JPH03110746U - - Google Patents
Info
- Publication number
- JPH03110746U JPH03110746U JP1950790U JP1950790U JPH03110746U JP H03110746 U JPH03110746 U JP H03110746U JP 1950790 U JP1950790 U JP 1950790U JP 1950790 U JP1950790 U JP 1950790U JP H03110746 U JPH03110746 U JP H03110746U
- Authority
- JP
- Japan
- Prior art keywords
- land portions
- circuit board
- printed circuit
- fuse
- insulating film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
- Fuses (AREA)
Description
第１図は本考案の一実施例に係るプリント基板
の斜視図、第２図はこのプリント基板にヒユーズ
を形成する手順を示す斜視図、第３図はこのヒユ
ーズが溶断した状態を示す斜視図、第４図は従来
のヒユーズの概略的説明図である。
１０……ランド部、２０……絶縁膜、３０……
隙間、３１……狭幅部、１００……プリント基板
、１１０……（プリント基板の）表面。
Fig. 1 is a perspective view of a printed circuit board according to an embodiment of the present invention, Fig. 2 is a perspective view showing the procedure for forming a fuse on this printed board, and Fig. 3 is a perspective view showing a state in which the fuse is blown. , FIG. 4 is a schematic explanatory diagram of a conventional fuse. 10... Land portion, 20... Insulating film, 30...
Gap, 31... Narrow portion, 100... Printed circuit board, 110... Surface (of printed circuit board).
Claims (1)
を空けて取り囲む絶縁膜とが表面に形成されたプ
リント基板であつて、前記隙間には一部が狭くな
つた狭幅部が設けられており、前記ランド部を隙
間に充填した半田で接続してヒユーズとなすこと
を特徴とするプリント基板。 The printed circuit board has a pair of land portions and an insulating film surrounding the land portions with a predetermined gap formed on the surface thereof, and the gap is provided with a narrow portion that is partially narrowed. . A printed circuit board, characterized in that the land portions are connected with solder filled in the gaps to form a fuse.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1950790U JPH03110746U (en) | 1990-02-27 | 1990-02-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1950790U JPH03110746U (en) | 1990-02-27 | 1990-02-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03110746U true JPH03110746U (en) | 1991-11-13 |
Family
ID=31522620
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1950790U Pending JPH03110746U (en) | 1990-02-27 | 1990-02-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03110746U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014148121A1 (en) * | 2013-03-22 | 2014-09-25 | シャープ株式会社 | Structure, wireless communication device and method for manufucturing structure |
-
1990
- 1990-02-27 JP JP1950790U patent/JPH03110746U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014148121A1 (en) * | 2013-03-22 | 2014-09-25 | シャープ株式会社 | Structure, wireless communication device and method for manufucturing structure |
| JP2014187549A (en) * | 2013-03-22 | 2014-10-02 | Sharp Corp | Structure, radio communication device and structure manufacturing method |
| US9736944B2 (en) | 2013-03-22 | 2017-08-15 | Sharp Kabushiki Kaisha | Structure, wireless communication device and method for manufacturing structure |