JPH0282685A - Application apparatus - Google Patents

Application apparatus

Info

Publication number
JPH0282685A
JPH0282685A JP23581188A JP23581188A JPH0282685A JP H0282685 A JPH0282685 A JP H0282685A JP 23581188 A JP23581188 A JP 23581188A JP 23581188 A JP23581188 A JP 23581188A JP H0282685 A JPH0282685 A JP H0282685A
Authority
JP
Japan
Prior art keywords
discharge
amount
calculated
syringe
discharges
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP23581188A
Other languages
Japanese (ja)
Other versions
JPH0744331B2 (en
Inventor
Toshiyuki Kurihara
栗原 敏行
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP23581188A priority Critical patent/JPH0744331B2/en
Publication of JPH0282685A publication Critical patent/JPH0282685A/en
Publication of JPH0744331B2 publication Critical patent/JPH0744331B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Coating Apparatus (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To keep the discharge of an application agent always constant by calculating the quantity of the application agent discharged next time based on the quantity of the application agent remaining in a syringe and the concerned data stored in first and second memories with a calculating means and controlling a pressure supply valve with a controlling means to discharge the calculated quantity of the application agent. CONSTITUTION:The quantity of a bonding agent remaining in a syringe 10 is measured with a line sensor 50, the number of times of discharged before then is calculated from the measured quantity and the data on the total number of times of discharges to the quantity of the remaining bonding agent with a calculating means in a CPU 57, and the result of the calculation is stored into the specific area in a RAM 58 and indicated on the screen of a TV monitor 54. The discharge by the number of the times of discharges calculated based on the concerned data on the discharge by the total number of times of discharges stored in the RAM 58 is calculated with the calculating means. If the discharge is smaller than the standard discharge, the rate of increase correction of the pressurizing time or pressurizing force is calculated with the calculating means in the CPU 57. If the discharge is larger than the standard discharge, the rate of decrease correction of the pressurizing time or pressurizing force is calculated.

Description

【発明の詳細な説明】 (イ)産業上の利用分野 本発明は、プリント基板上にチップ状電子部品を固着す
る際に用いる塗布剤を塗布する塗布装置に関する。
DETAILED DESCRIPTION OF THE INVENTION (A) Field of Industrial Application The present invention relates to a coating device for applying a coating agent used for fixing chip-shaped electronic components onto a printed circuit board.

(ロ)従来の技術 従来の塗布装置に於いては、シリンジ内に圧力供給源か
らのエアー圧をかけてシリンジ内の塗布剤をプリント基
板上に塗布していた。
(B) Prior Art In conventional coating apparatuses, air pressure from a pressure supply source is applied to the syringe to coat the coating agent in the syringe onto the printed circuit board.

また、特開昭62−176571号公報に開示されてい
・るように、シリンダー容器(前記シリンジに相等)の
粘性物(前記塗布剤に相等)の温度を温度検知手段で検
知し、その温度変化に応じて自動調圧弁の設定圧力を自
動調整させることにより常に所定量の粘性物を吐出させ
ようとした技術がある。
Furthermore, as disclosed in Japanese Patent Application Laid-Open No. 62-176571, the temperature of a viscous substance (similar to the above-mentioned coating agent) in a cylinder container (similar to the above-mentioned syringe) is detected by a temperature detection means, and the temperature change There is a technique that attempts to always discharge a predetermined amount of viscous material by automatically adjusting the set pressure of an automatic pressure regulating valve according to the amount of viscous material.

然し乍ら、シリンジ内の塗布剤の量により、温度変化に
見合った圧力をかけても、吐出きれる塗布剤の量にはバ
ラツキがあった。つまり、圧力供給源からの圧力を一定
としても塗布剤の残量の違いによる自重の影響等により
前記現象が生じていた。
However, depending on the amount of coating agent in the syringe, even if a pressure commensurate with the temperature change is applied, the amount of coating agent that can be completely discharged varies. In other words, even if the pressure from the pressure supply source is constant, the above phenomenon occurs due to the influence of its own weight due to the difference in the remaining amount of the coating agent.

