JPH02744U - - Google Patents
Info
- Publication number
- JPH02744U JPH02744U JP1988078503U JP7850388U JPH02744U JP H02744 U JPH02744 U JP H02744U JP 1988078503 U JP1988078503 U JP 1988078503U JP 7850388 U JP7850388 U JP 7850388U JP H02744 U JPH02744 U JP H02744U
- Authority
- JP
- Japan
- Prior art keywords
- pellets
- bonding
- bumps
- stacked
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Wire Bonding (AREA)
- Semiconductor Integrated Circuits (AREA)
Description
第１図は本考案の一実施例の断面図、第２図は
本考案の他の実施例の断面図、第３図は第２図〇
Ａ部の拡大図である。 １……マスターペレツト、２……カスタムペレ
ツト、３３……バンプ、３，４，１３……ボンデ
イングワイア、５……端子、６……アイランド、
７，８……パツケージ。
本考案の他の実施例の断面図、第３図は第２図〇
Ａ部の拡大図である。 １……マスターペレツト、２……カスタムペレ
ツト、３３……バンプ、３，４，１３……ボンデ
イングワイア、５……端子、６……アイランド、
７，８……パツケージ。
Claims (1)
- 複数個のペレツトにより構成され、前記複数個
のペレツトが上下に積層され、バンプによる直接
結合又はボンデイングワイアによる間接結合によ
り電気的に組合わされて一体的に実装されている
ことを特徴とする半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988078503U JPH02744U (ja) | 1988-06-13 | 1988-06-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988078503U JPH02744U (ja) | 1988-06-13 | 1988-06-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02744U true JPH02744U (ja) | 1990-01-05 |
Family
ID=31303425
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988078503U Pending JPH02744U (ja) | 1988-06-13 | 1988-06-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02744U (ja) |
-
1988
- 1988-06-13 JP JP1988078503U patent/JPH02744U/ja active Pending