JPH03102728U - - Google Patents
Info
- Publication number
- JPH03102728U JPH03102728U JP1091790U JP1091790U JPH03102728U JP H03102728 U JPH03102728 U JP H03102728U JP 1091790 U JP1091790 U JP 1091790U JP 1091790 U JP1091790 U JP 1091790U JP H03102728 U JPH03102728 U JP H03102728U
- Authority
- JP
- Japan
- Prior art keywords
- sheet material
- chuck head
- view
- etching
- chuck
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005530 etching Methods 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 1
Landscapes
- Weting (AREA)
Description
第１図は、本考案の一実施例を示すシート材の
片面エツチング装置の要部構成図、第２図は、チ
ヤツクヘツド部の断面図、第３図は、チヤツクヘ
ツド部の底面図、第４図は、第３図と異なる実施
例を示すチヤツクヘツド部の底面図、第５図は、
バツクグラインド後の半導体用ウエハーを説明す
るための斜視図、第６図は、バツクグラインド後
の半導体用ウエハーの拡大断面図、第７図は、エ
ツチング量とチツプ強度との関係を示すグラフ、
第８図および第９図は従来例を示し、第８図は、
片面エツチング装置の要部構成図、第９図は、チ
ヤツクヘツドの断面図である。
１……半導体用ウエハー、１ａ……研削面、２
……チヤツクヘツド部、３……吸着板、６ａ……
収納凹部、７……超音波センサ、８……測定用開
口部、９……超音波厚さ計、１０……エツチング
制御部。
Fig. 1 is a schematic diagram of the essential parts of a single-sided etching apparatus for sheet material showing an embodiment of the present invention, Fig. 2 is a sectional view of the chuck head, Fig. 3 is a bottom view of the chuck head, and Fig. 4 is a bottom view of the chuck head section showing an embodiment different from that in FIG. 3, and FIG.
A perspective view for explaining a semiconductor wafer after back grinding, FIG. 6 is an enlarged sectional view of the semiconductor wafer after back grinding, and FIG. 7 is a graph showing the relationship between etching amount and chip strength.
FIGS. 8 and 9 show conventional examples, and FIG.
FIG. 9, which is a block diagram of the essential parts of the single-sided etching apparatus, is a sectional view of the chuck head. 1...Semiconductor wafer, 1a...Grinded surface, 2
...Chuck head section, 3...Adsorption plate, 6a...
Storage recess, 7... Ultrasonic sensor, 8... Measuring opening, 9... Ultrasonic thickness gauge, 10... Etching control section.
Claims (1)
けてシート材を保持するチヤツクヘツドと、 上記チヤツクヘツドに保持されるシート材に対
向させるようにして、上記チヤツクヘツドの内部
にセンサ部が配設されているシート材の厚さ測定
器とを具備することを特徴とするシート材の片面
エツチング装置。[Scope of Claim for Utility Model Registration] A chuck head that holds a sheet material with the surface to be etched facing the etching treatment tank, and a sensor section inside the chuck head so as to face the sheet material held by the chuck head. 1. A single-sided etching device for a sheet material, comprising a thickness measuring device for the sheet material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1091790U JPH03102728U (en) | 1990-02-06 | 1990-02-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1091790U JPH03102728U (en) | 1990-02-06 | 1990-02-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03102728U true JPH03102728U (en) | 1991-10-25 |
Family
ID=31514465
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1091790U Pending JPH03102728U (en) | 1990-02-06 | 1990-02-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03102728U (en) |
-
1990
- 1990-02-06 JP JP1091790U patent/JPH03102728U/ja active Pending