JPH0290663U - - Google Patents
Info
- Publication number
- JPH0290663U JPH0290663U JP16903488U JP16903488U JPH0290663U JP H0290663 U JPH0290663 U JP H0290663U JP 16903488 U JP16903488 U JP 16903488U JP 16903488 U JP16903488 U JP 16903488U JP H0290663 U JPH0290663 U JP H0290663U
- Authority
- JP
- Japan
- Prior art keywords
- ionization
- vacuum container
- heater
- gas
- gas introduction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007733 ion plating Methods 0.000 claims description 5
- 230000008020 evaporation Effects 0.000 claims description 3
- 238000001704 evaporation Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 239000007789 gas Substances 0.000 claims 5
- 239000012495 reaction gas Substances 0.000 claims 2
- 239000007795 chemical reaction product Substances 0.000 claims 1
- 238000000151 deposition Methods 0.000 claims 1
- 239000000376 reactant Substances 0.000 claims 1
- 239000010409 thin film Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
- 238000010894 electron beam technology Methods 0.000 description 1
Landscapes
- Physical Vapour Deposition (AREA)
Description
第１図は本考案のイオンプレーテイング装置の
一実施例を示す概略構成図である。第２図は本考
案のイオンプレーテイング装置の他の例を示す要
部概略構成図である。第３図および第４図はそれ
ぞれ従来のイオンプレーテイング装置の概略構成
図である。
１……真空容器、２……基板ホルダー、３……
基板、４……蒸発材料、５……ルツボ、６……電
子銃、７……電子ビーム、３０……放電電極（第
１のイオン化装置）、３２……シヤツタ、４０…
…ガス導入管、４０ａ……ガス導入口、４５……
加熱ヒータ、４５ａ……電源、４５ｂ……電源ケ
ーブル、４６……抵抗器（制御装置）、４７……
第２のイオン化装置。
FIG. 1 is a schematic diagram showing an embodiment of the ion plating apparatus of the present invention. FIG. 2 is a schematic diagram of the main parts of another example of the ion plating apparatus of the present invention. FIGS. 3 and 4 are schematic diagrams of conventional ion plating apparatuses, respectively. 1... Vacuum container, 2... Substrate holder, 3...
Substrate, 4... Evaporation material, 5... Crucible, 6... Electron gun, 7... Electron beam, 30... Discharge electrode (first ionization device), 32... Shutter, 40...
...Gas inlet pipe, 40a...Gas inlet, 45...
Heater, 45a...Power supply, 45b...Power cable, 46...Resistor (control device), 47...
Second ionization device.
Claims (1)
材料をイオン化するための第１のイオン化装置と
、ガス導入管により真空容器内に導入される反応
ガスをイオン化するための第２のイオン化装置と
が設けられ、それらイオン化装置によつてそれぞ
れイオン化させた蒸発材料および反応ガスの反応
生成物を真空容器内に配置した基板の表面に蒸着
させて薄膜を形成するように構成されたイオンプ
レーテイング装置であつて、前記第２のイオン化
装置は、前記ガス導入管の先端部に形成されてい
るガス導入口の直前に位置して設けられた加熱ヒ
ータと、その加熱ヒータの出力を制御する制御装
置とからなり、ガス導入口から真空容器内に導入
される反応ガスを加熱ヒータに接触させて加熱す
ることでイオン化させるとともに、制御装置によ
つてそのイオン化率を制御するように構成されて
なることを特徴とするイオンプレーテイング装置
。 Inside the vacuum container, a first ionization device for ionizing the evaporation material evaporated from the crucible and a second ionization device for ionizing the reaction gas introduced into the vacuum container by the gas introduction tube are provided. An ion plating device configured to form a thin film by depositing reaction products of the evaporation material and reaction gas, which are provided and ionized by the ionization devices, onto the surface of a substrate placed in a vacuum container. The second ionization device includes a heater located immediately in front of a gas introduction port formed at the tip of the gas introduction tube, and a control device that controls the output of the heater. The reactant gas introduced into the vacuum container from the gas inlet is brought into contact with a heater and heated to ionize it, and the ionization rate is controlled by a control device. Features of ion plating equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16903488U JPH0290663U (en) | 1988-12-27 | 1988-12-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16903488U JPH0290663U (en) | 1988-12-27 | 1988-12-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0290663U true JPH0290663U (en) | 1990-07-18 |
Family
ID=31458739
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16903488U Pending JPH0290663U (en) | 1988-12-27 | 1988-12-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0290663U (en) |
-
1988
- 1988-12-27 JP JP16903488U patent/JPH0290663U/ja active Pending
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