(ハ)発明が解決しようとする課題 常に、塗布剤の吐出量を一定とすることである。(c) Problems to be solved by the invention The aim is to always keep the amount of coating agent discharged constant.

(ニ)課題を解決するための手段 そこで本発明は、プリント基板上にチップ状電子部品を
固着する際に用いる塗布剤を圧力供給弁の開閉制御によ
り塗布する塗布装置に於いて、シリンジ内の塗布剤の残
量に対する吐出回数の関係データを記憶する第1の記憶
手段と、吐出回数に対する吐出量の関係データを記憶す
る第2の記憶手段と、塗布剤の残量に基づいて前記第1
の記憶手段に格納された関係データから得られた既吐出
回数を算出すると共に該既吐出回数に基づいて前記第2
の記憶手段に格納された関係データから次回に吐出すべ
き量を算出する計算手段と、該計算手段により算出され
た次回の吐出すべき量となるように前記圧力供給弁を制
御する制御装置とを設けたものである。
(d) Means for Solving the Problems Therefore, the present invention provides a coating device that applies a coating agent used for fixing chip-shaped electronic components onto a printed circuit board by controlling the opening and closing of a pressure supply valve. a first storage means for storing relational data of the number of times of dispensing with respect to the remaining amount of the coating agent; a second storing means for storing relational data of the amount of dispensing with respect to the number of times of dispensing;
Calculate the number of ejections obtained from the relational data stored in the storage means, and calculate the number of ejections obtained from the second
a calculation means for calculating the amount to be discharged next time from the related data stored in the storage means; and a control device for controlling the pressure supply valve so as to obtain the amount to be discharged next time calculated by the calculation means. It has been established.

(ネ)作用 以上の構成より、計算手段でシリンジ内の塗布剤の残量
と第1、第2の記憶手段に記憶された各関係データを基
に次回の吐出すべき量が算出され、該吐出量となるよう
に制御装置により圧力供給弁が制御される。
(f) Effect With the above configuration, the calculation means calculates the amount to be dispensed next time based on the remaining amount of coating agent in the syringe and each related data stored in the first and second storage means, and The pressure supply valve is controlled by the control device so as to achieve the discharge amount.

(へ)実施例 以下本発明の一実施例を、先ず第1図乃至第10図に基
づき詳述する。
(F) EXAMPLE An example of the present invention will first be described in detail with reference to FIGS. 1 to 10.

(1)はX方向駆動用モータ(2)、Y方向駆動用モー
タ(3)によりXY方向、即ち左右縦横方向に移動可能
なXY子テーブル、該テーブル(1)上には所定間隔を
存して二枚のプリント基板(4)(5)が載置される。
(1) is an XY child table that can be moved in the XY directions, that is, in the horizontal and vertical directions by an X-direction drive motor (2) and a Y-direction drive motor (3); Two printed circuit boards (4) and (5) are placed thereon.

(6)(7)(8)(9)はXY子テーブル1)上方に
位置する第1.2.3.4の塗布ノズルであり、第1及
び第3のノズル(6) 、 (8)は小径ノズルで、第
2及び第4のノズル(7) 、 (9)は大径ノズルで
ある。〈10)(11)(12)(13)は塗布剤とし
ての接着剤が充填されたシリンジで、これらシリンジ(
10)(11)(12)(13)はローラ受(14)(
15)(16)(17)及びローラ(18)(19)(
20)(21)を介して第1.2.3.4のカムレバー
(22)(23)(24)(25)で支持されている。
(6) (7) (8) (9) are the 1.2.3.4 application nozzles located above the XY child table 1), and the first and third nozzles (6), (8) is a small diameter nozzle, and the second and fourth nozzles (7) and (9) are large diameter nozzles. <10) (11) (12) (13) are syringes filled with adhesive as a coating agent, and these syringes (
10) (11) (12) (13) are roller holders (14) (
15) (16) (17) and rollers (18) (19) (
It is supported by the 1.2.3.4 cam levers (22), (23), (24), and (25) via 20) and (21).

