JPS61237498A - 集積回路装置 - Google Patents
集積回路装置Info
- Publication number
- JPS61237498A JPS61237498A JP60078709A JP7870985A JPS61237498A JP S61237498 A JPS61237498 A JP S61237498A JP 60078709 A JP60078709 A JP 60078709A JP 7870985 A JP7870985 A JP 7870985A JP S61237498 A JPS61237498 A JP S61237498A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- common electrode
- head
- electrode
- heat generating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000009792 diffusion process Methods 0.000 claims description 10
- 230000002265 prevention Effects 0.000 claims description 9
- 239000010410 layer Substances 0.000 description 85
- 238000010438 heat treatment Methods 0.000 description 27
- 239000000758 substrate Substances 0.000 description 13
- 238000000034 method Methods 0.000 description 11
- 150000004767 nitrides Chemical class 0.000 description 8
- 239000002585 base Substances 0.000 description 7
- 238000004544 sputter deposition Methods 0.000 description 7
- 239000011241 protective layer Substances 0.000 description 6
- 239000010931 gold Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- 239000003513 alkali Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000000059 patterning Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 101150006573 PAN1 gene Proteins 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910004479 Ta2N Inorganic materials 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 238000005566 electron beam evaporation Methods 0.000 description 1
- 238000000609 electron-beam lithography Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000003746 solid phase reaction Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 229910001845 yogo sapphire Inorganic materials 0.000 description 1
Landscapes
- Electronic Switches (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60078709A JPS61237498A (ja) | 1985-04-13 | 1985-04-13 | 集積回路装置 |
| DE8686302569T DE3685983T2 (de) | 1985-04-13 | 1986-04-07 | Integrierte halbleiteranordnung. |
| EP86302569A EP0198646B1 (de) | 1985-04-13 | 1986-04-07 | Integrierte Halbleiteranordnung |
| US07/186,697 US4795887A (en) | 1985-04-13 | 1988-04-21 | Thermal printhead with common electrode formed directly over glazing layer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60078709A JPS61237498A (ja) | 1985-04-13 | 1985-04-13 | 集積回路装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61237498A true JPS61237498A (ja) | 1986-10-22 |
| JPH0311119B2 JPH0311119B2 (de) | 1991-02-15 |
Family
ID=13669389
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60078709A Granted JPS61237498A (ja) | 1985-04-13 | 1985-04-13 | 集積回路装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61237498A (de) |
-
1985
- 1985-04-13 JP JP60078709A patent/JPS61237498A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0311119B2 (de) | 1991-02-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |