JPH0287083A - lead terminal connection socket - Google Patents

Abstract

PURPOSE:To enable easy and reliable detection of a lead terminal bulging slightly from a main electrode, by making the upper side of an auxiliary electrode higher than that of the main electrode. CONSTITUTION:Auxiliary electrodes 7 made of pressurized conductive rubber, of which the bases 7a are connected to a conductor 6, are disposed, without forming any gap from main electrodes 4, between the main electrodes 4 disposed to be connected to lead terminals 3. The electrode 7 is so provided that the upper side 7b is higher than the upper side 4a of the electrode 4. When a socket IC 2 is put on and the terminals 3 are pressed by a presser member 10, according to this constitution, the electrodes 7 are not pressed and not put in continuity if the terminals 3 have no bend. If any terminal 3 has a bend and so bulges out of the edge of the electrode 4, the bulging part presses the electrode 7 and puts the terminal 3a in continuity with the conductor 6 located on the base of the electrode 7. Therefore the bend of the terminal 3a can be detected. Since the electrode 7 has elasticity and the upper side 7b thereof is higher than the upper side 4a, the pressing of the auxiliary electrode by the terminal 3a is secured when the bulging terminal 3a has a distortion, and thus the bend thereof is detected without fail.

Description

Detailed Description of the Invention (Field of Industrial Application) This invention relates to a socket equipped with an electrode that is connected to a lead terminal of a surface-mounted IC such as a small outline package (SOP) or a QFP (Quanded Flank Package). This relates to a socket structure that can detect minute bends in lead terminals.

(Prior art) A surface-mounted IC inspection device is equipped with a socket in which a large number of electrodes that contact the lead terminals of the IC are arranged in a flat manner. The lead terminal and the electrode are brought into contact by pressing the terminal against the electrode. In this type of sokeso 1-,
As shown in FIG. 8, an auxiliary electrode 7 is arranged with a gap between adjacent electrodes 4, and when the lead terminal 3 of the IC is bent, the electrode 4 and the auxiliary electrode 7 Japanese Unexamined Patent Publication No. 63-3276 discloses a device in which bending of the lead terminal 3 can be detected by utilizing the short circuit.

(Problem to be solved by the invention) The socket having the structure shown in FIG. In order to prevent the deformation of the edges of the electrodes 4 from easily contacting each other, only a gap of this size is required between the two electrodes 4 and 7, and as shown in FIG. If the lead terminal is twisted as shown in Figure 10, the contact with the auxiliary electrode 7 will be incomplete and detection will not be possible. The problem is that something happens. Even if the lead terminals are slightly bent, the lead terminals are arranged with a fine pinch between them, so there is a risk that a solder bridge will be formed between the lead terminals during the soldering process.

Therefore, the object of this invention is to make it possible to reliably detect even minute bends in the lead terminal, and to detect this when the upper terminal protrudes even slightly from the electrode, and regardless of whether or not the lead terminal is twisted. The object of the present invention is to obtain a socket having a structure that allows this to be detected easily and reliably.

(Means for Solving the Problems) The socket of the present invention is an electric socket equipped with a large number of electrodes arranged in a planar shape with the upper surface as a contact surface, and is mainly used for connecting to lead terminals of an IC. In sockets used for
The auxiliary electrode 7 made of pressurized conductive rubber whose bottom surface 7a is connected to the conductor 6 is arranged between the main electrode 4 without any gap between the auxiliary electrode 7 and the auxiliary electrode 7. The electrode 7 is characterized in that its upper surface 7b is higher than the upper surface 4a of the main electrode. Bottom surface 7 of auxiliary electrode 7
For example, it is preferable to connect to the conductor 6 through the vapor-deposited metal layer 9 in terms of manufacturing and accuracy.

(Function) When the IC 2 is placed on the socket having the above structure and the lead terminal 3 is pressed with the holding member 10, if the lead terminal is not bent, the auxiliary electrode 7 will not be pressed as shown in FIG. Electrode 7 is not conductive. On the other hand, if the lead terminal is bent and protrudes even slightly from the edge of the main electrode 4, the protruding portion of the lead terminal 3a presses the auxiliary electrode 7 as shown in FIG. Since the lead terminal 3a and the conductor 6 on the bottom surface of the auxiliary electrode 7 are electrically connected in the vertical direction, bending of the lead terminal 3a can be electrically detected by this electrical continuity. Since the auxiliary electrode 7 has elasticity and the upper surface 7b of the auxiliary electrode is higher than the upper surface 4a of the main electrode, it may not protrude.
Even if the upper terminal 3a is twisted as shown in FIG. 6 or 7, the pressing of the auxiliary electrode by the lead terminal is guaranteed, and the bending can be reliably detected.

(Example) The invention will now be further explained with reference to illustrated embodiments.

