JPH031893Y2 - - Google Patents

Description

[Detailed description of the invention] (Field of industrial application) The invention is characterized by a structure in which chip parts are connected to a printed wiring board, especially its press connection member, and can be mounted inexpensively, reliably, and easily. It's about what's possible.

(Conventional technology and problems) Conventionally, a so-called back-to-face connection was used, in which a chip component consisting of a chip carrier with signal input/output terminals on its top surface was mounted on a printed wiring board with printed signal lines on its top surface. One way to do this is to insert each pin on the chip component as a signal input/output terminal into the corresponding pinhole on the printed wiring board, and then connect each pin to the printed wiring board. A connection structure in which signal lines are soldered is often used.

However, with this connection structure, the work of inserting a large number of pins provided on a chip component into pinholes of a printed wiring board simultaneously and in parallel is surprisingly complicated and complicated due to problems such as manufacturing errors. There were problems such as some pins easily coming off the pinholes and becoming bent. In addition, since all the pins are soldered, when removing the chip component, it is necessary to melt the solder on each pin individually, and the heat may damage the circuit inside the chip component. Furthermore, since solder adheres to the chip components after removal, there was also the problem that they could not be easily reused.

On the other hand, in order to facilitate the removal and reuse of chip components, there is a connection structure in which the chip components are mounted on a printed wiring board using a socket. This socket is fixed to the printed wiring board by inserting each socket terminal for signal transmission into a pinhole of the printed wiring board and soldering each socket terminal wire to a signal line of the printed wiring board. Then, by removably inserting the pins of the chip component into the pin holes of the socket provided corresponding to each socket terminal wire of this socket, the chip component is fixed to the socket and electrically connected. It is something.

However, even with this method, it is still necessary to insert each socket terminal of a chip component into each corresponding socket at the same time, and the problem of complicated work and bending of some pins can still be avoided, as with the above-mentioned method. do not have. In addition, in order to ensure and easily insert each terminal of the socket into the pinhole provided on the printed wiring board, it is necessary to accurately maintain the parallelism between the tip of the terminal and the pinhole surface of the socket (± 1/100 degree) is required,
As a result, the manufacturing cost of the socket became high, and since it was difficult to miniaturize the socket, there was a problem that the mounting area of the chip components became large.

The present invention has been made in view of the above-mentioned conventional problems, and an object of the present invention is to provide a connection structure for chip components that is inexpensive, and allows chip components to be mounted reliably and easily.

(Means for Solving the Problems) The chip component connection structure according to the present invention includes a printed wiring board having each printed wiring signal line on its upper surface, and a printed wiring board mounted on the signal line and having each signal input on its upper surface. A chip component consisting of a chip carrier having an output terminal is made of a three-layer structure in which a metal pattern member electrically connecting the signal line and the input/output terminal and a pressing member are laminated and integrated via an elastic insulating member. This is a connection structure for chip parts that is press-fixed by a plate-shaped pressing connection member having a square cross section and having a step matching the step between the chip part and the printed wiring board.

The connection structure according to the present invention is particularly advantageously applied to IC chip carriers, but can also be suitably used for flat package type ICs in which signal input/output terminals are formed by protruding pins.

(Example) Hereinafter, an example of the present invention will be described in detail with reference to the drawings.

In FIGS. 1 and 2, reference number 1 is a printed wiring board, and this printed wiring board 1
The required signal line 2 is printed and wired on the
In addition, four fixing pinholes 3 for the plate-shaped press connection member 10 are formed at predetermined positions. and,
A chip carrier 4 (IC chip carrier in the figure) mounted on this printed wiring board 1 includes an integrated circuit 5, a plurality of signal lines 6 connected to this integrated circuit 5, and an end portion of each signal line 6. It has a signal input/output terminal 7.

IC chip carrier 4 configured as above
The connecting member 10 and the fixing pin 15 have a level difference that matches the level difference between the chip component and the printed wiring board.
is fixed to the printed wiring board 1 and electrically connected.

