JPH0281045U - - Google Patents
Info
- Publication number
- JPH0281045U JPH0281045U JP16145388U JP16145388U JPH0281045U JP H0281045 U JPH0281045 U JP H0281045U JP 16145388 U JP16145388 U JP 16145388U JP 16145388 U JP16145388 U JP 16145388U JP H0281045 U JPH0281045 U JP H0281045U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- resin
- type semiconductor
- present
- convex portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 230000009977 dual effect Effects 0.000 claims 1
- 238000000605 extraction Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案のＤＩＰ型半導体装置の側面図
、第２図は第１図の上面図、第３図は本考案のＤ
ＩＰ型半導体装置を収納する出荷用マガジンケー
ス、第４図は本考案のＤＩＰ型半導体装置を出荷
用マガジンに収納した後の断面図、第５図は他の
実施例図である。
１……ＤＩＰ型半導体装置の樹脂、２……本考
案の柱状凸部、３……外部引き出し用リード、４
……リードの傾斜角度、５……本考案のＤＩＰ型
半導体装置を収納するマガジンケース、６……５
のマガジンケースの凸部。
Figure 1 is a side view of the DIP type semiconductor device of the present invention, Figure 2 is a top view of Figure 1, and Figure 3 is the DIP type semiconductor device of the present invention.
A shipping magazine case for storing an IP type semiconductor device, FIG. 4 is a sectional view of the DIP type semiconductor device of the present invention after being stored in a shipping magazine, and FIG. 5 is a view of another embodiment. DESCRIPTION OF SYMBOLS 1... Resin of DIP type semiconductor device, 2... Column-shaped convex portion of the present invention, 3... Lead for external extraction, 4
...Inclination angle of leads, 5...Magazine case for storing the DIP type semiconductor device of the present invention, 6...5
The convex part of the magazine case.
Claims (1)
導体装置において、樹脂表面に少くとも１カ所以
上柱状の凸部または凹部を有することを特徴とす
る半導体装置。 1. A semiconductor device of a resin-sealed dual in-line package, characterized in that the resin surface has at least one columnar convex portion or concave portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16145388U JPH0281045U (en) | 1988-12-12 | 1988-12-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16145388U JPH0281045U (en) | 1988-12-12 | 1988-12-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0281045U true JPH0281045U (en) | 1990-06-22 |
Family
ID=31444404
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16145388U Pending JPH0281045U (en) | 1988-12-12 | 1988-12-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0281045U (en) |
-
1988
- 1988-12-12 JP JP16145388U patent/JPH0281045U/ja active Pending