority to US07/227,332 priority patent/US4942454A/en
Publication of JPH01107157U publication Critical patent/JPH01107157U/ja
Application granted granted Critical
Publication of JPH0810207Y2 publication Critical patent/JPH0810207Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】
第１図はこの考案の一実施例の樹脂封止形半導
体装置の断面図、第２図は従来の樹脂封止形半導
体装置に用いられるリードフレームの平面図、第
３図は第２図のリードフレームのメツキ工程を示
す断面図、第４図は従来の樹脂封止形半導体装置
の断面図である。 図において、４はダイパツト、５は貫通穴、１
５は貫通穴の壁面、１６は金属薄膜、１８は半導
体素子、１９は半田、２１は樹脂である。なお、
各図中同一符号は同一、または相当部分を示す。

Claims (1)

    【実用新案登録請求の範囲】
  1. 貫通穴を有するダイパツトと、前記貫通穴の壁
    面を除き前記ダイパツドの少なくとも一主面に形
    成された金属薄膜と、この金属薄膜上に固着材を
    介して固着された半導体素子とを、樹脂で一体的
    にモールドしてなり、前記貫通穴の壁面は前記金
    属薄膜に比べて前記固着材に漏れにくいことを特
    徴とする樹脂封止形半導体装置。
JP1988002975U 1987-08-05 1988-01-12 樹脂封止形半導体装置 Expired - Lifetime JPH0810207Y2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP1988002975U JPH0810207Y2 (ja) 1988-01-12 1988-01-12 樹脂封止形半導体装置
US07/227,332 US4942454A (en) 1987-08-05 1988-08-02 Resin sealed semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988002975U JPH0810207Y2 (ja) 1988-01-12 1988-01-12 樹脂封止形半導体装置

Publications (2)

Publication Number Publication Date
JPH01107157U true JPH01107157U (ja) 1989-07-19
JPH0810207Y2 JPH0810207Y2 (ja) 1996-03-27

Family

ID=31204206

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988002975U Expired - Lifetime JPH0810207Y2 (ja) 1987-08-05 1988-01-12 樹脂封止形半導体装置

Country Status (1)

Country Link
JP (1) JPH0810207Y2 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0369148A (ja) * 1989-08-08 1991-03-25 Ibiden Co Ltd 電子部品搭載用基板及び電子部品パッケージ

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63150953A (ja) * 1986-12-15 1988-06-23 Sumitomo Electric Ind Ltd 半導体装置用リ−ドフレ−ム

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63150953A (ja) * 1986-12-15 1988-06-23 Sumitomo Electric Ind Ltd 半導体装置用リ−ドフレ−ム

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0369148A (ja) * 1989-08-08 1991-03-25 Ibiden Co Ltd 電子部品搭載用基板及び電子部品パッケージ

Also Published As

Publication number Publication date
JPH0810207Y2 (ja) 1996-03-27

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