(26)(27)はこれらのカムレバー(22)(23
)(24)(25)の他端に設けられた支点軸である。
(26) (27) are these cam levers (22) (23)
) (24) This is a fulcrum shaft provided at the other end of (25).

(28)(29)は例えば半円毎に円弧の径が変化する
カムである。一方のカム(28)はカムフォロワ(30
)(31)を介して夫々第1、第2のカムレバー(22
)(23)を保持すると共に、他方のカム(29)はカ
ムフォロワ(32)(33)を介して夫々第3.4のカ
ムレバー(24)(25)を保持している。
(28) and (29) are, for example, cams whose arc diameter changes every semicircle. One cam (28) is a cam follower (30
) (31) to the first and second cam levers (22), respectively.
) (23), and the other cam (29) holds 3.4th cam levers (24) and (25), respectively, via cam followers (32) and (33).

そしてストッパレバー(34)(35)(36)(37
)は各々第1.2.3.4のカムレバー(22)(23
)(24)(25)のノズル支持部とカムとの当接部の
中間位置に配置されていて、各カムレバー(22)(2
3)(24)(25)を個別に選択的に保持できるよう
になっている。
And stopper levers (34) (35) (36) (37
) are the 1.2.3.4 cam levers (22) and (23), respectively.
)(24)(25), and is arranged at an intermediate position between the nozzle support part and the contact part of the cam, and each cam lever (22)(25)
3) (24) and (25) can be held individually and selectively.

(38)はカム(28)(29)の駆動源となるモータ
駆動回路(38A)により回動するパルスモータを示し
、クラッチブレーキユニット(39〉、減速機(40)
を介して駆動軸(41)に回転力を与える。
(38) indicates a pulse motor rotated by a motor drive circuit (38A) that serves as a drive source for the cams (28) and (29), and includes a clutch brake unit (39) and a reducer (40).
A rotational force is applied to the drive shaft (41) via the drive shaft (41).

そして、前記モータ(38)の回転によりカム(28)
<29)が同時に回転するが、ソレノイド(42)(4
3>(44)(45)が全て励磁していない場合には、
バネ(46)(47)(48)(49)の付勢力により
全てのストッパレバー(34)(35)(36)(37
)はカムレバー(22)(23)(24)(25)を保
持する。
The cam (28) is rotated by the rotation of the motor (38).
<29) rotate at the same time, but solenoid (42) (4
3> If (44) and (45) are not all excited,
All the stopper levers (34) (35) (36) (37) are
) holds the cam levers (22), (23), (24), and (25).

ここで小径ノズル(6)(8)が選択された場合は、第
5図に示すようにソレノイド(42)(44)が励磁し
、バネ(46)(4g)に抗してストッパレバー(34
)(36)による第1、第3のカムレバー(22)(2
4)の保持が解除され、カム(28)(29)の小径部
がカムフォロワ(30)(32)に位置するタイミング
でノズル(6)(8)がプリント基板(4)(5)に近
接して接着剤が供給される。プリント基板(4)(5)
位置の変更は、カム(28)(29)大径部によって各
ノズル(6)(7)(8)(9)が上方へ引き上げられ
た時、XY子テーブル1)を水平移動することにより行
われる。
If the small diameter nozzles (6) (8) are selected here, the solenoids (42) (44) are energized as shown in FIG.
) (36) by the first and third cam levers (22) (2
4) is released and the small diameter portions of the cams (28) and (29) are positioned at the cam followers (30 and 32), and the nozzles (6) and (8) approach the printed circuit boards (4 and 5). adhesive is supplied. Printed circuit board (4) (5)
The position can be changed by horizontally moving the XY child table 1) when each nozzle (6) (7) (8) (9) is pulled upward by the large diameter portion of the cam (28) (29). be exposed.

また、この時シリンジ<10)(11)(12)(13
)内の圧力を高めることによりノズル(6)(7)(8
)(9)先1への接着剤の供給や、ソレノイド(42)
(43)(44)(45)によるストッパレバー(34
)(35)(36)(37)の切換操作も行う。
Also, at this time, the syringe <10) (11) (12) (13
) by increasing the pressure in the nozzles (6) (7) (8
) (9) Supplying adhesive to tip 1 and solenoid (42)
(43) (44) (45) Stopper lever (34)
), (35), (36), and (37) are also performed.

