JPH0295642U - - Google Patents
Info
- Publication number
- JPH0295642U JPH0295642U JP133789U JP133789U JPH0295642U JP H0295642 U JPH0295642 U JP H0295642U JP 133789 U JP133789 U JP 133789U JP 133789 U JP133789 U JP 133789U JP H0295642 U JPH0295642 U JP H0295642U
- Authority
- JP
- Japan
- Prior art keywords
- insulating substrate
- edge
- row
- electrically connected
- heating resistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
Landscapes
- Electronic Switches (AREA)
- Details Of Resistors (AREA)
- Multi-Conductor Connections (AREA)
Description
第1図は、この考案の一実施例に係るサーマル
ヘツドの要部外観斜視図、第2図aは、同サーマ
ルヘツドの要部拡大断面図、第2図bは、同サー
マルヘツドの変形例を説明する要部拡大断面図、
第3図は、同サーマルヘツドの信号用導体パター
ンを説明する要部拡大平面図、第4図は、従来の
サーマルヘツドの要部外観斜視図、第5図は、同
従来のサーマルヘツドの側面図である。
2:セラミツク基板、2a:セラミツク基板縁
部、3:クリツプ端子、4:信号用導体パターン
、5:端子部、6:絶縁樹脂。
Fig. 1 is a perspective view of the main part of a thermal head according to an embodiment of the invention, Fig. 2a is an enlarged sectional view of the main part of the thermal head, and Fig. 2b is a modification of the thermal head. An enlarged sectional view of the main parts to explain the
Fig. 3 is an enlarged plan view of the main parts explaining the signal conductor pattern of the thermal head, Fig. 4 is an external perspective view of the main parts of the conventional thermal head, and Fig. 5 is a side view of the conventional thermal head. It is a diagram. 2: Ceramic substrate, 2a: Ceramic substrate edge, 3: Clip terminal, 4: Signal conductor pattern, 5: Terminal portion, 6: Insulating resin.
Claims (1)
列を駆動する駆動用素子とを設け、この駆動用素
子に導通する導体パターンを前記絶縁基板の縁部
に導いて端子部を列設し、この絶縁基板縁部を挾
持し前記端子部にそれぞれ導通するクリツプ端子
を列設して、これらクリツプ端子を前記絶縁基板
縁部に樹脂を用いて固定してなるサーマルヘツド
。 A heating resistor array and a driving element for driving the heating resistor array are provided on an insulating substrate, and a conductor pattern electrically connected to the driving element is guided to an edge of the insulating substrate and terminal portions are arranged in a row. A thermal head comprising a row of clip terminals that sandwich the edge of the insulating substrate and are electrically connected to the terminal portions, and these clip terminals are fixed to the edge of the insulating substrate using resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989001337U JP2598192Y2 (en) | 1989-01-10 | 1989-01-10 | Thermal head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989001337U JP2598192Y2 (en) | 1989-01-10 | 1989-01-10 | Thermal head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0295642U true JPH0295642U (en) | 1990-07-30 |
| JP2598192Y2 JP2598192Y2 (en) | 1999-08-03 |
Family
ID=31201141
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989001337U Expired - Lifetime JP2598192Y2 (en) | 1989-01-10 | 1989-01-10 | Thermal head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2598192Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015101026A (en) * | 2013-11-26 | 2015-06-04 | 京セラ株式会社 | Thermal head and thermal printer |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5694344U (en) * | 1979-12-20 | 1981-07-27 | ||
| JPS6159863A (en) * | 1984-08-31 | 1986-03-27 | Nec Corp | Hybrid integrated circuit device |
| JPS63157952U (en) * | 1987-04-03 | 1988-10-17 | ||
| JPS6467362A (en) * | 1987-09-08 | 1989-03-14 | Nec Corp | Thermal head |
-
1989
- 1989-01-10 JP JP1989001337U patent/JP2598192Y2/en not_active Expired - Lifetime
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5694344U (en) * | 1979-12-20 | 1981-07-27 | ||
| JPS6159863A (en) * | 1984-08-31 | 1986-03-27 | Nec Corp | Hybrid integrated circuit device |
| JPS63157952U (en) * | 1987-04-03 | 1988-10-17 | ||
| JPS6467362A (en) * | 1987-09-08 | 1989-03-14 | Nec Corp | Thermal head |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015101026A (en) * | 2013-11-26 | 2015-06-04 | 京セラ株式会社 | Thermal head and thermal printer |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2598192Y2 (en) | 1999-08-03 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |