JPH03114831A - Impregnation/superposition method and production of laminated sheet - Google Patents

Impregnation/superposition method and production of laminated sheet

Info

Publication number
JPH03114831A
JPH03114831A JP1254804A JP25480489A JPH03114831A JP H03114831 A JPH03114831 A JP H03114831A JP 1254804 A JP1254804 A JP 1254804A JP 25480489 A JP25480489 A JP 25480489A JP H03114831 A JPH03114831 A JP H03114831A
Authority
JP
Japan
Prior art keywords
resin liquid
fibrous base
base materials
resin
compression
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1254804A
Other languages
Japanese (ja)
Inventor
Riichi Otake
利一 大竹
Motoharu Hiruta
蛭田 元治
Hisafumi Sekiguchi
関口 尚史
Munekazu Hayashi
宗和 林
Hitoshi Kato
均 加藤
Satoshi Demura
智 出村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DIC Corp
Original Assignee
Dainippon Ink and Chemicals Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Ink and Chemicals Co Ltd filed Critical Dainippon Ink and Chemicals Co Ltd
Priority to JP1254804A priority Critical patent/JPH03114831A/en
Publication of JPH03114831A publication Critical patent/JPH03114831A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Laminated Bodies (AREA)

Abstract

PURPOSE:To enhance resistance to solder of a laminated sheet by a method wherein, after fibrous base materials are compressed and deaerated, the same is impregnated with a resin liquid while being released from compression in the resin liquid, and thereafter, the fibrous base materials are laminated in the resin liquid. CONSTITUTION:After a plurality of sheets of fibrous base materials 1 are superimposed one on another by guide rolls 2, they are led into an impregnating bath 4 containing a resin liquid while being compressed and deaerated by compression rolls 3 and are released from compression to be separated by guide rolls 2' within the impregnating bath 4 containing the resin liquid to the individual fibrous base materials which are impregnated with the resin liquid. After the individual resin liquid-impregnated base materials are then superimposed one on another and the amount of the resin liquid with which the base materials are impregnated is adjusted by squeezable seal rolls 5 located under a resin liquid level at the side part of the impregnating bath 4 containing the resin liquid, the superimposed fibrous base material is led into ambient air to be laminated with metallic foils or cover films 7 by laminating rolls 6, and by hardening the same under heating, a desirable laminated sheet is obtained. By this method, resistance to solder and insulating properties of the laminated sheet can be enhanced.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明はボイドの発生のない積層板を得るのに好適な繊
維質基材の含浸・重ね合せ方法およびこの方法を用いた
積層板の製法に関するものである。
[Detailed Description of the Invention] [Industrial Application Field] The present invention provides a method for impregnating and laminating fibrous base materials suitable for obtaining a void-free laminate, and a method for producing a laminate using this method. It is related to.

〔従来の技術〕[Conventional technology]

樹脂液を用いて積層板を連続で製造する方法に於いて、
従来長尺の繊維質基材に樹脂を連続的に含浸させて樹脂
含浸基材を得、次いでこれの所定枚数を大気中で重ね合
わせ、更に必要に応じて上下両面に金属箔を貼り合わせ
、加熱成形するという製造方法が提案されている。
In the method of continuously manufacturing laminates using resin liquid,
Conventionally, a long fibrous base material is continuously impregnated with resin to obtain a resin-impregnated base material, and then a predetermined number of these base materials are stacked in the atmosphere, and if necessary, metal foil is attached to both the top and bottom surfaces. A manufacturing method using heat molding has been proposed.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

しかしながら、上記の大気中で樹脂含浸基材を重ね合わ
せる方法では、該基材の重ね合わせ時に空気が捲き込ま
れ易く、得られる積層板中にボイドが発生し、結果とし
て積層板の耐ハンダ性を低下させるという欠点がある。
However, in the above method of laminating resin-impregnated base materials in the atmosphere, air is likely to be drawn in when the base materials are laminated, resulting in voids in the resulting laminate, resulting in poor solder resistance of the laminate. It has the disadvantage of lowering the

〔課題を解決するための手段〕[Means to solve the problem]