(50)・・・はシリンジ(10)(11)(12)(
13)内の接着剤の量を常時、検知するラインセンサー
で、シリンジ(10)(11)(12)(13)内に配
設されるフロート(51)・・・の位置を検出して、接
着剤の残量を検知する。
(50) ... is a syringe (10) (11) (12) (
A line sensor that constantly detects the amount of adhesive in the syringes (10), (11), (12), and (13) detects the positions of the floats (51)... placed in the syringes (10), (11), (12), and (13). Detects the amount of adhesive remaining.

(52)は各種データ設定用の入力装置としてのキーボ
ード(53)、モニターテレビ(54)の画面選択キー
(55)、塗布装置をスタートさせるスタートキー(5
6)とから構成される操作部で、前記キーボード(53
)の各キー操作により各種データを生ずる。
(52) is a keyboard (53) as an input device for setting various data, a screen selection key (55) for the monitor television (54), and a start key (55) for starting the coating device.
6), the keyboard (53);
) various data are generated by each key operation.

(57)は制御装置としてのCPUで、前記各キー操作
に応答して各種データ設定に係わる所与の制御や各種情
報に基づいて塗布動作に係わる制御を行う。
(57) is a CPU as a control device, which performs given control related to various data settings and control related to coating operation based on various information in response to each key operation.

(58)は前記キーボード(53)により設定された各
種設定データを記憶する記憶手段としてのRAMである
(58) is a RAM serving as a storage means for storing various setting data set by the keyboard (53).

(59)は塗布動作に係わるプログラムを格納するRO
Mである。
(59) is an RO that stores programs related to coating operations.
It is M.

<60)は圧力供給源としてのエアー源(61)のエア
ーをシリンジ(10)へ送る圧力供給弁としてのエアー
パルプで、前記CPU(57)からの命令により加圧時
間又は加圧力が変更きれる。
<60) is an air pulp as a pressure supply valve that sends air from an air source (61) as a pressure supply source to the syringe (10), and the pressurization time or pressure can be changed by commands from the CPU (57). .

(62)はインターフェースである。(62) is an interface.

(63)は吐出スタートタイミングセンサーで、該セン
サー(63)から出力される吐出スタート信号を受けて
、CPU(57)は塗布装置に吐出動作を行わせる。
(63) is a discharge start timing sensor, and upon receiving a discharge start signal output from the sensor (63), the CPU (57) causes the coating device to perform a discharge operation.

以下、動作について図面に基づき詳述する。The operation will be explained in detail below based on the drawings.

第6図は、一連の塗布動作時のシリンジ(10)内の接
着剤残量に対する総吐出回数の関係図である。この関係
データを前記RAM(58)内の所定エリア内に格納し
ておく。
FIG. 6 is a diagram showing the relationship between the amount of adhesive remaining in the syringe (10) and the total number of ejections during a series of coating operations. This relational data is stored in a predetermined area in the RAM (58).

先ず、操作部(52)のスタートキー(56)を押圧す
ると、CPU(57)の制御の下、第7図に示すフロー
チャートに従って塗布装置は塗布動作を開始する。そし
て、第8図に示す塗布データに従って、つまり、1番目
の塗布位置(X+、yt)にノズル選択データ内容に基
づき選択された塗布ノズル(6)(8)の吐出口(図示
せず)が来るようにXYテーブル(1)をXY移動させ
る。ここで、ノズル選択データ内容による選択とは、第
8図に示す10」と11」とにより選択される。即ち「
0゜の場合は小径ノズル(6)(8)を使用し、′1」
の場合は大径ノズル(7)(9)を使用するように設定
きれている。
First, when the start key (56) of the operation section (52) is pressed, the coating device starts the coating operation under the control of the CPU (57) according to the flowchart shown in FIG. Then, according to the coating data shown in FIG. 8, that is, the discharge ports (not shown) of the coating nozzles (6) and (8) selected based on the contents of the nozzle selection data are placed at the first coating position (X+, yt). Move the XY table (1) in XY so that the Here, the selection based on the contents of the nozzle selection data means the selection based on 10'' and 11'' shown in FIG. That is, “
If it is 0°, use the small diameter nozzle (6) (8) and
In this case, the settings have been made to use the large diameter nozzles (7) and (9).

