JPH029434U - - Google Patents

Info

Publication number
JPH029434U
JPH029434U JP1988087170U JP8717088U JPH029434U JP H029434 U JPH029434 U JP H029434U JP 1988087170 U JP1988087170 U JP 1988087170U JP 8717088 U JP8717088 U JP 8717088U JP H029434 U JPH029434 U JP H029434U
Authority
JP
Japan
Prior art keywords
signal
pulse
ball formation
wire
pulse signal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1988087170U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0451478Y2 (da
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988087170U priority Critical patent/JPH0451478Y2/ja
Publication of JPH029434U publication Critical patent/JPH029434U/ja
Application granted granted Critical
Publication of JPH0451478Y2 publication Critical patent/JPH0451478Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01551—Changing the shapes of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07511—Treating the bonding area before connecting, e.g. by applying flux or cleaning

Landscapes

  • Wire Bonding (AREA)
JP1988087170U 1988-06-30 1988-06-30 Expired JPH0451478Y2 (da)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988087170U JPH0451478Y2 (da) 1988-06-30 1988-06-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988087170U JPH0451478Y2 (da) 1988-06-30 1988-06-30

Publications (2)

Publication Number Publication Date
JPH029434U true JPH029434U (da) 1990-01-22
JPH0451478Y2 JPH0451478Y2 (da) 1992-12-03

Family

ID=31311792

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988087170U Expired JPH0451478Y2 (da) 1988-06-30 1988-06-30

Country Status (1)

Country Link
JP (1) JPH0451478Y2 (da)

Also Published As

Publication number Publication date
JPH0451478Y2 (da) 1992-12-03

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