JPH0290665U - - Google Patents
Info
- Publication number
- JPH0290665U JPH0290665U JP17158988U JP17158988U JPH0290665U JP H0290665 U JPH0290665 U JP H0290665U JP 17158988 U JP17158988 U JP 17158988U JP 17158988 U JP17158988 U JP 17158988U JP H0290665 U JPH0290665 U JP H0290665U
- Authority
- JP
- Japan
- Prior art keywords
- chamber
- opening
- target
- sputtering
- closing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004544 sputter deposition Methods 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 2
Landscapes
- Physical Vapour Deposition (AREA)
Description
第１図Ａ，Ｂはこの考案の第１の実施例を示す
断面図、第２図Ａ，Ｂは同じく第２の実施例を示
す断面図、第３図は従来のスパツタ装置を示す断
面図である。
１……スパツタ室、４……基板ホルダ、７……
開口部、８……ターゲツト支持部材、２０……タ
ーゲツト室、２３……ゲートバルブ（開閉機構）
。
Figures 1A and B are cross-sectional views showing the first embodiment of this invention, Figures 2 A and B are cross-sectional views showing the second embodiment, and Figure 3 is a cross-sectional view showing a conventional sputtering device. It is. 1...Spatter chamber, 4...Substrate holder, 7...
Opening, 8...Target support member, 20...Target chamber, 23...Gate valve (opening/closing mechanism)
.
Claims (1)
とターゲツト室とを構成し、前記スパツタ室に基
板ホルダを、前記ターゲツト室にターゲツト支持
部材をそれぞれ設け、これらスパツタ室とターゲ
ツト室とを開口部を通して連通させるとともに、
該開口部を開閉する開閉機構を設けたことを特徴
とするスパツタ装置。 A sputtering chamber and a target chamber each capable of vacuum suction are configured, a substrate holder is provided in the sputtering chamber, a target support member is provided in the target chamber, and the sputtering chamber and the target chamber are communicated through an opening. Along with letting
A sputtering device characterized by being provided with an opening/closing mechanism for opening and closing the opening.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17158988U JPH0290665U (en) | 1988-12-28 | 1988-12-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17158988U JPH0290665U (en) | 1988-12-28 | 1988-12-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0290665U true JPH0290665U (en) | 1990-07-18 |
Family
ID=31463553
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17158988U Pending JPH0290665U (en) | 1988-12-28 | 1988-12-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0290665U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5665981A (en) * | 1979-11-02 | 1981-06-04 | Hitachi Ltd | Sputtering device |
| JPS60262969A (en) * | 1984-06-11 | 1985-12-26 | Tdk Corp | Sputtering target apparatus |
-
1988
- 1988-12-28 JP JP17158988U patent/JPH0290665U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5665981A (en) * | 1979-11-02 | 1981-06-04 | Hitachi Ltd | Sputtering device |
| JPS60262969A (en) * | 1984-06-11 | 1985-12-26 | Tdk Corp | Sputtering target apparatus |