前記位置設定が完了したら、駆動源としてのパルスモー
タ(38)をモータ駆動回路(38A)により回動させ
てカム(28)(29)を回動させる。このカム(28
)(29)の回動に応じて塗布ヘッド(図示せず)が上
下動する。この時パルスモータ(38)の回動によりカ
ム(2g)(29)が同時に回動するが、今回のように
小径ノズル(6)(8)が選択された場合は第5図に示
すようにソレノイド(42)(44)が励磁し、バネ(
46)(48)に抗してストッパレバー(34)(36
)による第1、第3のカムレバー(22)(24)の保
持が解除され、カム(28)(29)の小径部がカムフ
ォロワ(30)(32)に位置するタイミングでノズル
(6)(8)がプリント基板(4)(5)に近接して接
着剤が供給される。
When the position setting is completed, the pulse motor (38) serving as a drive source is rotated by the motor drive circuit (38A) to rotate the cams (28) and (29). This cam (28
) (29), a coating head (not shown) moves up and down. At this time, the cams (2g) and (29) rotate at the same time due to the rotation of the pulse motor (38), but if the small diameter nozzles (6) and (8) are selected as in this case, as shown in Figure 5. The solenoids (42) and (44) are energized, and the spring (
46) (48) against the stopper levers (34) (36).
) is released from holding the first and third cam levers (22) and (24), and the nozzles (6) and (8 ) is provided with adhesive in close proximity to the printed circuit boards (4) and (5).

この接着剤の供給時に以下の動作が行われる。The following operations are performed when this adhesive is supplied.

即ち、シリンジ(10)内の接着剤の残量をラインセン
サー(50)により検知し、この値と第6図に示す残量
に対する総吐出回数のデータ値より、それまでの吐出回
数をCPU(57)内の計算手段(図示せず)で算出し
、その結果をRAM(5g>内の所定エノアに格納する
と共にモニターテレビ(54)の画面に表示させる。
That is, the remaining amount of adhesive in the syringe (10) is detected by the line sensor (50), and based on this value and the data value of the total number of ejections for the remaining amount shown in FIG. The calculation means (not shown) in 57) stores the result in a predetermined enoa in the RAM (5g) and displays it on the screen of the monitor television (54).

そして、第9図に示すRAM(58)内に格納された総
吐出回数に対する吐出量の関係図の関係データを基に、
前記算出された吐出回数に相当する吐出量を前記計算手
段で算出して、標準吐出量より吐出量が少なくなる時は
加圧時間又は加圧力の増加補正の割合をCPU(57)
内の計算手段(図示せず)で下記する式より算出する。
Then, based on the relational data of the relationship diagram of the discharge amount to the total number of discharges stored in the RAM (58) shown in FIG.
The calculation means calculates the discharge amount corresponding to the calculated number of discharges, and when the discharge amount is less than the standard discharge amount, the CPU (57) calculates the rate of increase correction of the pressurization time or pressurization force.
It is calculated using the following formula using a calculation means (not shown).

X121= Xtll・(l″″″lflt−191m
、l″9■5託””)−(I)標準吐出量 また、標準吐出量より吐出量が多くなる時は加圧時間又
は加圧力の減少補正の割合を同じく下記する式より算出
する。
X121= Xtll・(l″″″lflt-191m
, l''9■5trust'') - (I) Standard discharge amount Also, when the discharge amount is greater than the standard discharge amount, the rate of reduction correction of the pressurization time or pressurization force is calculated from the same formula below.

X(2)=X(1,x(1!9図より算出した吐出量−
標準吐出量)−べ■)標準吐出量 尚、前記2式のX(I)、Xo)は夫々標準加圧時間又
は加圧力、及び補正後の加圧時間又は、加圧力を示す。
X (2) = X (1, x (1! Discharge amount calculated from Figure 9 -
Standard Discharge Amount) - B) Standard Discharge Amount In the above two formulas, X(I) and Xo) respectively indicate the standard pressurization time or pressurization force and the corrected pressurization time or pressurization force.

