JPH029434U - - Google Patents

Info

Publication number
JPH029434U
JPH029434U JP1988087170U JP8717088U JPH029434U JP H029434 U JPH029434 U JP H029434U JP 1988087170 U JP1988087170 U JP 1988087170U JP 8717088 U JP8717088 U JP 8717088U JP H029434 U JPH029434 U JP H029434U
Authority
JP
Japan
Prior art keywords
signal
pulse
ball formation
wire
pulse signal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1988087170U
Other languages
Japanese (ja)
Other versions
JPH0451478Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988087170U priority Critical patent/JPH0451478Y2/ja
Publication of JPH029434U publication Critical patent/JPH029434U/ja
Application granted granted Critical
Publication of JPH0451478Y2 publication Critical patent/JPH0451478Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01551—Changing the shapes of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07511—Treating the bonding area before connecting, e.g. by applying flux or cleaning

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案のワイヤボンダのワイヤ切れ検
出装置の実施例の説明図で、同図のａは該実施例
の構成図であり、ｂは信号波形例を示す図である
。 １……紫外線検出管、２……パルス駆動回路、
３……パルス信号検出回路、５……パルス信号、
６……判定回路、７……ボール形成開始信号、８
……ワイヤ切れ信号、１１……ワイヤ、１２……
キヤピラリ、１４……スパークロツド、１５……
紫外線、ｉ……放電電流、Ｔ……検出時間。 FIG. 1 is an explanatory diagram of an embodiment of a wire breakage detection device for a wire bonder according to the present invention, in which a is a block diagram of the embodiment, and b is a diagram showing an example of a signal waveform. 1... Ultraviolet detection tube, 2... Pulse drive circuit,
3...Pulse signal detection circuit, 5...Pulse signal,
6... Judgment circuit, 7... Ball formation start signal, 8
...Wire break signal, 11...Wire, 12...
Capillary, 14...Spark rod, 15...
Ultraviolet light, i...discharge current, T...detection time.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ワイヤボンダのボール形成時のスパークによつ
て生じる紫外線を検出する紫外線検出管と；該紫
外線検出管にパルス電圧を印加するパルス駆動回
路と；紫外線を受けた時に前記の紫外線検出管に
生じるパルス状の放電電流を受け、これに対応す
るパルス信号を検出するパルス信号検出回路と；
該パルス信号とボール形成開始信号とを受け、該
ボール形成開始信号を受けた時点から所定の時間
内に所定の数のパルスが検出されない場合にワイ
ヤ切れ信号を出力する判定回路と；を具備するこ
とを特徴とするワイヤボンダのワイヤ切れ検出装
置。 an ultraviolet detection tube that detects ultraviolet rays generated by sparks during ball formation of a wire bonder; a pulse drive circuit that applies a pulse voltage to the ultraviolet detection tube; a pulse signal detection circuit that receives a discharge current and detects a corresponding pulse signal;
a determination circuit that receives the pulse signal and the ball formation start signal and outputs a wire breakage signal if a predetermined number of pulses are not detected within a predetermined time from the time when the ball formation start signal is received; A wire breakage detection device for a wire bonder, characterized by the following.
JP1988087170U 1988-06-30 1988-06-30 Expired JPH0451478Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988087170U JPH0451478Y2 (en) 1988-06-30 1988-06-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988087170U JPH0451478Y2 (en) 1988-06-30 1988-06-30

Publications (2)

Publication Number Publication Date
JPH029434U true JPH029434U (en) 1990-01-22
JPH0451478Y2 JPH0451478Y2 (en) 1992-12-03

Family

ID=31311792

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988087170U Expired JPH0451478Y2 (en) 1988-06-30 1988-06-30

Country Status (1)

Country Link
JP (1) JPH0451478Y2 (en)

Also Published As

Publication number Publication date
JPH0451478Y2 (en) 1992-12-03

Similar Documents

Publication Publication Date Title
JPH029434U (en)
JPS5527427A (en) Detecting method in arc welding and other
JPH01240774A (en) Ignition signal detecting circuit
JPH0363963U (en)
JPS5719165A (en) Pulse arc welding device
JPH0360887U (en)
JPS6083644U (en) acupoint stimulator
JPH0177298U (en)
JPH0477460B2 (en)
JPS62106642U (en)
JPS6421364U (en)
JPS6367353U (en)
JP2757237B2 (en) Ball forming device for wire bonder
JPS58129156U (en) Oscilloscope sweep trigger pulse generation circuit
JPH0227522U (en)
JPS63129881U (en)
JPH0316365U (en)
JPS62103359U (en)
JPS6433192U (en)
JPS6028538U (en) Auto-dimming mirror device
JPS61152384U (en)
JPS6223397U (en)
JPH0270930U (en)
JPH02108229U (en)
JPS63197340U (en)