JPH028752A - Probe card - Google Patents

Abstract

PURPOSE:To prevent damage to an internal wiring material, a ground diffusion layer or a convex electrode by branching an end of a probing needle on the side of a printed substrate into a plurality of parts to suppress the deformation of the probing needle by a pressure when the needle is brought into contact with an electrode of a semiconductor element. CONSTITUTION:A probe card contains a printed circuit board 1, a conducting path 2 provided thereon 1 and a probing needle 3 connected thereto 2 and an end thereof on the side of the printed circuit board 1 is branched into a plurality of parts. In other words, the probe card is connected to a conducting section 2 provided in the perimeter of a hole formed almost at the center of the printed circuit board 1 while being made up of a plurality of probing needles 3 comprising hard metal such tungsten toward the center from the perimeter of the hole. Then, the probing needles 3 have a branch section 4 connected to the printed circuit board 1 in the course thereof. The addition of the branching section 4 allows the suppression of deformation of the probing needles when the semiconductor element is pressurized.

Description

[Detailed description of the invention] [Industrial application field] The present invention relates to a probe card.

[Conventional technology]

Conventionally, in the manufacturing process of semiconductor devices in which a plurality of semiconductor elements are formed on a semiconductor wafer and then separated into individual semiconductor elements, the electrical characteristics of each semiconductor element are measured.
This is generally done when the semiconductor wafer is in a state before separation. At this time, a test device to which a probe card is connected is used to measure the electrical characteristics of the semiconductor element.

FIG. 3 is a sectional view of a conventional probe card for explaining the conventional probe card. As shown in FIG. 3, the probe card is connected to a conductive path 2 provided around a hole formed approximately in the center of a printed circuit board 1, and
It is composed of a plurality of probing needles 3 extending from the periphery of the hole toward the center, and the terminal of the conductive path 2 is connected to a connector connected to a test device.

During measurement, the probing needles 3 are brought close to the wafer while facing the surface of the semiconductor wafer, and the plurality of probing needles 3 are brought into contact with each electrode formed on one semiconductor element within the wafer using appropriate pressure. The electrical characteristics of the semiconductor device were measured while the

[Problem to be solved by the invention]

In the conventional probe card described above, the probing needle 3
However, since the needle shape becomes thinner toward the tip, if too much pressure is applied when the tip of the probing needle 3 is brought into contact with the electrode of the semiconductor element, the probing needle 3 will easily be deformed.

The deformed probing needle has the disadvantage that it comes off the electrode part of the semiconductor element and damages the internal wiring material or the underlying diffusion layer, resulting in a decrease in yield. Furthermore, semiconductor devices having convex electrodes have the disadvantage that deformation of the probing needle damages the electrodes, resulting in defects in the strength-reducing ring in subsequent processes.

An object of the present invention is to provide a probe card that can improve the yield of semiconductor devices by suppressing the deformation of the probing needle and preventing the tip of the probing needle from coming off the electrode part of the semiconductor device. be.

[Means to solve the problem]

The probe card of the present invention includes a printed circuit board, a conductive path provided on the printed circuit board, and a probing needle connected to the conductive path, in which the probing needle has a plurality of ends on the printed circuit board side. It is composed of branches.

〔Example〕

Next, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a sectional view of a probe card for explaining a first embodiment of the present invention. As shown in FIG. 1, the probe card is connected to a conductive path 2 provided around a hole formed in the approximate center of a printed circuit board 1, and is connected to a conductive path 2 provided around a hole formed approximately in the center of a printed circuit board 1. It is composed of a plurality of probing needles 3 made of hard metal. The probing needle 3 has a branch part 4 connected to the printed circuit board 1 in the middle. The addition of the branch portion 4 makes it possible to suppress deformation of the probing needle when applying pressure to the semiconductor element.

FIG. 2 is a sectional view of a probe card for explaining a second embodiment of the present invention. As shown in FIG. 2, the present embodiment is characterized in that the branch portion 4 described in the first embodiment is connected to the conductive path 2. This allows the first
In addition to the same effect as in the embodiment, since the branch portion 4 also serves as a conductive portion, it has the effect of lowering the electrical resistance of probing.

〔Effect of the invention〕

As explained above, the present invention makes it possible to suppress the deformation of the probing needle due to the pressure when the probing needle contacts the electrode of the semiconductor element by branching the end of the probing needle on the printed circuit board side into a plurality of parts. This has the effect of preventing damage to internal wiring materials, underlying diffusion layers, or convex electrodes, and improving yield.

ng needle, 4...branch.

Claims (1)

[Claims] In a probe card for measuring the characteristics of a semiconductor device that includes a probing needle connected and held to a conductive path provided on a printed circuit board, the end of the probing needle on the printed circuit board side is branched into a plurality of parts. Characteristic probe card.