更に、標準吐出量と同じとなる時は設定加圧時間又は設
定加圧力のままにしておく。
Furthermore, when the discharge amount is the same as the standard discharge amount, the set pressurization time or set pressurization force is left unchanged.

例えば、第1図に示す(A)をシリンジ(10)内の接
着剤の残量とした場合、第6図の関係データを基にそれ
までの吐出回数を求め(第6図(A′))、該吐出回数
(A′)から第9図の関係データを基に次回吐出時の予
想吐出量を求め(第9図(A“))、その値(A”)が
標準吐出量(B”)より少なくなったため、前記式(I
)を用いて増加補正を行う。そして、前記算出された加
圧時間又は加圧力に第10図の前記RAM(58)内に
格納されている各部品に対する標準吐出量を示すデータ
を基に前記加圧時間又は加圧力に該標準吐出量を掛けた
時間又は圧力だけシリンジ(10)に圧力をかけること
により最適量の接着剤が吐出きれる。即ち、第10図よ
り1番目の部品の標準吐出量はrl、であるため、その
まま補正された加圧時間又は加圧力をかければ良い、尚
、第10rgJの「1」は標準吐出量を示し、「2」は
標準吐出量の2倍を示している。以下同様である。
For example, if (A) shown in Figure 1 is the remaining amount of adhesive in the syringe (10), the number of discharges up to that point is calculated based on the related data in Figure 6 (Figure 6 (A')). ), the expected discharge amount for the next discharge is calculated from the number of discharges (A') based on the relational data in FIG. 9 (FIG. 9 (A")), and the value (A") is the standard discharge amount (B ”), the formula (I
) to perform incremental correction. Then, based on the data indicating the standard discharge amount for each component stored in the RAM (58) in FIG. 10, the calculated pressurization time or force is adjusted to the standard discharge amount. By applying pressure to the syringe (10) for the time or pressure multiplied by the discharge amount, the optimum amount of adhesive can be discharged. That is, as shown in Fig. 10, the standard discharge rate of the first component is rl, so it is sufficient to apply the corrected pressurization time or pressure as it is. Note that "1" in the 10th rgJ indicates the standard discharge rate. , "2" indicates twice the standard discharge amount. The same applies below.

以下、順次この動作が繰り返えきれ、最適量の接着剤の
塗布が完了される。この時、総吐出回数の内容から順次
、吐出回数を減算していく。即ち、標準吐出量「1」の
場合は総吐出回数から「−1」減算し、r2.の場合は
「−2」減算する。以下同様である。そして、総吐出回
数からの減算が続き、ある設定吐出回数となったら、シ
リンジ(10)内に接着剤を自動補給するなり、作業者
に接着剤を補給するよう報知するなり、塗布装置を停止
するようにする。
Thereafter, this operation is repeated one after another until the application of the optimum amount of adhesive is completed. At this time, the number of ejections is sequentially subtracted from the total number of ejections. That is, if the standard discharge amount is "1", "-1" is subtracted from the total number of discharges, and r2. In this case, subtract "-2". The same applies below. Then, the subtraction from the total number of discharges continues, and when a certain set number of discharges is reached, the adhesive is automatically replenished into the syringe (10), the operator is notified to replenish the adhesive, and the applicator is stopped. I'll do what I do.

尚、シリンジ(10)内の接着剤の残量を検知する方法
は本実施例だけに限らず、例えば、センサーから発信さ
れた超音波が空気中を伝わり液面に到達した後、反射波
となって前記センサーに戻ってくるまでの時間から、セ
ンサーから液面までの距離を換算して接着剤の残量を認
識するようにしても良い。
Note that the method for detecting the remaining amount of adhesive in the syringe (10) is not limited to this embodiment. For example, after ultrasonic waves emitted from a sensor travel through the air and reach the liquid surface, reflected waves and The remaining amount of adhesive may be recognized by converting the distance from the sensor to the liquid surface from the time it takes for the adhesive to return to the sensor.