本発明者らは、この様な状況を鑑みて鋭意研究した結果
、繊維質基材を圧縮して脱気を行った後、樹脂液中で圧
縮から開放しつつ該繊維質基材中に樹脂液を含浸させ、
次いでその樹脂液中で該繊維質基材の重ね合せを行うと
、繊維質基材への樹脂の含浸性が向上し、且つ該基材の
重ね合せ時の空気の捲き込みが防止でき、積層板中のボ
イドの発生が抑えられ、積層板の耐ハンダ性が大巾に向
上することを見い出し、本発明に到った。
The inventors of the present invention conducted intensive research in view of the above situation, and found that after compressing and deaerating a fibrous base material, the resin was released into the fibrous base material while being released from compression in a resin liquid. Impregnated with liquid,
Next, when the fibrous base materials are laminated in the resin liquid, the impregnating property of the resin into the fibrous base materials is improved, and air entrainment can be prevented when the base materials are laminated. The inventors have discovered that the generation of voids in the board is suppressed and the solder resistance of the laminate is significantly improved, leading to the present invention.

すなわち、本発明は、 繊維質基材を圧縮して脱気を行った後、樹脂液中で圧縮
から開放しつつ該繊維質基材中に樹脂液を含浸させ、次
いで樹脂液中で該繊維質基材を重ね合せることを特徴と
する繊維質基材の含浸・重ね合せ方法、および 繊維質基材を圧縮して脱気を行った後、樹脂液中で圧縮
から開放しつつ該繊維質基材中に樹脂液を含浸させ、次
いで樹脂液中で該繊維質基材を重ね合せた後、加熱硬化
させることを特徴とする積層板の製法 を提供するものである。
That is, in the present invention, after compressing and deaerating a fibrous base material, the fibrous base material is impregnated with a resin liquid while being released from compression in a resin liquid, and then the fibers are soaked in a resin liquid. A method for impregnating and overlapping fibrous base materials, which is characterized by overlapping fibrous base materials, and compressing and deaerating the fibrous base materials, and then releasing the fibrous base materials from compression in a resin solution. The present invention provides a method for manufacturing a laminate, which comprises impregnating a base material with a resin liquid, then superimposing the fibrous base materials in the resin liquid, and then heating and curing the fibrous base materials.

本発明に用いる繊維質基材としては、例えば、クラフト
紙、リンター紙、ガラス布、ガラス不織布などが挙げら
れ、単独又はこれらの組合せて用いる。
Examples of the fibrous base material used in the present invention include kraft paper, linter paper, glass cloth, glass nonwoven fabric, etc., and these can be used alone or in combination.

本発明で用いる樹脂液としては、熱硬化性で、且つ繊維
質基材に含浸可能なものであればよ(、固形の樹脂を溶
剤に溶解させたものや、固形の成分を液中に分散させた
ものであってもよい。例えば、フェノール系樹脂、メラ
ミン系樹脂、エポキシ系樹脂、ポリイミド系樹脂、不飽
和ポリエステル系樹脂、エポキシビニルエステル系樹脂
、ジアリルフタレート系樹脂などを主成分として含む溶
剤含有又は不含の液状樹脂組成物等が挙げられる。
The resin liquid used in the present invention may be one that is thermosetting and can be impregnated into a fibrous base material (such as a solid resin dissolved in a solvent or a solid component dispersed in a liquid). For example, solvents containing phenolic resins, melamine resins, epoxy resins, polyimide resins, unsaturated polyester resins, epoxy vinyl ester resins, diallyl phthalate resins, etc. as main components. Examples include liquid resin compositions containing or not containing it.

なかでも、硬化時に縮合水などの副生物を生成しないエ
ポキシ樹脂や不飽和ポリエステル樹脂、エポキシビニル
エステル樹脂などが好ましく、且つ溶剤(ただし、スチ
レン等の重合性ビニルモノマーを除()不含の組成物で
あると特に好ましい。
Among these, epoxy resins, unsaturated polyester resins, epoxy vinyl ester resins, etc. that do not produce by-products such as condensed water during curing are preferred, and compositions containing no solvents (with the exception of polymerizable vinyl monomers such as styrene) are preferred. It is particularly preferable that it is a material.

これらの樹脂は単独又は組合せて用いる。These resins may be used alone or in combination.

尚、溶剤を希釈剤に用いた場合には、最外層に金属箔や
カバーフィルムが貼り合される前に、基材中の溶剤を除
去しておく必要がある。
In addition, when a solvent is used as a diluent, it is necessary to remove the solvent in the base material before the metal foil or cover film is bonded to the outermost layer.

