JPH0311119B2 - - Google Patents

Info

Publication number: JPH0311119B2
Authority: JP; Japan
Prior art keywords: layer; common electrode; head; heat generating; electrode
Prior art date: 1985-04-13
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Lifetime

Application number

JP60078709A

Other languages

English (en)

Japanese (ja)

Other versions

JPS61237498A (ja

Inventor

Isao Myokan

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Konica Minolta Inc

Original Assignee

Konica Minolta Inc

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1985-04-13

Filing date

1985-04-13

Publication date

1991-02-15

1985-04-13 Application filed by Konica Minolta Inc filed Critical Konica Minolta Inc

1985-04-13 Priority to JP60078709A priority Critical patent/JPS61237498A/ja

1986-04-07 Priority to DE8686302569T priority patent/DE3685983T2/de

1986-04-07 Priority to EP86302569A priority patent/EP0198646B1/de

1986-10-22 Publication of JPS61237498A publication Critical patent/JPS61237498A/ja

1988-04-21 Priority to US07/186,697 priority patent/US4795887A/en

1991-02-15 Publication of JPH0311119B2 publication Critical patent/JPH0311119B2/ja

Status Granted legal-status Critical Current

Links

239000010410 layer Substances 0.000 claims description 95
238000010438 heat treatment Methods 0.000 claims description 27
238000009792 diffusion process Methods 0.000 claims description 13
239000000463 material Substances 0.000 claims description 13
230000002265 prevention Effects 0.000 claims description 12
239000011241 protective layer Substances 0.000 claims description 8
229910052581 Si3N4 Inorganic materials 0.000 claims description 6
VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
229910052782 aluminium Inorganic materials 0.000 claims description 6
239000010931 gold Substances 0.000 claims description 6
HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 6
229910052814 silicon oxide Inorganic materials 0.000 claims description 6
XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
229910052737 gold Inorganic materials 0.000 claims description 5
PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 4
229910052750 molybdenum Inorganic materials 0.000 claims description 4
229910052721 tungsten Inorganic materials 0.000 claims description 4
BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 claims description 3
229910052715 tantalum Inorganic materials 0.000 claims description 3
MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 claims description 3
229910001936 tantalum oxide Inorganic materials 0.000 claims description 3
229910052582 BN Inorganic materials 0.000 claims description 2
PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 2
ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 2
239000011733 molybdenum Substances 0.000 claims description 2
TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 2
GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 2
WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 2
239000010937 tungsten Substances 0.000 claims description 2
238000000034 method Methods 0.000 description 14
239000000758 substrate Substances 0.000 description 11
239000002585 base Substances 0.000 description 10
150000004767 nitrides Chemical class 0.000 description 8
238000004544 sputter deposition Methods 0.000 description 7
238000003825 pressing Methods 0.000 description 5
229910004298 SiO 2 Inorganic materials 0.000 description 3
239000003513 alkali Substances 0.000 description 3
230000000694 effects Effects 0.000 description 3
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
238000003491 array Methods 0.000 description 2
230000015572 biosynthetic process Effects 0.000 description 2
239000011889 copper foil Substances 0.000 description 2
230000008018 melting Effects 0.000 description 2
238000002844 melting Methods 0.000 description 2
229910052751 metal Inorganic materials 0.000 description 2
239000002184 metal Substances 0.000 description 2
238000000059 patterning Methods 0.000 description 2
230000005855 radiation Effects 0.000 description 2
229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
239000004642 Polyimide Substances 0.000 description 1
239000000919 ceramic Substances 0.000 description 1
239000011248 coating agent Substances 0.000 description 1
238000000576 coating method Methods 0.000 description 1
238000011109 contamination Methods 0.000 description 1
230000007547 defect Effects 0.000 description 1
230000006866 deterioration Effects 0.000 description 1
238000010586 diagram Methods 0.000 description 1
238000009826 distribution Methods 0.000 description 1
238000005566 electron beam evaporation Methods 0.000 description 1
238000000609 electron-beam lithography Methods 0.000 description 1
239000011521 glass Substances 0.000 description 1
238000011835 investigation Methods 0.000 description 1
238000010030 laminating Methods 0.000 description 1
230000000873 masking effect Effects 0.000 description 1
239000011159 matrix material Substances 0.000 description 1
229910052759 nickel Inorganic materials 0.000 description 1
230000003647 oxidation Effects 0.000 description 1
238000007254 oxidation reaction Methods 0.000 description 1
238000001259 photo etching Methods 0.000 description 1
239000004033 plastic Substances 0.000 description 1
229920001721 polyimide Polymers 0.000 description 1
239000000843 powder Substances 0.000 description 1
238000000926 separation method Methods 0.000 description 1
238000003746 solid phase reaction Methods 0.000 description 1
238000007740 vapor deposition Methods 0.000 description 1