また、減圧時の空気流量、減圧時間を計測する方法、シ
リンジの重量を計測する方法、シリンジ内の接着剤の体
積を計測する方法等により、シリンジ(10)内の接着
剤の残量を検知するようにしても良い。
In addition, the remaining amount of adhesive in the syringe (10) can be detected by measuring the air flow rate during depressurization, the decompression time, the weight of the syringe, the volume of adhesive in the syringe, etc. You may also do this.

更に、塗布装置をスタートさせる時は常にシリンジ(1
0)内の接着剤を満杯にしてから行うようにすればライ
ンセンサー(50)を使用しないでも済む。即ち、満杯
時の総吐出回数から順次減算していくことにより、それ
までの吐出回数が認識できるためである。
Furthermore, when starting the applicator, always use the syringe (1
If the process is carried out after filling the adhesive inside 0), there is no need to use the line sensor (50). That is, by sequentially subtracting from the total number of discharges when the tank is full, the number of discharges up to that point can be recognized.

(ト)発明の効果 以上の構成により、シリンジ内の残量の如何を問わず、
常に最適量の接着剤の吐出が行える。
(g) With a configuration that exceeds the effects of the invention, regardless of the amount remaining in the syringe,
The optimum amount of adhesive can always be discharged.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明一実施例を適用せる塗布装置の構成回路
図、第2図及び第3図は同じく塗布機構を示す斜視図及
び平面図、第4図及び第5図はカムレバーの動作状態を
示す図、第6図は接着剤の残量に対する総吐出回数の関
係図、第7図は塗布動作を示すフローチャートを示す図
、第8図は塗布動作に係わるプログラムを示す図、第9
図は総吐出回数に対する吐出量の関係図、第10図は各
部品に対する標準吐出量を示す図を示す。 (10)(11)(12)(13)・・・シリンジ、 
(50)・・・ラインセンサー  (57)川CPU、
 <58)・・・RAM。
Fig. 1 is a configuration circuit diagram of a coating device to which an embodiment of the present invention is applied, Figs. 2 and 3 are perspective views and plan views showing the coating mechanism, and Figs. 4 and 5 are operating states of the cam lever. FIG. 6 is a diagram showing the relationship between the remaining amount of adhesive and the total number of discharges, FIG. 7 is a flowchart showing the coating operation, FIG. 8 is a diagram showing the program related to the coating operation, and FIG.
The figure shows the relation between the discharge amount and the total number of discharges, and FIG. 10 shows the standard discharge amount for each component. (10) (11) (12) (13)...Syringe,
(50)...Line sensor (57) River CPU,
<58)...RAM.

Claims (1)

【特許請求の範囲】[Claims] (1)プリント基板上にチップ状電子部品を固着する際
に用いる塗布剤を圧力供給弁の開閉制御により塗布する
塗布装置に於いて、シリンジ内の塗布剤の残量に対する
吐出回数の関係データを記憶する第1の記憶手段と、吐
出回数に対する吐出量の関係データを記憶する第2の記
憶手段と、塗布剤の残量に基づいて前記第1の記憶手段
に格納された関係データから得られた既吐出回数を算出
すると共に該既吐出回数に基づいて前記第2の記憶手段
に格納された関係データから次回に吐出すべき量を算出
する計算手段と、該計算手段により算出された次回の吐
出すべき量となるように前記圧力供給弁を制御する制御
装置とを設けたことを特徴とする塗布装置。
(1) In a coating device that applies a coating agent used to adhere chip-shaped electronic components onto a printed circuit board by controlling the opening and closing of a pressure supply valve, data relating to the number of discharges and the amount of coating agent remaining in the syringe is collected. A first storage means for storing, a second storage means for storing relational data of the amount of ejection with respect to the number of ejections, and a first storage means for storing relational data of the amount of ejection with respect to the number of times of ejection, and a first storage means for storing relational data of the amount of ejection based on the remaining amount of the coating agent. calculation means for calculating the number of times the discharge has already been performed and the amount to be discharged next time from the related data stored in the second storage means based on the number of times the discharge has already been performed; A coating device comprising: a control device for controlling the pressure supply valve so as to maintain the amount to be discharged.
JP23581188A 1988-09-20 1988-09-20 Coating device Expired - Lifetime JPH0744331B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23581188A JPH0744331B2 (en) 1988-09-20 1988-09-20 Coating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23581188A JPH0744331B2 (en) 1988-09-20 1988-09-20 Coating device