金属箔としては、例えば長尺の銅箔、アルミニウム箔、
真鍮箔、ステンレス箔、ニッケル箔など。
Examples of metal foil include long copper foil, aluminum foil,
Brass foil, stainless steel foil, nickel foil, etc.

が用いられ、必要に応じ裏面に接着剤が塗布されていて
も良い。
is used, and an adhesive may be applied to the back surface if necessary.

またカバーフィルムとしては、例えばポリエチレンフィ
ルム、ポリプロピレンフィルム、ポリエステルフィルム
、ポリフッ化エチレン系フィルム、ポリイミドフィルム
などが用いられる。
Further, as the cover film, for example, polyethylene film, polypropylene film, polyester film, polyfluoroethylene film, polyimide film, etc. are used.

次に、本発明の含浸・重ね合せ方法の例を図1〜図−3
を用いて具体的に説明する。
Next, examples of the impregnation/superposition method of the present invention are shown in Figures 1 to 3.
This will be explained in detail using .

複数枚の繊維質基材1をガイドロール2で重ね合せた後
、圧縮ロール3で圧縮して脱気しつつ樹脂液含浸槽4内
に導き、次いで圧縮から開放しつつ該樹脂液含浸槽4内
でガイドロール2によりそれぞれの繊維質基材を個々に
分離させながら、その中に樹脂液を含浸させる。この際
、圧縮ロール3を複数個として、長尺基材を1枚づつ圧
縮する方法も可能であるが、圧縮ロール3からの樹脂液
洩れ、樹脂液含浸槽4の容量を出来るだけ小さくできる
などの点で、可能な限り少数の圧縮ロール3で複数の繊
維質基材を同時に圧縮する方法が好ましい。
After stacking a plurality of fibrous base materials 1 with guide rolls 2, they are compressed with compression rolls 3 and guided into the resin liquid impregnating tank 4 while being deaerated, and then released from the compression and guided into the resin liquid impregnating tank 4. The resin liquid is impregnated into each of the fibrous base materials while separating them individually using guide rolls 2. At this time, it is also possible to use a plurality of compression rolls 3 to compress the long base material one by one, but this would prevent the resin liquid from leaking from the compression rolls 3 and reduce the capacity of the resin liquid impregnation tank 4 as much as possible. From this point of view, it is preferable to use a method in which a plurality of fibrous base materials are simultaneously compressed using as few compression rolls 3 as possible.

次いで樹脂液が含浸された含浸基材を、樹脂液含浸槽4
の側部の液面下にあるスクイズ可能なシールロール5で
重ね合せると共に樹脂液含浸量の調整とを行った後、大
気中に導き出し、貼り合せロール6にて金属箔又はカバ
ーフィルム7を貼す合せ、加熱硬化させて(図示せず)
、所望の積層板を得る。この際、含浸基材をシールロー
ル5以外の別のロール(図示せず)を用いて樹脂液中で
重ね合せた後、シールロール5に導いてもよい。
Next, the impregnated base material impregnated with the resin liquid is transferred to the resin liquid impregnation tank 4.
After overlapping with a seal roll 5 that can be squeezed below the liquid level on the side and adjusting the amount of resin liquid impregnated, the resin is brought out into the atmosphere, and a metal foil or cover film 7 is pasted with a lamination roll 6. Combine and heat cure (not shown)
, to obtain the desired laminate. At this time, the impregnated base materials may be overlapped in the resin liquid using a roll (not shown) other than the seal roll 5, and then introduced to the seal roll 5.

また、重ね合せた含浸基材は、必ずしも上記シールロー
ル5で樹脂液含浸量を調整する必要はなく、重ね合せた
後、樹脂液含浸槽4の外のスクイズロール(図示せず)
を通して樹脂液含浸量の調整を行ってもよい。また上記
スクイズ可能なシールロール5を通した後、再度別のス
クイズロール(図示せず)を通して再調整を行うと好ま
しい、加熱硬化は、無圧又は加圧下で行われるが、無圧
加熱硬化と加圧加熱硬化が組合されて行れても良い。
In addition, it is not necessary to adjust the amount of resin liquid impregnation of the superimposed impregnated base materials with the seal roll 5, and after superimposing them, a squeeze roll (not shown) outside the resin liquid impregnation tank 4 is used.
The amount of resin liquid impregnated may be adjusted by Moreover, after passing through the above-mentioned squeezeable seal roll 5, it is preferable to readjust by passing it through another squeeze roll (not shown). Heat curing is performed without pressure or under pressure, but pressureless heat curing is Pressure and heat curing may be combined.

