JPH03102743U - - Google Patents
Info
- Publication number
- JPH03102743U JPH03102743U JP1102590U JP1102590U JPH03102743U JP H03102743 U JPH03102743 U JP H03102743U JP 1102590 U JP1102590 U JP 1102590U JP 1102590 U JP1102590 U JP 1102590U JP H03102743 U JPH03102743 U JP H03102743U
- Authority
- JP
- Japan
- Prior art keywords
- light
- receiving element
- photoelectric conversion
- emitting
- protective resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案の光電変換素子の基本的構成の
一例を示す正面図、第２図は第１図のＡ−Ａ′線
矢視断面図、第３図はそのパツケージ内部の回路
構成例を示す正面図、第４図は本考案の光電変換
素子の他の構成例を示す正面図、第５図は第４図
のＢ−Ｂ′線矢視断面図、第６図は従来の光電変
換素子の構成を示す正面図である。
１１……リードフレーム、１２……発光または
受光素子、１３……周辺電気回路素子、１４……
透明モールドパツケージ、１５……ボンデイング
ワイヤー、１６……低線膨張モールド体。
Figure 1 is a front view showing an example of the basic configuration of the photoelectric conversion element of the present invention, Figure 2 is a sectional view taken along the line A-A' in Figure 1, and Figure 3 is an example of the circuit configuration inside the package. 4 is a front view showing another configuration example of the photoelectric conversion element of the present invention, FIG. 5 is a sectional view taken along the line B-B' in FIG. 4, and FIG. FIG. 3 is a front view showing the configuration of a conversion element. 11... Lead frame, 12... Light emitting or light receiving element, 13... Peripheral electric circuit element, 14...
Transparent mold package, 15...Bonding wire, 16...Low linear expansion mold body.
Claims (1)
たは受光素子およびＩＣ素子が一体または別体と
してマウントされており、外周を保護用樹脂でパ
ツケージングされた光電変換素子であり、前記保
護用樹脂は少なくとも発光または受光素子を含む
部分のみが透明材料で形成されており、その他の
部分はより低い線膨張率を有する材料からなるこ
とを特徴とする光電変換素子。 It is a photoelectric conversion element in which at least a light-emitting or light-receiving element and an IC element are mounted integrally or separately on a metal lead frame, and the outer periphery is packaged with a protective resin, and the protective resin is at least a light-emitting or light-receiving element and an IC element. A photoelectric conversion element characterized in that only a portion including a light-receiving element is made of a transparent material, and the other portions are made of a material having a lower coefficient of linear expansion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1102590U JPH03102743U (en) | 1990-02-08 | 1990-02-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1102590U JPH03102743U (en) | 1990-02-08 | 1990-02-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03102743U true JPH03102743U (en) | 1991-10-25 |
Family
ID=31514569
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1102590U Pending JPH03102743U (en) | 1990-02-08 | 1990-02-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03102743U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005159296A (en) * | 2003-11-06 | 2005-06-16 | Sharp Corp | Opto device package structure |
-
1990
- 1990-02-08 JP JP1102590U patent/JPH03102743U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005159296A (en) * | 2003-11-06 | 2005-06-16 | Sharp Corp | Opto device package structure |
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