JPH03108331A - High precision polishing equipment - Google Patents

High precision polishing equipment

Info

Publication number
JPH03108331A
JPH03108331A JP1245926A JP24592689A JPH03108331A JP H03108331 A JPH03108331 A JP H03108331A JP 1245926 A JP1245926 A JP 1245926A JP 24592689 A JP24592689 A JP 24592689A JP H03108331 A JPH03108331 A JP H03108331A
Authority
JP
Japan
Prior art keywords
precision polishing
wafer
wax
autocollimator
high precision
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1245926A
Other languages
Japanese (ja)
Inventor
Yutaro Endo
遠藤 雄太郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP1245926A priority Critical patent/JPH03108331A/en
Publication of JPH03108331A publication Critical patent/JPH03108331A/en
Pending legal-status Critical Current

Links

Landscapes

  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、高精度研磨装置に係り、特にウェハの平行
度調整に関するものである。
DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a high-precision polishing apparatus, and particularly to parallelism adjustment of a wafer.

〔従来の技術〕[Conventional technology]

第2図は従来のこの種の高精度研磨装置を示す断面図で
あり、図において、1はウェハ、2はオプティカル・フ
ラット(以下、O/Fという)、4はシリンダ、5は角
度調整ネジ(X/Y)、6はバネ、7はウェハ取付台、
8は平行度を測定するオートコリメータ、9はウェハを
研磨するガラス板である。
Fig. 2 is a sectional view showing a conventional high-precision polishing device of this type. In the figure, 1 is a wafer, 2 is an optical flat (hereinafter referred to as O/F), 4 is a cylinder, and 5 is an angle adjustment screw. (X/Y), 6 is a spring, 7 is a wafer mount,
8 is an autocollimator for measuring parallelism, and 9 is a glass plate for polishing the wafer.

次に作用について説明する。高精度研磨装置は、オート
コリメータ8により光学的にウェハ1の平行度を調整、
検査をしながら研磨する装置である。
Next, the effect will be explained. The high-precision polishing device optically adjusts the parallelism of the wafer 1 using an autocollimator 8,
This is a device that polishes while inspecting.

07F2に対し平行にウェハ1を貼り付け、それをウェ
ハ取付台7に固定する。このウェハ取付台7の中心には
円柱状の空洞7aが形成されており、この空洞を通して
オートコリメータ8から発した光が0/F2に当たり、
そのはね返ってきた光の位置でO/F2の平行度を調整
する。この際、O/F2とウェハ1は平行でなれければ
ならないが、高精度に平行にするには、0/F2を多孔
質セラミック製のものとし、この0/F2の上(表面A
)にヒータで加熱しながらワックスを塗り、完全にワッ
クスが溶けるとウェハをのせるようにする。
The wafer 1 is pasted parallel to 07F2 and fixed to the wafer mount 7. A cylindrical cavity 7a is formed in the center of this wafer mount 7, and the light emitted from the autocollimator 8 passes through this cavity and hits 0/F2.
Adjust the parallelism of O/F2 based on the position of the reflected light. At this time, O/F2 and wafer 1 must be parallel to each other, but in order to make them parallel with high precision, O/F2 should be made of porous ceramic, and above this O/F2 (surface A
) while heating it with a heater, and when the wax is completely melted, place the wafer on it.

その時、第3図のように多孔質セラミックでできたO/
Fにワックスがしみ込み、ウェハ1と0/F2との間の
ワックスが極力おさえられ、ワックス厚を薄く均一に、
かつ平行に貼り付けることができる。
At that time, as shown in Figure 3, an O/
The wax soaks into F, and the wax between wafer 1 and 0/F2 is suppressed as much as possible, making the wax thin and uniform.
And they can be pasted in parallel.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

従来の高精度研磨装置は以上のように構成されているが
、0/F2にワックスを塗った際、O/Fの裏面Bにワ
ックスがしみ出してきて、O/Fの裏面が反射鏡の役割
を果せなくなり、オートコリメータからの光を反射する
ことができず、平行度の調整に困難が生ずる場合があっ
た。
Conventional high-precision polishing equipment is configured as described above, but when wax is applied to 0/F2, the wax seeps out to the back side B of the O/F, and the back side of the O/F is exposed to the reflective mirror. In some cases, the autocollimator becomes unable to fulfill its role and cannot reflect the light from the autocollimator, making it difficult to adjust the parallelism.

この発明は上記のような問題点を解消するためになされ
たもので、O/Fの裏面からのワックスのしみ出しを無
くし、O/Fの反射鏡としての性能を向上させ、オート
コリメータによるウェハの平行度の調整を容易にできる
高精度研磨装置を得ることを目的とする。
This invention was made in order to solve the above-mentioned problems, and it eliminates wax seepage from the back side of the O/F, improves the performance of the O/F as a reflector, and improves the performance of the wafer by an autocollimator. The object of the present invention is to obtain a high-precision polishing device that allows easy adjustment of parallelism.

〔課題を解決するための手段〕[Means to solve the problem]

この発明に係る高精度研磨装置は、多孔質セラミックで
できたO/Fの裏面に熱膨張率がそれと同程度の反射鏡
を貼着したものである。
The high-precision polishing device according to the present invention has a reflecting mirror having a coefficient of thermal expansion similar to that of the O/F made of porous ceramic attached to the back surface of the O/F.

〔作用〕 この発明における高精度研磨装置は、反射鏡を貼り付け
た多孔質セラミックのO/Fにより、ワックスが裏面に
しみ出さず、両脇からしみ出し、オートコリメータから
の光の反射を容易にする。
[Function] The high-precision polishing device of this invention uses a porous ceramic O/F with a reflecting mirror attached, so that the wax does not seep out from the back side but from both sides, making it easy to reflect light from the autocollimator. Make it.