更に、本発明の方法では、図−2のように樹脂液含浸槽
4を密閉型とし、減圧装置8により槽内を減圧状態とす
ると、圧縮ロール3やシールロール5からの樹脂洩れが
少なくなり、且つ樹脂液中に持ち込まれた空気を除去す
るという点から好ましい、この際、減圧度が高すぎると
圧縮ロール3や重ね合せロール5からの空気の流入が生
じたり、樹脂中の低沸点成分が揮散したりするために、
通常は10〜700w+dgの減圧度で行なわれるが、
なかでも50〜550 mmHgが好ましい。また、図
−3のように繊維質基材を予め減圧脱気した後、圧縮し
てもよい。
Furthermore, in the method of the present invention, as shown in Figure 2, the resin liquid impregnation tank 4 is of a closed type, and the inside of the tank is reduced in pressure by the pressure reducing device 8, thereby reducing resin leakage from the compression roll 3 and seal roll 5. , and is preferable from the point of view of removing air brought into the resin liquid.In this case, if the degree of pressure reduction is too high, air may flow in from the compression roll 3 or the stacking roll 5, and low boiling point components in the resin may be removed. In order for the vapor to evaporate,
Usually, it is carried out at a reduced pressure of 10 to 700w + dg,
Among these, 50 to 550 mmHg is preferred. Alternatively, as shown in Figure 3, the fibrous base material may be degassed under reduced pressure in advance and then compressed.

〔実施例〕〔Example〕

次に本発明を図−1および図−4に示した実施例および
比較例により更に具体的に説明する。尚、部は重量部、
%は重量%を示す。
Next, the present invention will be explained in more detail with reference to Examples and Comparative Examples shown in FIGS. 1 and 4. In addition, parts are parts by weight,
% indicates weight %.

実施例1 ビスフェノールAとエピクロルヒドリンとの反応により
得られたエポキシ当量が190なるエポキシ樹脂16.
9部、テトラブロモビスフェノールAとエピクロルヒド
リンとの反応により得られたエポキシ当量が370なる
エポキシ樹脂26.5部、メチルテトラヒドロ無水フタ
ル酸26.6部、ベンジルジメチルアミン0.7部、テ
トラブロモビスフェノールAとエピクロルヒドリンとの
反応により得られたエポキシ当量が370なるエポキシ
樹脂のメタクリレート(60%)とスチレンモノマー(
40%)とより成るエポキシビニルエステル樹脂30部
および「パーへキサ3M」 〔日本油脂a1)製の重合
開始剤30.6部を混合せしめて常温無溶剤液状熱硬化
性樹脂を調製した。このものの粘度は650 cpsで
あり、臭素含有率は20%であった。
Example 1 Epoxy resin 16 having an epoxy equivalent of 190 obtained by the reaction of bisphenol A and epichlorohydrin.
9 parts, 26.5 parts of an epoxy resin with an epoxy equivalent of 370 obtained by the reaction of tetrabromobisphenol A and epichlorohydrin, 26.6 parts of methyltetrahydrophthalic anhydride, 0.7 parts of benzyldimethylamine, tetrabromobisphenol A Methacrylate (60%) of an epoxy resin with an epoxy equivalent of 370 obtained by reaction with epichlorohydrin and styrene monomer (
40%) and 30.6 parts of a polymerization initiator manufactured by "Perhexa 3M" [NOF a1) were mixed to prepare a room temperature solvent-free liquid thermosetting resin. The viscosity of this was 650 cps and the bromine content was 20%.

以下、図−1をもって説明する。厚さ0.18mm、巾
1020anのガラス布からなる4枚の長尺の繊維質基
材1をガイドロール2で重ね合せた後、圧縮ロール3で
圧縮した。上記の常温無溶剤液状熱硬化性樹脂を入れた
樹脂液含浸槽4内に圧縮された繊維質基材1を導き、圧
縮から開放しつつガイドロール2′により繊維質基材を
個々に分離させながら樹脂液を含浸させ、スクイズ可能
なシールロール5で重ね合せつつ、樹脂液含有率42%
になるようにスクイズした。
This will be explained below with reference to Figure 1. Four long fibrous substrates 1 made of glass cloth with a thickness of 0.18 mm and a width of 1020 ann were stacked on each other with a guide roll 2 and then compressed with a compression roll 3. The compressed fibrous base material 1 is guided into the resin liquid impregnation tank 4 containing the above room temperature solvent-free liquid thermosetting resin, and the fibrous base material is individually separated by guide rolls 2' while being released from compression. The resin liquid content is 42% while being impregnated with the resin liquid and overlapped with the seal roll 5 that can be squeezed.
I squeezed it to make it.