Publications (2)

Publication Number Publication Date
JPH0282685A true JPH0282685A (en) 1990-03-23
JPH0744331B2 JPH0744331B2 (en) 1995-05-15

Family

ID=16991605

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23581188A Expired - Lifetime JPH0744331B2 (en) 1988-09-20 1988-09-20 Coating device

Country Status (1)

Country Link
JP (1) JPH0744331B2 (en)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02280872A (en) * 1989-04-24 1990-11-16 Pioneer Electron Corp Method for detecting emission amount in viscous material emitting apparatus
JPH04188887A (en) * 1990-11-22 1992-07-07 Matsushita Electric Ind Co Ltd Adhesive application method and adhesive application device
JPH04199775A (en) * 1990-11-29 1992-07-20 Sanyo Electric Co Ltd Coating apparatus
JPH04199776A (en) * 1990-11-29 1992-07-20 Sanyo Electric Co Ltd Coating apparatus
JPH0671215A (en) * 1992-08-27 1994-03-15 Sanyo Electric Co Ltd Coating device
JPH09181431A (en) * 1995-12-27 1997-07-11 Matsushita Electric Ind Co Ltd Viscous fluid residual amount detection device and residual amount detection method
JPH10151402A (en) * 1996-11-26 1998-06-09 Matsushita Electric Ind Co Ltd Sealant discharge amount control method
JPH10255946A (en) * 1997-03-06 1998-09-25 Matsushita Electric Ind Co Ltd Connector thermocompression bonding method
JP2001029865A (en) * 2000-01-01 2001-02-06 Matsushita Electric Ind Co Ltd Coating device
JP2018014367A (en) * 2016-07-19 2018-01-25 富士機械製造株式会社 Component mounter
CN113102168A (en) * 2020-01-09 2021-07-13 艾美柯技术株式会社 Coating device, coating method, and coating head management system
CN113115526A (en) * 2021-04-20 2021-07-13 哈尔滨学院 PCB manufacturing system

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02280872A (en) * 1989-04-24 1990-11-16 Pioneer Electron Corp Method for detecting emission amount in viscous material emitting apparatus
JPH04188887A (en) * 1990-11-22 1992-07-07 Matsushita Electric Ind Co Ltd Adhesive application method and adhesive application device
JPH04199775A (en) * 1990-11-29 1992-07-20 Sanyo Electric Co Ltd Coating apparatus
JPH04199776A (en) * 1990-11-29 1992-07-20 Sanyo Electric Co Ltd Coating apparatus
JPH0671215A (en) * 1992-08-27 1994-03-15 Sanyo Electric Co Ltd Coating device
JPH09181431A (en) * 1995-12-27 1997-07-11 Matsushita Electric Ind Co Ltd Viscous fluid residual amount detection device and residual amount detection method
JPH10151402A (en) * 1996-11-26 1998-06-09 Matsushita Electric Ind Co Ltd Sealant discharge amount control method
JPH10255946A (en) * 1997-03-06 1998-09-25 Matsushita Electric Ind Co Ltd Connector thermocompression bonding method
JP2001029865A (en) * 2000-01-01 2001-02-06 Matsushita Electric Ind Co Ltd Coating device
JP2018014367A (en) * 2016-07-19 2018-01-25 富士機械製造株式会社 Component mounter
CN113102168A (en) * 2020-01-09 2021-07-13 艾美柯技术株式会社 Coating device, coating method, and coating head management system
CN113115526A (en) * 2021-04-20 2021-07-13 哈尔滨学院 PCB manufacturing system
CN113115526B (en) * 2021-04-20 2021-12-21 哈尔滨学院 A PCB board manufacturing system

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Publication number Publication date
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