JPH03106764U - - Google Patents

Info

Publication number
JPH03106764U
JPH03106764U JP1990014908U JP1490890U JPH03106764U JP H03106764 U JPH03106764 U JP H03106764U JP 1990014908 U JP1990014908 U JP 1990014908U JP 1490890 U JP1490890 U JP 1490890U JP H03106764 U JPH03106764 U JP H03106764U
Authority
JP
Japan
Prior art keywords
facing
light
mounting
emitting diode
mounting surfaces
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1990014908U
Other languages
English (en)
Other versions
JP2544236Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990014908U priority Critical patent/JP2544236Y2/ja
Publication of JPH03106764U publication Critical patent/JPH03106764U/ja
Application granted granted Critical
Publication of JP2544236Y2 publication Critical patent/JP2544236Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Description

【図面の簡単な説明】
第1図は本考案実施例の平面図、第2図は第1
図のA−A′断面図、第3図は第1図のB−B′
断面図、第4図は本考案実施例の応用例1、第5
図は本考案実施例の応用例2、第6図は従来の表
示装置の断面図である。 1……第1のリードフレーム、2……第2のリ
ードフレーム、3,4……反射部、5……赤色発
光ダイオード、6……緑色発光ダイオード、7,
8……載置面、9,10……底面、11a……第
1の配線用リードフレーム、11b……第2の配
線用リードフレーム、12……透明エポキシ樹脂
。

Claims (1)

    【実用新案登録請求の範囲】
  1. 側壁に発光ダイオードの載置面を形成し該載置
    面に対向した側面と上方とを開放しかつ窪んだ底
    面からなる反射部を有し、前記載置面が略平行で
    ありかつ対向するように配置された第1、第2の
    リードフレームと、前記載置面の各々に側面が略
    真上を指向するように載置固着された互いに発光
    色の異なる発光ダイオードと、前記反射部の近傍
    と前記発光ダイオードとを覆う透明樹脂とを具備
    したことを特徴とする発光ダイオードランプ。
JP1990014908U 1990-02-16 1990-02-16 発光ダイオードランプ Expired - Lifetime JP2544236Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990014908U JP2544236Y2 (ja) 1990-02-16 1990-02-16 発光ダイオードランプ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990014908U JP2544236Y2 (ja) 1990-02-16 1990-02-16 発光ダイオードランプ

Publications (2)

Publication Number Publication Date
JPH03106764U true JPH03106764U (ja) 1991-11-05
JP2544236Y2 JP2544236Y2 (ja) 1997-08-13

Family

ID=31518244

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990014908U Expired - Lifetime JP2544236Y2 (ja) 1990-02-16 1990-02-16 発光ダイオードランプ

Country Status (1)

Country Link
JP (1) JP2544236Y2 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011142123A1 (ja) * 2010-05-14 2011-11-17 コニカミノルタセンシング株式会社 光源、照明光学系、及び反射特性測定装置

Also Published As

Publication number Publication date
JP2544236Y2 (ja) 1997-08-13

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