次いで35μ醜厚の銅箔7を貼合わせロール6で重ね合
せた含浸基材の上下両面に貼り合せ、温度120°Cの
熱風式加熱炉で3分間予備硬化させた後、170°C,
20Kg/cm”の条件で10分間連続式ダブルベルト
で加熱加圧成形し、裁断した。
Next, copper foil 7 with a thickness of 35 μm was laminated to the upper and lower surfaces of the laminated impregnated substrates using a laminating roll 6, and after precuring for 3 minutes in a hot air heating oven at a temperature of 120°C, the copper foil 7 was heated at 170°C.
It was heated and pressed using a continuous double belt for 10 minutes at a pressure of 20 kg/cm'' and then cut.

次いで、170°Cで60分間無圧下で後硬化させて1
000 X 1000 X O,8mの積層板を得た。
Then, it was post-cured at 170°C for 60 minutes without pressure.
A laminate of 000 x 1000 x O, 8 m was obtained.

得られた積層板についてボイドの発生の有無、プレッシ
ャークツカーテスト(以下、PCTと略す。)後の耐ハ
ンダ性を以下の方法で判定した。結果を表−1に示す。
The resulting laminates were evaluated for the presence or absence of voids and for their solder resistance after a pressure puller test (hereinafter abbreviated as PCT) using the following methods. The results are shown in Table-1.

0ボイド発生の有無:銅箔を塩化第二銅水溶液でエツチ
ングして除去して顕微鏡でボイド発生の有無を判定した
。
0 Presence or absence of void generation: The copper foil was removed by etching with a cupric chloride aqueous solution, and the presence or absence of void generation was determined using a microscope.

OPCT後の耐ハンダ性:片面の銅箔をエツチング除去
したサンプルを120℃、2気圧、4時間の条件でプレ
ッシャークツカー内で吸水させた後、表面の水分を拭き
取り、260°Cのハンダ浴に2分間フロートさせて、
デラミネーションおよびミーズリングの有無を目視測定
した。
Solder resistance after OPCT: After removing the copper foil from one side by etching, the sample was allowed to absorb water in a pressure cooker at 120°C, 2 atm, and for 4 hours, then the moisture on the surface was wiped off, and the sample was placed in a soldering bath at 260°C. Float for 2 minutes,
The presence or absence of delamination and measling was visually measured.

比較例1 図−4に示す様にして、長尺の繊維質基材1を樹脂液含
浸槽4に導き、実施例1と同様の熱硬化性樹脂を含浸さ
せ、次いで大気中を移送して該基材中に残留した空気を
脱気させた後、スクイズロール5′により重ね合せつつ
樹脂液含有率を42%に調整し、以後は実施例1と同様
にて積N板を得、次いで同様にしてボイド発生の有無お
よびPCT後の耐ハンダ性を判定した。結果を表−1に
示す。
Comparative Example 1 As shown in Figure 4, a long fibrous base material 1 was introduced into a resin liquid impregnation tank 4, impregnated with the same thermosetting resin as in Example 1, and then transported through the atmosphere. After degassing the air remaining in the base material, the resin liquid content was adjusted to 42% while being overlapped with a squeeze roll 5', and thereafter a laminated N plate was obtained in the same manner as in Example 1. In the same manner, the presence or absence of void generation and the solder resistance after PCT were determined. The results are shown in Table-1.

表 1 〔発明の効果〕 本発明の含浸・重ね合せ方法で得られた積層板は、従来
のデイツプ方式等の含浸方式で含浸させ、大気中で含浸
基材を重ね合せて得られる積層板に比較し、含浸性が良
好で、重ね合せ時の空気捲き込みがないため、特に耐ハ
ンダ性、絶縁特性に優れるものであって、積層板の連続
製造方法として有用である。
Table 1 [Effects of the Invention] The laminate obtained by the impregnating and laminating method of the present invention is similar to the laminate obtained by impregnating with a conventional dip method or other impregnating method and laminating the impregnated base materials in the atmosphere. In comparison, it has good impregnating properties and there is no air entrainment during stacking, so it has particularly excellent solder resistance and insulation properties, and is useful as a method for continuous production of laminates.

