JPH03102742U

JPH03102742U -

Info

Publication number: JPH03102742U
Application number: JP1155590U
Authority: JP
Priority date: 1990-02-09
Filing date: 1990-02-09
Publication date: 1991-10-25

Description

[Brief explanation of drawings]

第１図は本考案の実施例を示す樹脂封止型半導
体装置のリードフレームの斜視図、第２図はその
リードフレームの平面図、第３図は第２図のＡ−
Ａ線断面図、第４図は第２図のＢ−Ｂ線断面図、
第５図は本考案の実施例を示す樹脂封止型半導体
装置のリードフレームのコーナ部の拡大斜視図、
第６図は本考案の他の実施例を示す樹脂封止型半
導体装置のリードフレームのアイランド部の展開
図、第７図はそのリードフレームのアイランドの
コーナ部の斜視図、第８図は従来の樹脂封止型半
導体装置の断面図、第９図は従来の他の例を示す
樹脂封止型半導体装置のリードフレームのアイラ
ンドの斜視図である。１１……アイランド、１２……インナリード、
１３……アイランドサポート、１４……半導体素
子、１５……金属細線、１７，１９……折り曲げ
部、１８……突出部。 FIG. 1 is a perspective view of a lead frame of a resin-sealed semiconductor device showing an embodiment of the present invention, FIG. 2 is a plan view of the lead frame, and FIG.
A sectional view taken along the line A, Figure 4 is a sectional view taken along the line B-B in Figure 2,
FIG. 5 is an enlarged perspective view of a corner portion of a lead frame of a resin-sealed semiconductor device showing an embodiment of the present invention;
FIG. 6 is a developed view of an island portion of a lead frame of a resin-sealed semiconductor device showing another embodiment of the present invention, FIG. 7 is a perspective view of a corner portion of the island of the lead frame, and FIG. 8 is a conventional FIG. 9 is a perspective view of an island of a lead frame of a resin-sealed semiconductor device showing another example of the conventional resin-sealed semiconductor device. 11...Island, 12...Inner Reed,
13...Island support, 14...Semiconductor element, 15...Metal thin wire, 17, 19...Bend portion, 18...Protrusion portion.

Claims

[Scope of claims for utility model registration] (1) A semiconductor element is mounted on a lead frame,
A resin-sealed semiconductor device in which the semiconductor element is sealed with resin, characterized in that each corner of the island of the lead frame is formed with a bent portion rising toward the semiconductor element mounting side. Semiconductor equipment. (2) The resin-sealed semiconductor device according to claim 1, wherein each corner of the island is pressed into a curved surface or into an angular shape and bent.