〔実施例〕〔Example〕

以下、この発明の一実施例を図について説明する。第1
図において、1はウェハ、2はO/Fの主部をなしワッ
クスをしみ込ませることのできる多孔質セラミックでで
きたO/F、3はこの多孔質セラミックの裏面Bに貼着
され、それと同程度の熱膨張率でなる、例えば、金属、
ガラス、セラミックなど反射鏡になり得る部材で、ワッ
クスがしみ込まずオートコリメータから発した光を反射
することができる。そしてこれら2と3とにより07F
を形成する。
An embodiment of the present invention will be described below with reference to the drawings. 1st
In the figure, 1 is a wafer, 2 is an O/F that is the main part of the O/F and is made of porous ceramic that can be impregnated with wax, and 3 is an O/F that is attached to the back side B of this porous ceramic and is the same as the O/F. For example, metals with a coefficient of thermal expansion of about
A material that can be used as a reflective mirror, such as glass or ceramic, can reflect the light emitted from the autocollimator without soaking in the wax. And with these 2 and 3, 07F
form.

次にその作用について説明する。この発明では、0/F
が、ワックスをしみこますための多孔質セラミック2の
部分と、オートコリメータ8からの光を反射させる反射
鏡3の部分に分かれた構造となっているため、従来例の
ように、O/Fにワックスを塗った際、裏面にワックス
がしみ出してきてO/Fの裏面が反射鏡の役割を果せな
くなるようなことはなく、オートコリメータからの光を
容易に反射することができ、ウェハの平行度の調整を改
善し得る。
Next, its effect will be explained. In this invention, 0/F
However, since the structure is divided into a porous ceramic 2 part for soaking wax and a reflecting mirror 3 part to reflect the light from the autocollimator 8, unlike the conventional example, the O/F When wax is applied, the wax does not ooze out to the back side of the O/F and the back side of the O/F cannot function as a reflector, and the light from the autocollimator can be easily reflected. Parallelism adjustment may be improved.

〔発明の効果〕〔Effect of the invention〕

以上のようにこの発明によれば、O/Fを多孔質セラミ
ックと反射鏡により構成したので、オートコリメータに
よるウェハ平行出しが容易になり、精度の高い研磨装置
が得られる効果がある。
As described above, according to the present invention, since the O/F is constituted by a porous ceramic and a reflecting mirror, the wafer can be easily parallelized by an autocollimator, and a highly accurate polishing apparatus can be obtained.

【図面の簡単な説明】[Brief explanation of drawings]

第1図はこの発明の一実施例による高精度研磨装置のO
/Fを示す断面側面図、第2図は従来の高精度研磨装置
を示す断面側面図、第3図は従来の高精度研磨装置の0
/Fを示す断面側面図である。 図中、1はウェハ、2はO/F、3は反射鏡、4はシリ
ンダ、5は角度調整ネジ、6はバネ、7はウェハ取付台
、8はオートコリメータ、9はガラス板である。 なお、図中同一符号は同−又は相当部分を示す。
FIG. 1 shows a high-precision polishing device according to an embodiment of the present invention.
2 is a cross-sectional side view showing a conventional high-precision polishing device, and FIG. 3 is a cross-sectional side view showing a conventional high-precision polishing device.
It is a cross-sectional side view showing /F. In the figure, 1 is a wafer, 2 is an O/F, 3 is a reflecting mirror, 4 is a cylinder, 5 is an angle adjustment screw, 6 is a spring, 7 is a wafer mount, 8 is an autocollimator, and 9 is a glass plate. Note that the same reference numerals in the figures indicate the same or equivalent parts.

Claims (1)

【特許請求の範囲】[Claims] 多孔質セラミック層よりなるオプティカル・フラットを
備えた高精度研磨装置において、上記オプティカル・フ
ラットの片面の少なくとも一部に反射鏡となる部材を貼
着したことを特徴とする高精度研磨装置。
A high-precision polishing device equipped with an optical flat made of a porous ceramic layer, characterized in that a member serving as a reflecting mirror is attached to at least a portion of one side of the optical flat.
JP1245926A 1989-09-20 1989-09-20 High precision polishing equipment Pending JPH03108331A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1245926A JPH03108331A (en) 1989-09-20 1989-09-20 High precision polishing equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1245926A JPH03108331A (en) 1989-09-20 1989-09-20 High precision polishing equipment

Publications (1)

Publication Number Publication Date
JPH03108331A true JPH03108331A (en) 1991-05-08

Family

ID=17140905

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1245926A Pending JPH03108331A (en) 1989-09-20 1989-09-20 High precision polishing equipment

Country Status (1)

Country Link
JP (1) JPH03108331A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105619184A (en) * 2015-12-29 2016-06-01 上海现代先进超精密制造中心有限公司 High precision machining method for X-direction reflection mirror
CN107052948A (en) * 2017-04-24 2017-08-18 上海现代先进超精密制造中心有限公司 A kind of Cassegrain's primary mirror precision processing method and its matched clamp
US12144284B2 (en) 2018-07-30 2024-11-19 Kubota Corporation Combine harvester with a threshing device and detachable top plate

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105619184A (en) * 2015-12-29 2016-06-01 上海现代先进超精密制造中心有限公司 High precision machining method for X-direction reflection mirror
CN107052948A (en) * 2017-04-24 2017-08-18 上海现代先进超精密制造中心有限公司 A kind of Cassegrain's primary mirror precision processing method and its matched clamp
US12144284B2 (en) 2018-07-30 2024-11-19 Kubota Corporation Combine harvester with a threshing device and detachable top plate

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