JPH028035U - - Google Patents

Info

Publication number
JPH028035U
JPH028035U JP1988083508U JP8350888U JPH028035U JP H028035 U JPH028035 U JP H028035U JP 1988083508 U JP1988083508 U JP 1988083508U JP 8350888 U JP8350888 U JP 8350888U JP H028035 U JPH028035 U JP H028035U
Authority
JP
Japan
Prior art keywords
lead electrode
semiconductor device
bonding pad
bonding
generatrix
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988083508U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988083508U priority Critical patent/JPH028035U/ja
Publication of JPH028035U publication Critical patent/JPH028035U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図ａ，ｂは本考案の一実施例を説明するた
めの平面図及びＡ−Ａ′線断面図、第２図は半導
体ペレツトとリード電極の配線の例を示す平面図
、第３図ａ，ｂは従来の半導体装置のワイヤーボ
ンデイングを説明するための平面図及びＢ−Ｂ′
線断面図である。 １……半導体ペレツト、１ａ……ボンデイング
パツド面、２……基台、３……金線、４，４ａ〜
４ｄ……リード電極、５……円錐状凹み、６……
キヤピラリー、７……リード電極、８……リード
電極面。 1A and 1B are a plan view and a sectional view taken along the line A-A' for explaining an embodiment of the present invention, FIG. 2 is a plan view showing an example of wiring between a semiconductor pellet and a lead electrode, and FIG. a and b are a plan view and B-B' for explaining wire bonding of a conventional semiconductor device;
FIG. DESCRIPTION OF SYMBOLS 1... Semiconductor pellet, 1a... Bonding pad surface, 2... Base, 3... Gold wire, 4, 4a~
4d... Lead electrode, 5... Conical recess, 6...
Capillary, 7... Lead electrode, 8... Lead electrode surface.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体ペレツトのボンデイングパツドとリード
電極とをワイヤーボンデイングによつて電気的に
結線する構造を有する半導体装置において、前記
ボンデイングパツド面に対してばらつき角θを有
するリード電極面上に、底面と母線のなす各がθ
より大きな角を有する正円錐状のくぼみを設けて
あることを特徴とする半導体装置。 In a semiconductor device having a structure in which a bonding pad of a semiconductor pellet and a lead electrode are electrically connected by wire bonding, a bottom surface and a generatrix are placed on the surface of the lead electrode having a dispersion angle θ with respect to the surface of the bonding pad. Each of these is θ
A semiconductor device characterized by having a cone-shaped recess having a larger angle.
JP1988083508U 1988-06-23 1988-06-23 Pending JPH028035U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988083508U JPH028035U (en) 1988-06-23 1988-06-23

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988083508U JPH028035U (en) 1988-06-23 1988-06-23

Publications (1)

Publication Number Publication Date
JPH028035U true JPH028035U (en) 1990-01-18

Family

ID=31308223

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988083508U Pending JPH028035U (en) 1988-06-23 1988-06-23

Country Status (1)

Country Link
JP (1) JPH028035U (en)

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