Fig. 1 is a plan view schematically showing the socket of the present invention with an IC mounted thereon, where 1 is an insulating substrate, 2 is an ICl3...
4 is the lead terminal of IC2, 4 is the main electrode placed in a plane in contact with the lead terminal 3, 5 is the land for circuit connection to the main electrode 4, and 6 is the main electrode 4. The conductive pattern 7 is formed on the insulating substrate 1 with a gap L (see FIGS. 1 and 4) between the main electrode 4 and the main electrode 4. This is an auxiliary electrode that is fitted on both ends without any gaps. The auxiliary electrode 7 consists of a cubic pressurized conductive comb, and as shown in FIG. 4, a metal thin film 9 is deposited on the bottom surface 7a of the comb, leaving a small margin 8 at the periphery.

FIG. 2 shows the relationship between the main electrode 4 and the auxiliary electrode 7 in more detail, and the auxiliary electrode 7 made of pressurized conductive rubber is arranged between the main electrode 4 without any gap. If there is no bend in the lead terminal 3 of the IC mounted in this socket, as shown in Figure 4, the lead terminal 3 is the main electrode 4.
Even if the lead terminal 3 is pressed with the presser material 10, the auxiliary electrode 7 of the pressurized conductive comb is not pressed, so the pressurized thick electric rubber is not electrically conductive, and therefore the conductive pattern 6
is insulated from all main electrodes 4.

There is.

On the other hand, as shown in FIG. 3, if the lead terminal 3a of the IC has a bend that protrudes from the main electrode 4, the bent lead terminal 3a will protrude as shown in FIG. portion presses the auxiliary electrode 7. Since the auxiliary electrode 7 is made of pressurized conductive rubber, the auxiliary electrode 7 is electrically connected by this pressing, and the conductive pattern 6 is electrically connected to the main electrode 4 via the auxiliary electrode 7 and the lead terminal 3a. Therefore, by checking the continuity between the main electrode 4 and the conductive pattern 6, the deformation of the lead terminal 3a can be electrically detected.

6 and 7 show the state when the lead terminal 3a is bent and twisted, and the lead terminal 3a is bent and twisted.
Even if the lead terminal 3a is twisted in the direction shown in FIG. 4 and the conductive pattern 6 are electrically connected, and the bend can be reliably detected.

The metal thin film 9 deposited on the bottom surface of the pressurized conductive rubber can be formed to the ultimate position leaving a slight margin 8 to prevent it from coming into contact with the main electrode 4. This compensates for the problem of leaving some gaps between them.

(Effects of the Invention) According to the present invention, minute bends in the lead terminals of surface-mounted ICs can be corrected regardless of whether the lead terminals are twisted or not.
Can be detected electrically easily and accurately. By using the socket 1 of the present invention as a socket for an IC tester, it is possible to simultaneously detect bending of lead terminals and test the electrical characteristics of an IC by simply adding a simple inspection program.

[Brief explanation of drawings]

FIGS. 1 to 7 are diagrams showing an embodiment of the present invention,
Fig. 1 is a plan view schematically showing the socket, Fig. 2 is a partial plan view showing the relationship between the main electrode and auxiliary electrode in a more realistic form, and Fig. 3 is a lead with a bend in the electrode shown in Fig. 2. Partial plan view showing a state in which terminal groups including terminals are in contact, No. 4
Figures 7 through 7 are partial side views showing the state of contact between the lead terminal and the electrode, and Figure 4 shows the case where the lead terminal is not bent.
FIG. 5 shows a case where the lead terminal has a bend, and FIGS. 6 and 7 show a case where the lead terminal has a bend and a twist. 8 and 9 are partial plan views showing the relationship between the electrodes and lead terminals of a conventional socket, and FIG. 10 is a partial side view of the conventional structure when the lead terminals are twisted. In the figure, 3: Lead terminal 3a: Bent lead terminal 4:
Main electrode 4a: Top surface of main electrode 6: Conductive pattern 7: Auxiliary electrode 7a: Bottom surface of auxiliary electrode 7b
: Upper surface of auxiliary electrode 9: Metal thin film L-spacing

Claims (2)

[Claims] (1) In a lead terminal connection socket equipped with a large number of electrodes arranged in a plane with the upper surface as the contact surface, the main electrode (4) is placed in contact with the lead terminal (3) between each other. , the auxiliary electrode (7) made of pressurized conductive rubber whose bottom surface (7a) is connected to the conductor (6) is arranged without forming a gap between it and the main electrode (4), A lead terminal connection socket characterized in that the auxiliary electrode (7) is provided with its upper surface (7b) higher than the upper surface (4a) of the main electrode. (2) The bottom surface (7a) of the auxiliary electrode (7) is covered with a vapor-deposited metal thin film (
2. The lead terminal connection socket according to claim 1, wherein the lead terminal connection socket is connected to the electrical conductor (6) via the lead terminal (9).