JPH03105444U - - Google Patents

Info

Publication number
JPH03105444U
JPH03105444U JP1314190U JP1314190U JPH03105444U JP H03105444 U JPH03105444 U JP H03105444U JP 1314190 U JP1314190 U JP 1314190U JP 1314190 U JP1314190 U JP 1314190U JP H03105444 U JPH03105444 U JP H03105444U
Authority
JP
Japan
Prior art keywords
layer
antistatic
lamination
coating
vapor deposition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1314190U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1314190U priority Critical patent/JPH03105444U/ja
Publication of JPH03105444U publication Critical patent/JPH03105444U/ja
Pending legal-status Critical Current

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Landscapes

  • Conductive Materials (AREA)
  • Bag Frames (AREA)
  • Packaging Frangible Articles (AREA)
  • Laminated Bodies (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案による複合ラミネートフイルム
の層断面図である。第2図は本考案による製袋法
である。第3図は従来の製袋法の概略図である。
FIG. 1 is a cross-sectional view of the layers of a composite laminate film according to the present invention. FIG. 2 shows the bag making method according to the present invention. FIG. 3 is a schematic diagram of a conventional bag making method.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 絶縁性を有する基材フイルムの片側に金属蒸着
あるいはコーテイング、ラミネートを施し、該蒸
着、コーテイング、ラミネート層に耐摩擦層を設
け、表面抵抗値が10Ω/ロ以下の導電層を、
他面にポリ塩化ビニリデンのバリアー層を設け、
かつバリアー層側にヒートシール性を有するポリ
オレフイン樹脂に帯電防止剤を混練、あるいは塗
布し表面抵抗値が1012Ω/ロ以下の帯電防止
層をラミネートした複合フイルムであつて、該複
合フイルムの導電層の表層として折り曲げ、内層
の帯電防止層の両側端部をヒートシールさせ、内
容物が外から確認できる程度に透明性を有するこ
とを特徴とする電子部品用バツグ。
Metal vapor deposition, coating, or lamination is applied to one side of an insulating base film, and a friction-resistant layer is provided on the vapor deposition, coating, or lamination layer, and a conductive layer with a surface resistance value of 10 6 Ω/Ro or less is formed.
A barrier layer of polyvinylidene chloride is provided on the other side,
A composite film in which an antistatic layer having a surface resistance value of 10 12 Ω/Ω or less is laminated by kneading or applying an antistatic agent to a polyolefin resin having heat sealability on the barrier layer side, and the conductivity of the composite film is A bag for electronic parts, which is characterized by being folded as a surface layer and heat-sealing both ends of an antistatic layer as an inner layer, and having transparency to the extent that the contents can be confirmed from the outside.
JP1314190U 1990-02-15 1990-02-15 Pending JPH03105444U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1314190U JPH03105444U (en) 1990-02-15 1990-02-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1314190U JPH03105444U (en) 1990-02-15 1990-02-15

Publications (1)

Publication Number Publication Date
JPH03105444U true JPH03105444U (en) 1991-10-31

Family

ID=31516574

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1314190U Pending JPH03105444U (en) 1990-02-15 1990-02-15

Country Status (1)

Country Link
JP (1) JPH03105444U (en)

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