JPH03104792U - - Google Patents
Info
- Publication number
- JPH03104792U JPH03104792U JP1288890U JP1288890U JPH03104792U JP H03104792 U JPH03104792 U JP H03104792U JP 1288890 U JP1288890 U JP 1288890U JP 1288890 U JP1288890 U JP 1288890U JP H03104792 U JPH03104792 U JP H03104792U
- Authority
- JP
- Japan
- Prior art keywords
- chassis
- ventilation
- shaped
- duct
- opening
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000009423 ventilation Methods 0.000 claims description 12
- 238000001816 cooling Methods 0.000 claims description 5
- 238000007664 blowing Methods 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 4
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第1図はこの考案の一実施例による電子機器の
構成図、第2図は第1図のA部詳細図、第3図は
実装状態の正面図、第4図は第3図の断面BBを
示す図、第5図は第3図の断面CCを示す図、第
6図は従来技術による電子機器の構成図、第7図
は実装状態の正面図、第8図は第7図の断面DD
を示す図、第9図は第7図の断面EEを示す図で
ある。
図において1……第1の面、2……第2の面、
3……第3の面、4……第1の通風ダクト、5…
…冷却フイン、6……第1の通風孔、7……溝、
8……シヤシ、9……第4の面、10……第2の
通風ダクト、11……第2の通風孔、12……コ
ネクタ座、13……マザーボード、14……改良
マザーボード、15……電子回路部品、16……
放熱板、17……第1の辺、18……コネクタプ
ラグ、19……第2の辺、20……第3の辺、2
1……プリント基板、22……回路モジユール、
23……第1のブロア、24……第2のブロア、
25……舌状のバツフル、26……第1の冷却空
気、27……第2の冷却空気、28……カバー、
29……調整板である。なお、図中同一符号は同
一、又は相当部分を示す。
Fig. 1 is a configuration diagram of an electronic device according to an embodiment of this invention, Fig. 2 is a detailed view of part A in Fig. 1, Fig. 3 is a front view of the mounted state, and Fig. 4 is a cross section BB of Fig. 3. 5 is a diagram showing the cross section CC of FIG. 3, FIG. 6 is a configuration diagram of an electronic device according to the prior art, FIG. 7 is a front view of the mounted state, and FIG. 8 is a cross section of FIG. 7. DD
FIG. 9 is a diagram showing cross section EE in FIG. 7. In the figure, 1...first surface, 2...second surface,
3...Third surface, 4...First ventilation duct, 5...
...cooling fins, 6...first ventilation holes, 7...grooves,
8... Chassis, 9... Fourth surface, 10... Second ventilation duct, 11... Second ventilation hole, 12... Connector seat, 13... Motherboard, 14... Improved motherboard, 15... ...Electronic circuit parts, 16...
Heat sink, 17...first side, 18...connector plug, 19...second side, 20...third side, 2
1...Printed circuit board, 22...Circuit module,
23...first blower, 24...second blower,
25... Tongue-shaped buttful, 26... First cooling air, 27... Second cooling air, 28... Cover,
29...It is an adjustment plate. Note that the same reference numerals in the figures indicate the same or equivalent parts.
Claims (1)
1の面と直角をなす第2の面及び上記第2の面と
相対する第3の面には第1の通風ダクトが設けら
れるとともに、上記第1の通風ダクト内には冷却
フインを具備し、さらに上記第2の面及び第3の
面の後部には第1の通風孔が設けられ、そして上
記第2の面及び第3の面の内側には上記第1の面
に対し直角をなすように配したコの字型の溝を具
備する箱状のシヤシと、上記第1の面と相対する
第4の面に配せられるとともに、上記第1の面に
対し反対側の面には第2の通風ダクトが取り付け
られ、かつ、上記第2の通風ダクトと当接する部
分には第2の通風孔が設けられ、さらにコネクタ
座を具備するマザーボードと、一面には電子回路
部品が放熱板を挾持して実装されており、かつ、
第1の辺には上記コネクタ座と係合するコネクタ
プラグが実装され、さらに上記第1の辺と直角を
なす第2の辺及び上記第2の辺と相対する第3の
辺は、上記シヤシのコの字型の溝にはまり込むよ
うに配された矩形板状のプリント基板と、上記シ
ヤシの開口部を外側から覆うように配したカバー
と、上記シヤシに取り付けられ、上記第1の通風
ダクト内を送風するための第1のブロアと、上記
シヤシ内に収納され、かつ上記第2の通風孔、第
2のダクト及び上記マザーボードの相対する面に
配された調整板の平面上にCの字状とIの字状の
開口部により成形された舌状の複数のバツフルを
介して上記プリント基板に送風するための第2の
ブロアとで構成されていることを特徴とする電子
機器。 An opening is provided on the first surface, and a first ventilation duct is provided on a second surface that is perpendicular to the first surface and a third surface that faces the second surface. Additionally, cooling fins are provided in the first ventilation duct, first ventilation holes are provided in the rear portions of the second and third surfaces, and cooling fins are provided in the second and third surfaces. A box-shaped chassis having a U-shaped groove arranged perpendicularly to the first surface on the inside of the surface, and a box-shaped chassis provided with a U-shaped groove arranged on the fourth surface opposite to the first surface. At the same time, a second ventilation duct is attached to the surface opposite to the first surface, and a second ventilation hole is provided in a portion that contacts the second ventilation duct, and a connector is provided. A motherboard with a seat, and electronic circuit components mounted on one side with a heat sink sandwiched between them, and
A connector plug that engages with the connector seat is mounted on a first side, and a second side that is perpendicular to the first side and a third side opposite to the second side are mounted on the chassis. a rectangular plate-shaped printed circuit board arranged to fit into the U-shaped groove; a cover arranged to cover the opening of the chassis from the outside; and a cover attached to the chassis and the first ventilation A first blower for blowing air inside the duct, and a C on the plane of an adjusting plate housed in the chassis and arranged on opposing surfaces of the second ventilation hole, the second duct, and the motherboard. 1. An electronic device comprising a second blower for blowing air to the printed circuit board through a plurality of tongue-shaped buttfuls formed by an opening in the shape of the letter I and an opening in the letter I.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1288890U JPH03104792U (en) | 1990-02-13 | 1990-02-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1288890U JPH03104792U (en) | 1990-02-13 | 1990-02-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03104792U true JPH03104792U (en) | 1991-10-30 |
Family
ID=31516334
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1288890U Pending JPH03104792U (en) | 1990-02-13 | 1990-02-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03104792U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001284862A (en) * | 2000-03-30 | 2001-10-12 | Tech Res & Dev Inst Of Japan Def Agency | Electronic equipment cooling device |
-
1990
- 1990-02-13 JP JP1288890U patent/JPH03104792U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001284862A (en) * | 2000-03-30 | 2001-10-12 | Tech Res & Dev Inst Of Japan Def Agency | Electronic equipment cooling device |