JPH0276843U - - Google Patents

Info

Publication number
JPH0276843U
JPH0276843U JP15707088U JP15707088U JPH0276843U JP H0276843 U JPH0276843 U JP H0276843U JP 15707088 U JP15707088 U JP 15707088U JP 15707088 U JP15707088 U JP 15707088U JP H0276843 U JPH0276843 U JP H0276843U
Authority
JP
Japan
Prior art keywords
semiconductor
separation band
chip
type
semiconductor layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15707088U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP15707088U priority Critical patent/JPH0276843U/ja
Publication of JPH0276843U publication Critical patent/JPH0276843U/ja
Pending legal-status Critical Current

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Landscapes

  • Element Separation (AREA)
  • Solid State Image Pick-Up Elements (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の半導体素子アレイの一例を示
す平面図、第2図は第1図に示す半導体素子アレ
イの部分断面図、および第3図は従来の半導体素
子アレイの部分断面図をそれぞれに示す。 図において、1……チツプ、1a……チツプ1
に配列されている半導体素子の一部を共通に構成
する半導体層、2,12,22,32,42,5
2,62……トランジスタ、2a,2b……トラ
ンジスタ2を構成する半導体層、12a,12b
……トランジスタ12を構成する半導体層、3,
13……分離帯、3a……分離帯3を構成する半
導体層、3c……分離帯3の電極。
FIG. 1 is a plan view showing an example of the semiconductor device array of the present invention, FIG. 2 is a partial sectional view of the semiconductor device array shown in FIG. 1, and FIG. 3 is a partial sectional view of the conventional semiconductor device array. Shown below. In the figure, 1...chip, 1a...chip 1
Semiconductor layers 2, 12, 22, 32, 42, 5 that commonly constitute a part of semiconductor elements arranged in
2, 62...Transistor, 2a, 2b...Semiconductor layer forming transistor 2, 12a, 12b
... A semiconductor layer constituting the transistor 12, 3,
13... Separation zone, 3a... Semiconductor layer forming separation zone 3, 3c... Electrode of separation zone 3.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] チツプ上に複数の半導体素子がそのP型半導体
層またはN型半導体層を共通にしつつ配列され且
つ前記半導体素子のそれぞれに隣接して帯状の分
離帯が設けられている半導体素子アレイであつて
、該分離帯が主として前記半導体層とは異なる型
の半導体によつて形成され、分離帯に取付けられ
ている電極が、分離帯を主として形成する半導体
がP型半導体であるとき、分離帯よりも低電位で
あるチツプ外の部位に接続され、または、分離帯
を主として形成する半導体がN型半導体であると
き、分離帯よりも高電位であるチツプ外の部位に
接続されていることを特徴とする半導体素子アレ
イ。
A semiconductor element array in which a plurality of semiconductor elements are arranged on a chip with their P-type semiconductor layer or N-type semiconductor layer in common, and a strip-shaped separation band is provided adjacent to each of the semiconductor elements, When the separation band is mainly formed of a semiconductor of a different type from the semiconductor layer, and the electrode attached to the separation band is a P-type semiconductor, the electrode is lower than the separation band. It is characterized in that it is connected to a site outside the chip that has a potential, or, when the semiconductor that mainly forms the separation band is an N-type semiconductor, it is connected to a site outside the chip that has a higher potential than the separation band. Semiconductor element array.
JP15707088U 1988-12-01 1988-12-01 Pending JPH0276843U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15707088U JPH0276843U (en) 1988-12-01 1988-12-01

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15707088U JPH0276843U (en) 1988-12-01 1988-12-01

Publications (1)

Publication Number Publication Date
JPH0276843U true JPH0276843U (en) 1990-06-13

Family

ID=31436187

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15707088U Pending JPH0276843U (en) 1988-12-01 1988-12-01

Country Status (1)

Country Link
JP (1) JPH0276843U (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59194465A (en) * 1983-04-19 1984-11-05 Sanken Electric Co Ltd Manufacturing method of semiconductor integrated circuit
JPS6045033A (en) * 1983-08-22 1985-03-11 Sanyo Electric Co Ltd Semiconductor integrated circuit

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59194465A (en) * 1983-04-19 1984-11-05 Sanken Electric Co Ltd Manufacturing method of semiconductor integrated circuit
JPS6045033A (en) * 1983-08-22 1985-03-11 Sanyo Electric Co Ltd Semiconductor integrated circuit

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