JPH0295257U - - Google Patents
Info
- Publication number
- JPH0295257U JPH0295257U JP1989002731U JP273189U JPH0295257U JP H0295257 U JPH0295257 U JP H0295257U JP 1989002731 U JP1989002731 U JP 1989002731U JP 273189 U JP273189 U JP 273189U JP H0295257 U JPH0295257 U JP H0295257U
- Authority
- JP
- Japan
- Prior art keywords
- storage cup
- heat dissipation
- semiconductor
- stored
- insulating case
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案の樹脂封止型電子機器の概略構
造を示す縦断面図、第２図ａないしｄは本考案に
使用する収納カツプの外周面に形成する係止部の
各変形例を示す断面図及び外観図、第３図は従来
の樹脂封止型電子機器の概略構成を示す縦断面図
である。
１…放熱基板、２…放熱体、３…取付ねじ、４
…取付孔、６…半導体ペレツト、７…内部導体、
８…外部端子、９…絶縁ケース、１０…絶縁蓋体
、１１…封止樹脂、５０…収納カツプ、５１…つ
ば部。
FIG. 1 is a vertical cross-sectional view showing a schematic structure of the resin-sealed electronic device of the present invention, and FIGS. 2 a to 2 d show variations of the locking portion formed on the outer circumferential surface of the storage cup used in the present invention. FIG. 3 is a longitudinal sectional view showing a schematic configuration of a conventional resin-sealed electronic device. 1... Heat dissipation board, 2... Heat dissipation body, 3... Mounting screw, 4
...Mounting hole, 6...Semiconductor pellet, 7...Inner conductor,
8... External terminal, 9... Insulating case, 10... Insulating lid, 11... Sealing resin, 50... Storage cup, 51... Brim portion.
Claims (1)
半導体ペレツトが収納された収納カツプを有し、
この収納カツプ内の半導体ペレツトには内部導体
を介して外部端子の一端が接続され、その他端は
、放熱基板上に前記収納カツプを包囲して載置・
固着された絶縁ケースの蓋体上に導出され、この
絶縁ケース内には、充填・硬化された封止樹脂を
有する樹脂封止型電子機器において、前記半導体
ペレツトが収納された収納カツプの外周面に、前
記封止樹脂との接着面積を大きくするための係止
部を形成したことを特徴とする半導体装置。 On the heat dissipation board attached to the external heat dissipation body,
It has a storage cup in which semiconductor pellets are stored,
One end of the external terminal is connected to the semiconductor pellet in this storage cup via an internal conductor, and the other end is placed on a heat dissipation board surrounding the storage cup.
In a resin-sealed electronic device having a sealing resin that is guided out onto the lid of a fixed insulating case and filled and hardened in the insulating case, the outer peripheral surface of a storage cup in which the semiconductor pellet is stored is A semiconductor device characterized in that a locking portion is formed to increase an adhesive area with the sealing resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989002731U JPH0636589Y2 (en) | 1989-01-17 | 1989-01-17 | Resin-sealed electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989002731U JPH0636589Y2 (en) | 1989-01-17 | 1989-01-17 | Resin-sealed electronic device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0295257U true JPH0295257U (en) | 1990-07-30 |
| JPH0636589Y2 JPH0636589Y2 (en) | 1994-09-21 |
Family
ID=31203759
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989002731U Expired - Fee Related JPH0636589Y2 (en) | 1989-01-17 | 1989-01-17 | Resin-sealed electronic device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0636589Y2 (en) |
-
1989
- 1989-01-17 JP JP1989002731U patent/JPH0636589Y2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0636589Y2 (en) | 1994-09-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS585349U (en) | semiconductor equipment | |
| JPH0352644U (en) | ||
| JPS585348U (en) | Resin-encapsulated semiconductor device | |
| JPH0295258U (en) | ||
| JPH0247061U (en) | ||
| JPS6188252U (en) | ||
| JPH0336141U (en) | ||
| JPS58191645U (en) | Semiconductor device package | |
| JPH01129842U (en) | ||
| JPS61182037U (en) | ||
| JPS63127148U (en) | ||
| JPS6284928U (en) | ||
| JPH0451146U (en) | ||
| JPH01120331U (en) | ||
| JPS6357750U (en) | ||
| JPS62126835U (en) | ||
| JPH01115246U (en) | ||
| JPH0332432U (en) | ||
| JPS6397241U (en) | ||
| JPS6370160U (en) | ||
| JPH0348235U (en) | ||
| JPH036839U (en) | ||
| JPS6416640U (en) | ||
| JPS5951919U (en) | insulation joint tool | |
| JPH02122436U (en) |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |