JPH0451146U - - Google Patents
Info
- Publication number
- JPH0451146U JPH0451146U JP1990092683U JP9268390U JPH0451146U JP H0451146 U JPH0451146 U JP H0451146U JP 1990092683 U JP1990092683 U JP 1990092683U JP 9268390 U JP9268390 U JP 9268390U JP H0451146 U JPH0451146 U JP H0451146U
- Authority
- JP
- Japan
- Prior art keywords
- cap
- semiconductor device
- lid body
- semiconductor
- directions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/015—Manufacture or treatment of bond wires
- H10W72/01515—Forming coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Description
第１図はこの考案の半導体装置の一実施例の断
面図、第２図は従来のＥＰＲＯＭの実装構造の一
部断面斜視図である。
１……プリント基板、２……チツプ搭載部、３
……端子、４……ペースト、５……半導体素子、
６……金属細線、７……チツプ保護樹脂、８……
キヤツプ、９……放熱体。
FIG. 1 is a sectional view of an embodiment of the semiconductor device of this invention, and FIG. 2 is a partially sectional perspective view of a conventional EPROM mounting structure. 1... Printed circuit board, 2... Chip mounting section, 3
... terminal, 4 ... paste, 5 ... semiconductor element,
6...Thin metal wire, 7...Chip protection resin, 8...
Cap, 9... Heat sink.
Claims (1)
、 (b) この半導体素子の主表面と、上記キヤツ
プの上部内周面に接触するように、ポツテイング
により形成され、この半導体素子の発熱を上記キ
ヤツプに伝達するフイラを含有したチツプ保護樹
脂と、 (c) 上記キヤツプの外周面に設けられ、上記
チツプ保護樹脂を介して伝達された上記半導体素
子の熱を放熱する放熱体と、 よりなる半導体装置。 (2) キヤツプは、金属、セラミツク、樹脂のい
ずれかで形成されることを特徴とする請求項１記
載の半導体装置。 (3) キヤツプは、四方向の側面部から成る蓋体
、２方向の側面部からなる蓋体、四本柱やぐら状
の蓋体、のいずれかの形状を有することを特徴と
する請求項１記載の半導体装置。[Claims for Utility Model Registration] (1) (a) A semiconductor device enclosed within a cap; (b) A main surface of the semiconductor device that is brought into contact with the upper inner circumferential surface of the cap by potting. (c) a chip protection resin containing a filler that is formed on the outer circumferential surface of the cap and transmits heat from the semiconductor element to the cap; A semiconductor device consisting of a heat dissipating body that dissipates heat, and a semiconductor device comprising: (2) The semiconductor device according to claim 1, wherein the cap is made of metal, ceramic, or resin. (3) The cap according to claim 1, wherein the cap has any one of the following shapes: a lid body consisting of side parts in four directions, a lid body consisting of side parts in two directions, and a lid body in the shape of a four-pillar tower. Semiconductor equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990092683U JPH0451146U (en) | 1990-09-05 | 1990-09-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990092683U JPH0451146U (en) | 1990-09-05 | 1990-09-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0451146U true JPH0451146U (en) | 1992-04-30 |
Family
ID=31829334
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990092683U Pending JPH0451146U (en) | 1990-09-05 | 1990-09-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0451146U (en) |
-
1990
- 1990-09-05 JP JP1990092683U patent/JPH0451146U/ja active Pending