【図面の簡単な説明】[Brief explanation of drawings]

図−1〜図−3は本発明の含浸・重ね合せ方法を示す概
略図、図−4は従来の含浸・重ね合せ方法を示す概略図
である。 1:長尺の繊維質基材、2.2’  ニガイドロール、
3:圧縮ロール、4:樹脂液含浸槽、5ニスクイズ可能
なシールロール、5′ ニスクイズロール、6:貼合せ
ロール、7:金属箔又はカバーフィルム、8:減圧装置
。
FIGS. 1 to 3 are schematic diagrams showing the impregnation/superposition method of the present invention, and FIG. 4 is a schematic diagram showing the conventional impregnation/superposition method. 1: Long fibrous base material, 2.2' Ni guide roll,
3: Compression roll, 4: Resin liquid impregnating tank, 5: Seal roll capable of being squeezed, 5' squeeze roll, 6: Lamination roll, 7: Metal foil or cover film, 8: Decompression device.

Claims (1)

【特許請求の範囲】 1、繊維質基材を圧縮して脱気を行った後、樹脂液中で
圧縮から開放しつつ該繊維質基材中に樹脂液を含浸させ
、次いで樹脂液中で該繊維質基材を重ね合せることを特
徴とする繊維質基材の含浸・重ね合せ方法。 2、樹脂液の含浸を減圧下の樹脂液中で行う請求項1記
載の含浸・重ね合せ方法。 3、複数枚の繊維質基材を重ね合せて圧縮して脱気を行
った後、樹脂液中で圧縮から開放しつつ個々に分離させ
、次いで樹脂液中で再度重ね合せる請求項1又は2記載
の含浸・重ね合せ方法。 4、繊維質基材を圧縮して脱気を行った後、樹脂液中で
圧縮から開放しつつ該繊維質基材中に樹脂液を含浸させ
、次いで樹脂液中で該繊維質基材を重ね合せた後、加熱
硬化させることを特徴とする積層板の製法。 5、樹脂液の含浸を減圧下の樹脂液中で行う請求項4記
載の積層板の製法。 6、複数枚の繊維質基材を重ね合せて圧縮して脱気を行
った後、樹脂液中で圧縮から開放しつつ個々に分離させ
、次いで樹脂液中で再度重ね合せる請求項4又は5記載
の積層板の製法。
[Claims] 1. After compressing and deaerating the fibrous base material, impregnating the fibrous base material with the resin solution while releasing the compression in the resin solution, and then impregnating the fibrous base material with the resin solution in the resin solution. A method for impregnating and overlapping fibrous base materials, which comprises overlapping the fibrous base materials. 2. The impregnation/superposition method according to claim 1, wherein the impregnation with the resin liquid is carried out in the resin liquid under reduced pressure. 3. Claim 1 or 2, in which a plurality of fibrous base materials are piled up, compressed and deaerated, and then separated into individual pieces while being released from compression in a resin liquid, and then piled up again in a resin liquid. The impregnation/superposition method described. 4. After compressing and deaerating the fibrous base material, impregnate the fibrous base material with the resin liquid while releasing the compression in the resin liquid, and then impregnate the fibrous base material in the resin liquid. A method for producing a laminate, which is characterized by heating and curing after stacking. 5. The method for manufacturing a laminate according to claim 4, wherein the impregnation with the resin liquid is carried out in the resin liquid under reduced pressure. 6. Claim 4 or 5, in which a plurality of fibrous base materials are piled up, compressed and deaerated, and then individually separated while being released from compression in a resin liquid, and then piled up again in a resin liquid. Manufacturing method of the described laminate.
JP1254804A 1989-09-29 1989-09-29 Impregnation/superposition method and production of laminated sheet Pending JPH03114831A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1254804A JPH03114831A (en) 1989-09-29 1989-09-29 Impregnation/superposition method and production of laminated sheet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1254804A JPH03114831A (en) 1989-09-29 1989-09-29 Impregnation/superposition method and production of laminated sheet

Publications (1)

Publication Number Publication Date
JPH03114831A true JPH03114831A (en) 1991-05-16

Family

ID=17270122

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1254804A Pending JPH03114831A (en) 1989-09-29 1989-09-29 Impregnation/superposition method and production of laminated sheet

Country Status (1)

Country Link
JP (1) JPH03114831A (en)

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