Landscapes

Electronic Switches (AREA)
Production Of Multi-Layered Print Wiring Board (AREA)

JP60078709A 1985-04-13 1985-04-13 集積回路装置 Granted JPS61237498A (ja)

Priority Applications (4)

Application Number	Priority Date	Filing Date	Title
JP60078709A JPS61237498A (ja)	1985-04-13	1985-04-13	集積回路装置
DE8686302569T DE3685983T2 (de)	1985-04-13	1986-04-07	Integrierte halbleiteranordnung.
EP86302569A EP0198646B1 (de)	1985-04-13	1986-04-07	Integrierte Halbleiteranordnung
US07/186,697 US4795887A (en)	1985-04-13	1988-04-21	Thermal printhead with common electrode formed directly over glazing layer

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP60078709A JPS61237498A (ja)	1985-04-13	1985-04-13	集積回路装置

Publications (2)

Publication Number	Publication Date
JPS61237498A JPS61237498A (ja)	1986-10-22
JPH0311119B2 true JPH0311119B2 (de)	1991-02-15

Family

ID=13669389

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP60078709A Granted JPS61237498A (ja)	1985-04-13	1985-04-13	集積回路装置

Country Status (1)

Country	Link
JP (1)	JPS61237498A (de)

1985
- 1985-04-13 JP JP60078709A patent/JPS61237498A/ja active Granted

Also Published As

Publication number	Publication date
JPS61237498A (ja)	1986-10-22

Legal Events

Date	Code	Title	Description
2005-02-15	LAPS	Cancellation because of no payment of annual fees

Publication	Publication Date	Title
US5091736A (en)	1992-02-25	Thermal print head
US4795887A (en)	1989-01-03	Thermal printhead with common electrode formed directly over glazing layer
US5680170A (en)	1997-10-21	Thermal printhead
JP7219634B2 (ja)	2023-02-08	サーマルプリントヘッド
JPS63179764A (ja)	1988-07-23	感熱記録ヘツド
JPH0311119B2 (de)	1991-02-15
JP2001232838A (ja)	2001-08-28	サーマルプリントヘッドおよびその製造方法
US20070040868A1 (en)	2007-02-22	Thermal printhead
US5428373A (en)	1995-06-27	Thermal head for thermal recording or thermal transfer recording and method of manufacturing the same
JPS61237662A (ja)	1986-10-22	集積回路装置
JP3126874B2 (ja)	2001-01-22	サーマルプリントヘッド
JPS61237660A (ja)	1986-10-22	集積回路装置
JP2023121322A (ja)	2023-08-31	サーマルプリントヘッド、サーマルプリントヘッドの製造方法、およびサーマルプリンタ
JPH0351096B2 (de)	1991-08-05
JP3616809B2 (ja)	2005-02-02	サーマルヘッドおよびその製造方法
JPS61256691A (ja)	1986-11-14	集積回路装置
JP2023109505A (ja)	2023-08-08	半導体素子、半導体素子の実装構造、およびサーマルプリントヘッド
JPS61262142A (ja)	1986-11-20	サ−マルヘツド
JP2023121416A (ja)	2023-08-31	サーマルプリントヘッド、およびサーマルプリンタ
JP2023153472A (ja)	2023-10-18	サーマルプリントヘッドの製造方法、およびサーマルプリントヘッド
JPH0416023B2 (de)	1992-03-19
JPS63151468A (ja)	1988-06-24	感熱記録ヘツド
JPH079640Y2 (ja)	1995-03-08	サーマルヘッド
JPH0592598A (ja)	1993-04-16	サーマルヘツド
JPH0569576A (ja)	1993-03-23	ライン型サーマルプリントヘツドの構造