JPH031431U - - Google Patents
Info
- Publication number
- JPH031431U JPH031431U JP1989058814U JP5881489U JPH031431U JP H031431 U JPH031431 U JP H031431U JP 1989058814 U JP1989058814 U JP 1989058814U JP 5881489 U JP5881489 U JP 5881489U JP H031431 U JPH031431 U JP H031431U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- view
- utility
- semiconductor chip
- scope
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Die Bonding (AREA)
Description
第１図ａは本考案の一実施例を示す平面図。第
１図ｂは第１図ａのＡ部断面図。第２図ａは従来
のＩＣダイパツト構造を示す平面図。第２図ｂは
第２図ａのＡ部断面図。第３図ａは従来のＩＣダ
イパツト構造を示す平面図。第３図ｂは第３図ａ
のＡ部断面図。第４図ａは本考案の実施例を示す
平面図。第４図ｂは第４図ａのＡ部断面図。
１……回路基板、２……ＩＣダイパツト、３…
…ＩＣチツプ、４……接着剤、５……ＩＣダイパ
ツト凹部、６……接着剤の逃げ。
FIG. 1a is a plan view showing an embodiment of the present invention. FIG. 1b is a sectional view of section A in FIG. 1a. FIG. 2a is a plan view showing a conventional IC die pad structure. FIG. 2b is a sectional view of section A in FIG. 2a. FIG. 3a is a plan view showing a conventional IC die pad structure. Figure 3b is Figure 3a
A sectional view of part A. FIG. 4a is a plan view showing an embodiment of the present invention. FIG. 4b is a sectional view of section A in FIG. 4a. 1... Circuit board, 2... IC die part, 3...
...IC chip, 4...adhesive, 5...IC die-pat recess, 6...adhesive escape.
Claims (1)
Ｃダイパツトが凹構造をしており、接着剤の逃げ
部を有することを特徴とする回路基板。 In a circuit board on which a semiconductor chip is mounted, I
A circuit board characterized in that the C die part has a concave structure and has an adhesive relief part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989058814U JPH031431U (en) | 1989-05-22 | 1989-05-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989058814U JPH031431U (en) | 1989-05-22 | 1989-05-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH031431U true JPH031431U (en) | 1991-01-09 |
Family
ID=31584766
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989058814U Pending JPH031431U (en) | 1989-05-22 | 1989-05-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH031431U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005296484A (en) * | 2004-04-15 | 2005-10-27 | Takahane Akihiko | Footwear which allows projecting toes individually from upper |
| JP2014022576A (en) * | 2012-07-18 | 2014-02-03 | Nichia Chem Ind Ltd | Semiconductor element mounting member and semiconductor device |
| JP2016184756A (en) * | 2016-06-10 | 2016-10-20 | 日亜化学工業株式会社 | Semiconductor element mounting member and semiconductor device |
-
1989
- 1989-05-22 JP JP1989058814U patent/JPH031431U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005296484A (en) * | 2004-04-15 | 2005-10-27 | Takahane Akihiko | Footwear which allows projecting toes individually from upper |
| JP2014022576A (en) * | 2012-07-18 | 2014-02-03 | Nichia Chem Ind Ltd | Semiconductor element mounting member and semiconductor device |
| JP2016184756A (en) * | 2016-06-10 | 2016-10-20 | 日亜化学工業株式会社 | Semiconductor element mounting member and semiconductor device |