JPH03101524U - - Google Patents

Info

Publication number
JPH03101524U
JPH03101524U JP1990009192U JP919290U JPH03101524U JP H03101524 U JPH03101524 U JP H03101524U JP 1990009192 U JP1990009192 U JP 1990009192U JP 919290 U JP919290 U JP 919290U JP H03101524 U JPH03101524 U JP H03101524U
Authority
JP
Japan
Prior art keywords
semiconductor element
thin
view
semiconductor device
sealed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990009192U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990009192U priority Critical patent/JPH03101524U/ja
Publication of JPH03101524U publication Critical patent/JPH03101524U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】
第１図はこの考案に係る半導体装置の一実施例
を示す表面実装型ミニフラツトパツケージの斜視
図、第２図は第１図の断面図、第３図は従来の表
面実装型ミニフラツトパツケージの斜視図、第４
図は第３図の断面図である。 １……半導体素子、２……ダイパツド部、４…
…リード、５……金属細線、６……封止樹脂、１
１……半導体素子の薄い部分。なお、図中、同一
符号は同一、または相当部分を示す。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体素子を樹脂封止する薄型半導体装置にお
    いて、前記半導体素子の周辺部を他の部分より薄
    くし、かつ、この薄い部分に電極を形成したこと
    を特徴とする半導体装置。
JP1990009192U 1990-02-01 1990-02-01 Pending JPH03101524U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990009192U JPH03101524U (ja) 1990-02-01 1990-02-01

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990009192U JPH03101524U (ja) 1990-02-01 1990-02-01

Publications (1)

Publication Number Publication Date
JPH03101524U true JPH03101524U (ja) 1991-10-23

Family

ID=31512796

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990009192U Pending JPH03101524U (ja) 1990-02-01 1990-02-01

Country Status (1)

Country Link
JP (1) JPH03101524U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102758399A (zh) * 2012-07-19 2012-10-31 西安建筑科技大学 城市桥梁的附着式开合防护罩

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102758399A (zh) * 2012-07-19 2012-10-31 西安建筑科技大学 城市桥梁的附着式开合防护罩

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