JPH03110853U - - Google Patents
Info
- Publication number
- JPH03110853U JPH03110853U JP1833590U JP1833590U JPH03110853U JP H03110853 U JPH03110853 U JP H03110853U JP 1833590 U JP1833590 U JP 1833590U JP 1833590 U JP1833590 U JP 1833590U JP H03110853 U JPH03110853 U JP H03110853U
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- semiconductor chip
- heat radiator
- resin
- heat sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 2
- 230000000630 rising effect Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図ａ，ｂは従来装置構造を示す断面図及び
平面図、第２図は従来装置の説明図、第３図ａ，
ｂ，ｃ，ｄは本考案の一実施例構造図、第４図ａ
，ｂのその説明図である。図において、１……放
熱体、１ａ……リード線部、１ｂ……端部、１ｅ
……他端の樹脂成形時の治具保持部、２……半導
体チツプ、３……リード線、３ａ……接続線、４
……樹脂部、５……ねじ用孔、６……金属放熱体
、７……ねじ、８……樹脂製突起物である。
Figures 1a and b are cross-sectional views and plan views showing the structure of a conventional device, Figure 2 is an explanatory diagram of the conventional device, and Figures 3a,
b, c, d are structural diagrams of one embodiment of the present invention, Fig. 4 a
, b. In the figure, 1... heat sink, 1a... lead wire section, 1b... end, 1e
...Jig holding part for resin molding at the other end, 2...Semiconductor chip, 3...Lead wire, 3a...Connection wire, 4
...Resin part, 5...Screw hole, 6...Metal heat sink, 7...Screw, 8...Resin protrusion.
Claims (1)
上がり部及折り曲げ部を有するリード線部と、前
記放熱体に電極部が固着された半導体チツプと、
前記半導体チツプの他の電極部に接続され、前記
リード線部とほぼ平行に導出される他のリード線
と、少なくとも前記リード線部の折曲部、半導体
チツプ及び放熱体を封止する樹脂部よりなる半導
体装置において、前記放熱体の他端上下部に金属
支持用の絶縁性突起物を固着させたことを特徴と
する樹脂密封型半導体装置。 a plate-shaped heat radiator; a lead wire portion having a rising portion and a bent portion connected to one end of the heat radiator; and a semiconductor chip having an electrode portion fixed to the heat radiator;
Another lead wire connected to the other electrode portion of the semiconductor chip and led out substantially parallel to the lead wire portion, and a resin portion that seals at least the bent portion of the lead wire portion, the semiconductor chip, and the heat sink. 1. A resin-sealed semiconductor device comprising: an insulating protrusion for metal support fixed to the upper and lower portions of the other end of the heat sink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1833590U JP2506933Y2 (en) | 1990-02-27 | 1990-02-27 | Resin sealed semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1833590U JP2506933Y2 (en) | 1990-02-27 | 1990-02-27 | Resin sealed semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03110853U true JPH03110853U (en) | 1991-11-13 |
| JP2506933Y2 JP2506933Y2 (en) | 1996-08-14 |
Family
ID=31521498
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1833590U Expired - Lifetime JP2506933Y2 (en) | 1990-02-27 | 1990-02-27 | Resin sealed semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2506933Y2 (en) |
-
1990
- 1990-02-27 JP JP1833590U patent/JP2506933Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JP2506933Y2 (en) | 1996-08-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |