JPH0295257U - - Google Patents

Info

Publication number
JPH0295257U
JPH0295257U JP1989002731U JP273189U JPH0295257U JP H0295257 U JPH0295257 U JP H0295257U JP 1989002731 U JP1989002731 U JP 1989002731U JP 273189 U JP273189 U JP 273189U JP H0295257 U JPH0295257 U JP H0295257U
Authority
JP
Japan
Prior art keywords
storage cup
heat dissipation
semiconductor
stored
insulating case
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1989002731U
Other languages
English (en)
Other versions
JPH0636589Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989002731U priority Critical patent/JPH0636589Y2/ja
Publication of JPH0295257U publication Critical patent/JPH0295257U/ja
Application granted granted Critical
Publication of JPH0636589Y2 publication Critical patent/JPH0636589Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】
第１図は本考案の樹脂封止型電子機器の概略構
造を示す縦断面図、第２図ａないしｄは本考案に
使用する収納カツプの外周面に形成する係止部の
各変形例を示す断面図及び外観図、第３図は従来
の樹脂封止型電子機器の概略構成を示す縦断面図
である。 １…放熱基板、２…放熱体、３…取付ねじ、４
…取付孔、６…半導体ペレツト、７…内部導体、
８…外部端子、９…絶縁ケース、１０…絶縁蓋体
、１１…封止樹脂、５０…収納カツプ、５１…つ
ば部。

Claims (1)

    【実用新案登録請求の範囲】
  1. 外部の放熱体に取り付けられる放熱基板上に、
    半導体ペレツトが収納された収納カツプを有し、
    この収納カツプ内の半導体ペレツトには内部導体
    を介して外部端子の一端が接続され、その他端は
    、放熱基板上に前記収納カツプを包囲して載置・
    固着された絶縁ケースの蓋体上に導出され、この
    絶縁ケース内には、充填・硬化された封止樹脂を
    有する樹脂封止型電子機器において、前記半導体
    ペレツトが収納された収納カツプの外周面に、前
    記封止樹脂との接着面積を大きくするための係止
    部を形成したことを特徴とする半導体装置。
JP1989002731U 1989-01-17 1989-01-17 樹脂封止型電子機器 Expired - Fee Related JPH0636589Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989002731U JPH0636589Y2 (ja) 1989-01-17 1989-01-17 樹脂封止型電子機器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989002731U JPH0636589Y2 (ja) 1989-01-17 1989-01-17 樹脂封止型電子機器

Publications (2)

Publication Number Publication Date
JPH0295257U true JPH0295257U (ja) 1990-07-30
JPH0636589Y2 JPH0636589Y2 (ja) 1994-09-21

Family

ID=31203759

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989002731U Expired - Fee Related JPH0636589Y2 (ja) 1989-01-17 1989-01-17 樹脂封止型電子機器

Country Status (1)

Country Link
JP (1) JPH0636589Y2 (ja)

Also Published As

Publication number Publication date
JPH0636589Y2 (ja) 1994-09-21

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees