JPH03109393U - - Google Patents
Info
- Publication number
- JPH03109393U JPH03109393U JP1851990U JP1851990U JPH03109393U JP H03109393 U JPH03109393 U JP H03109393U JP 1851990 U JP1851990 U JP 1851990U JP 1851990 U JP1851990 U JP 1851990U JP H03109393 U JPH03109393 U JP H03109393U
- Authority
- JP
- Japan
- Prior art keywords
- case body
- electronic components
- electronic device
- resin
- electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Switches That Are Operated By Magnetic Or Electric Fields (AREA)
- Switches Operated By Changes In Physical Conditions (AREA)
Description
第１図は、実施例電子装置を示す断面図、第２
図は、実施例の耐水性電子装置を示す断面図、第
３図は、従来の電子装置を示す断面図である。 １…機器ケース、２…回路基板、３…電子部品
、６…樹脂モールド部。
図は、実施例の耐水性電子装置を示す断面図、第
３図は、従来の電子装置を示す断面図である。 １…機器ケース、２…回路基板、３…電子部品
、６…樹脂モールド部。
Claims (1)
- 【実用新案登録請求の範囲】 電子部品を実装した回路基板を装置ケース体に
内装した電子装置において、 前記電子部品を熱伝導性の良い樹脂でモールド
し、この樹脂モールド部の表面適所を上記装置ケ
ース体の内面に接面させたことを特徴とする電子
装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1851990U JPH03109393U (ja) | 1990-02-26 | 1990-02-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1851990U JPH03109393U (ja) | 1990-02-26 | 1990-02-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03109393U true JPH03109393U (ja) | 1991-11-11 |
Family
ID=31521674
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1851990U Pending JPH03109393U (ja) | 1990-02-26 | 1990-02-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03109393U (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014080931A1 (ja) * | 2012-11-21 | 2014-05-30 | 株式会社カネカ | 放熱構造体 |
-
1990
- 1990-02-26 JP JP1851990U patent/JPH03109393U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014080931A1 (ja) * | 2012-11-21 | 2014-05-30 | 株式会社カネカ | 放熱構造体 |
| JPWO2014080931A1 (ja) * | 2012-11-21 | 2017-01-05 | 株式会社カネカ | 放熱構造体 |