JPH0279049U - - Google Patents

Info

Publication number
JPH0279049U
JPH0279049U JP1988158589U JP15858988U JPH0279049U JP H0279049 U JPH0279049 U JP H0279049U JP 1988158589 U JP1988158589 U JP 1988158589U JP 15858988 U JP15858988 U JP 15858988U JP H0279049 U JPH0279049 U JP H0279049U
Authority
JP
Japan
Prior art keywords
bonding wire
base body
semiconductor element
insulating member
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988158589U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988158589U priority Critical patent/JPH0279049U/ja
Publication of JPH0279049U publication Critical patent/JPH0279049U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】
第１図はこの考案における一実施例による半導
体装置を示す斜視図、第２図は熱放散を示す断面
図、第３図は従来の半導体装置を示す斜視図、第
４図は熱放散を示す断面図である。 図において１は基体、２は半導体素子、３はボ
ンデイングワイヤ、４はリード、５は絶縁物部材
、６は基板、７はヒートパス、８は接着剤、９は
金属インサート、１０は固定ねじである。なお図
中、同一符号は同一または相当部分を示す。

Claims (1)

    【実用新案登録請求の範囲】
  1. 基体と、前記基体上に固着された半導体素子と
    、前記半導体素子と接続されるボンデインクワイ
    ヤと、前記ボンデイングワイヤと接続されるリー
    ドと、前記基体上の半導体素子および接続用ボン
    デイングワイヤ、リードを囲む絶縁物部材とを備
    えた半導体装置において、複数個の金属インサー
    トを上面が絶縁物部材上に突出し形成するように
    充填、配設されていることを特徴とする半導体装
    置。
JP1988158589U 1988-12-06 1988-12-06 Pending JPH0279049U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988158589U JPH0279049U (ja) 1988-12-06 1988-12-06

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988158589U JPH0279049U (ja) 1988-12-06 1988-12-06

Publications (1)

Publication Number Publication Date
JPH0279049U true JPH0279049U (ja) 1990-06-18

Family

ID=31439053

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988158589U Pending JPH0279049U (ja) 1988-12-06 1988-12-06

Country Status (1)

Country Link
JP (1) JPH0279049U (ja)

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