The connecting member 10 is made by sequentially laminating and integrating a metal pattern 11, an elastic insulating member 12, and a pressing member 13, and the entire cross section has a step that matches the step between the chip component and the printed wiring board.
It is bent into a shape (crank shape), and mounting holes 14 are formed at both ends, and the front and back surfaces are relatively hard, and an elastic insulating member is interposed therebetween. Therefore, it is said to have excellent compressibility overall. As shown in FIG. 3, the metal pattern member 11 constituting the connection member 10 has a large number of parallel signal lines 11a arranged on its inner surface. The spacing between the signal lines 11a is set to be a fraction of the spacing between the signal lines 2 of the printed wiring board 1 and the signal input/output terminals 7 of the IC chip carrier 4. Further, the elastic insulating member 12 is made of an elastic insulating material such as urethane, and the pressing member 13 is made of materials such as various metals and plastics. The fixing pin 15 for fixing the connecting member 10 to the printed wiring board 1 is made of elastic metal and is formed in a V shape.

Next, a method for mounting the IC chip carrier 4 on the printed wiring board 1 using the connecting member 10 will be described.

First, the IC chip carrier 4 is placed on the surface of the printed wiring board 1 at a predetermined position in a back-to-face positional relationship. And I.C.
Connecting members 10 are engaged with each edge of the chip carrier 4 where the signal input/output terminals 7 are formed, and the mounting holes 14 provided in these connecting members 10 are connected to pins for fixing the printed wiring board 1. Align with hole 3. In this state, one end of the fixing pin 15 is inserted into the mounting hole 14 of the connecting member 10 and the fixing pinhole 3 of the printed wiring board 1 and pressed. This connecting member is bent in a crank shape to match the level difference between the chip component and the printed circuit board, in other words, it is bent in an upright position corresponding to the thickness of the chip component, making it easy to align and provide cushioning properties. Yes, it has elasticity, so
Appropriate thickness error absorption function (parallelism correction function) is provided. Fixing pin 1 inserted further in this state
Solder one end of 5 to the back side of the printed wiring board. As a result of the 12 layers of elastic insulating material interposed in the connecting member 10, the pressing member 13 of the connecting member 10 is urged toward the printed wiring board 1 side at the other end of the fixing pin 15, and this pressing member 13 is pressed against the metal pattern. Part 1
1 and an elastic insulating member 12, the IC chip carrier 4 is pressed onto the printed wiring board 1 and fixedly connected. In this fixed state, the signal wires 11a of the metal pattern member 11 are in contact with the signal wires 2 of the printed wiring board 1 and the signal input/output terminals 7 of the IC chip carrier 4 in a pressed state, and each signal wire 2 and the signal input/output The terminals 7 are electrically connected through a plurality of signal lines 11a, respectively.

In the above embodiment, the connection member 10 is fixed to the printed wiring board 1 with the fixing pin 15, but it may also be fixed with a bolt/nut or other means.

(Effects of the invention) As described above, the chip component connection structure of the present invention includes a pressing connection member that contacts each signal input/output terminal of the IC chip carrier and each signal line of the printed wiring board to electrically connect them. , a structure in which a metal pattern member, an elastic insulating member, and a pressing member are sequentially laminated and integrated to have a step that matches the step between the chip component and the printed wiring board, and these are fixed by pressing. ing.

Therefore, the connection structure can be made compact, and since it has a level difference that matches the level difference between the chip component and the printed circuit board, it is possible to easily connect the chip component and the printed circuit board. The presence of the elastic insulating member provides cushioning properties and has an appropriate thickness error absorbing function (parallelism correcting function), so that the connection can be made reliably. Furthermore, even if the chip components are removed from the printed wiring board, they can be reused without any problem.

In the figure, an IC chip carrier with input/output terminals on the left and right sides has been described, but it can also be used with additional input/output terminals on the front and rear.

[Brief explanation of the drawing]

Each drawing shows an embodiment of the present invention. Fig. 1 is a partially cutaway perspective view showing an example of the connection structure of the invention in which an IC chip carrier is mounted on a printed wiring board, and Fig. −′ in Figure 1
The line sectional view and FIG. 3 are perspective views of the connecting member used in the present invention. In the drawings, 1... printed wiring board, 2... signal line, 4... IC chip carrier, 7... signal input/output terminal, 10... connection member, 11... metal pattern member, 12... elastic insulating member, 13...pressing member, 15...fixing pin.

Claims (1)

[Scope of utility model registration request] A printed wiring board having each signal line of printed wiring on its upper surface, and a chip component consisting of a chip carrier mounted on the signal line and having each signal input/output terminal on its upper surface, connect the above signal line and the above input/output terminal. It has a three-layer structure in which a metal pattern member for electrically connecting the two and a pressing member are laminated and integrated via an elastic insulating member, and has a cross section having a step that matches the step between the chip component and the printed wiring board. 〓A connection structure for chip parts that is press-fixed using a plate-shaped press connection member.