JPH03120036U - - Google Patents
Info
- Publication number
- JPH03120036U JPH03120036U JP2872690U JP2872690U JPH03120036U JP H03120036 U JPH03120036 U JP H03120036U JP 2872690 U JP2872690 U JP 2872690U JP 2872690 U JP2872690 U JP 2872690U JP H03120036 U JPH03120036 U JP H03120036U
- Authority
- JP
- Japan
- Prior art keywords
- pellet
- wafer ring
- pellets
- semiconductor
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000008188 pellet Substances 0.000 claims description 8
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 239000011295 pitch Substances 0.000 claims 1
- 238000001179 sorption measurement Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Die Bonding (AREA)
Description
第１図は本考案の一実施例を示す半導体ペレツ
トマウント装置の平面図、第２図および第３図は
その主要部の拡大縦断面図、第４図は従来の半導
体ペレツトマウント装置の平面図、第５図は従来
装置の主要部の拡大縦断面図である。
１……半導体ペレツト、４……ウエーハリング
、６……駆動部（スイングアーム）、７……真空
吸着コレツト、８……リードフレーム、１１……
リードフレーム定ピツチ送り用搬送部、１２……
静電型近接センサ。
FIG. 1 is a plan view of a semiconductor pellet mount device showing an embodiment of the present invention, FIGS. 2 and 3 are enlarged longitudinal cross-sectional views of its main parts, and FIG. 4 is a diagram of a conventional semiconductor pellet mount device. The plan view and FIG. 5 are enlarged longitudinal cross-sectional views of the main parts of the conventional device. 1... Semiconductor pellet, 4... Wafer ring, 6... Drive unit (swing arm), 7... Vacuum suction collet, 8... Lead frame, 11...
Conveyance unit for lead frame constant pitch feeding, 12...
Electrostatic proximity sensor.
Claims (1)
この搬送部の上方に上下動自在に、かつ、首振り
運動可能の駆動部の遠心端に配設されたペレツト
貼着手段と、環状の保持枠に多数個のペレツトが
貼着された粘着シートを張設したウエーハリング
を保持するホルダー部を備えた半導体ペレツトの
マウント装置において、 前記ペレツト吸着手段を構成する真空吸着コレ
ツト回動経路の下方に静電型近接センサを配設し
たことを特徴とする半導体ペレツトの吸着ミス検
出装置。[Scope of claim for utility model registration] A conveyor unit that feeds the lead frame in fixed pitches;
A pellet sticking means is disposed above the conveying section at the distal end of the drive section which can move up and down and swing, and an adhesive sheet with a large number of pellets stuck to the annular holding frame. A semiconductor pellet mounting device comprising a holder portion for holding a wafer ring with a wafer ring stretched thereon, characterized in that an electrostatic proximity sensor is disposed below a rotating path of a vacuum suction collector constituting the pellet suction means. Device for detecting adsorption errors for semiconductor pellets.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2872690U JPH03120036U (en) | 1990-03-20 | 1990-03-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2872690U JPH03120036U (en) | 1990-03-20 | 1990-03-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03120036U true JPH03120036U (en) | 1991-12-10 |
Family
ID=31531515
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2872690U Pending JPH03120036U (en) | 1990-03-20 | 1990-03-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03120036U (en) |
-
1990
- 1990-03-20 JP JP2872690U patent/JPH03120036U/ja active Pending
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