JPH0312434U - - Google Patents

Info

Publication number
JPH0312434U
JPH0312434U JP1989071736U JP7173689U JPH0312434U JP H0312434 U JPH0312434 U JP H0312434U JP 1989071736 U JP1989071736 U JP 1989071736U JP 7173689 U JP7173689 U JP 7173689U JP H0312434 U JPH0312434 U JP H0312434U
Authority
JP
Japan
Prior art keywords
metal lead
bonding structure
superimposed
bonded
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989071736U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989071736U priority Critical patent/JPH0312434U/ja
Publication of JPH0312434U publication Critical patent/JPH0312434U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)
JP1989071736U 1989-06-21 1989-06-21 Pending JPH0312434U (cs)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989071736U JPH0312434U (cs) 1989-06-21 1989-06-21

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989071736U JPH0312434U (cs) 1989-06-21 1989-06-21

Publications (1)

Publication Number Publication Date
JPH0312434U true JPH0312434U (cs) 1991-02-07

Family

ID=31609038

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989071736U Pending JPH0312434U (cs) 1989-06-21 1989-06-21

Country Status (1)

Country Link
JP (1) JPH0312434U (cs)

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