JPH029432U - - Google Patents

Info

Publication number
JPH029432U
JPH029432U JP1988088386U JP8838688U JPH029432U JP H029432 U JPH029432 U JP H029432U JP 1988088386 U JP1988088386 U JP 1988088386U JP 8838688 U JP8838688 U JP 8838688U JP H029432 U JPH029432 U JP H029432U
Authority
JP
Japan
Prior art keywords
lead frame
bonding wires
bonding
lead
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988088386U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988088386U priority Critical patent/JPH029432U/ja
Publication of JPH029432U publication Critical patent/JPH029432U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07553—Controlling the environment, e.g. atmosphere composition or temperature changes in shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5366—Shapes of wire connectors the bond wires having kinks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案のボンデイング形態によりボン
デイングした一実施例の縦断面図、第２図は本考
案の第２の実施例の縦断面図、第３図は従来のボ
ンデイング形態によりボンデイングを行なつた従
来例の縦断面図である。 １―１，２―１，３―１……リードフレームの
リード部、１―２，２―２，３―２……ボンデイ
ングワイヤ、１―３，２―３，３―３……ＩＣペ
レツト、１―４，２―４，３―４……リードフレ
ームのＩＣペレツト搭載部、１―５，２―５，３
―５……ボンデイングパツド、Ａ……プラスチツ
クパツケージを加熱した時ボンデイングワイヤに
加わる熱的ストレスの方向、Ｂ……プラスチツク
パツケージの加熱をやめた時ボンデイングワイヤ
に加わる熱的ストレスの方向。 Fig. 1 is a longitudinal cross-sectional view of an embodiment of bonding according to the bonding method of the present invention, Fig. 2 is a longitudinal cross-sectional view of a second embodiment of the present invention, and Fig. 3 is a longitudinal cross-sectional view of an embodiment of bonding according to the conventional bonding method of the present invention. FIG. 3 is a vertical cross-sectional view of a conventional example. 1-1, 2-1, 3-1... Lead part of lead frame, 1-2, 2-2, 3-2... Bonding wire, 1-3, 2-3, 3-3... IC pellet. , 1-4, 2-4, 3-4... IC pellet mounting part of lead frame, 1-5, 2-5, 3
-5... Bonding pad, A... Direction of thermal stress applied to the bonding wire when the plastic package is heated, B... Direction of thermal stress applied to the bonding wire when heating the plastic package is stopped.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] モールド樹脂と、リードフレームと、集積回路
（以下ＩＣと記す）と、前記リードフレームと該
ＩＣの端子を配線するボンデイングワイヤとで構
成する、ＩＣのプラスチツクパツケージにおいて
、前記リードフレームに該ボンデイングワイヤを
接続した箇所より、前記ボンデイングワイヤを引
き出す方向を外部リードの方向としたことを特徴
とするパツケージ。 In the plastic package of an IC, which is composed of a molded resin, a lead frame, an integrated circuit (hereinafter referred to as IC), and bonding wires for wiring the lead frame and terminals of the IC, the bonding wires are attached to the lead frame. A package characterized in that the direction in which the bonding wire is pulled out from the connected point is the direction of the external lead.
JP1988088386U 1988-07-01 1988-07-01 Pending JPH029432U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988088386U JPH029432U (en) 1988-07-01 1988-07-01

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988088386U JPH029432U (en) 1988-07-01 1988-07-01

Publications (1)

Publication Number Publication Date
JPH029432U true JPH029432U (en) 1990-01-22

Family

ID=31312956

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988088386U Pending JPH029432U (en) 1988-07-01 1988-07-01

Country Status (1)

Country Link
JP (1) JPH029432U (en)

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