JPH03126544A - Manufacture of laminated board - Google Patents
Manufacture of laminated boardInfo
- Publication number
- JPH03126544A JPH03126544A JP26734789A JP26734789A JPH03126544A JP H03126544 A JPH03126544 A JP H03126544A JP 26734789 A JP26734789 A JP 26734789A JP 26734789 A JP26734789 A JP 26734789A JP H03126544 A JPH03126544 A JP H03126544A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- long
- impregnated
- sized
- polyimide resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 9
- 229920001721 polyimide Polymers 0.000 claims abstract description 18
- 239000009719 polyimide resin Substances 0.000 claims abstract description 14
- 239000000463 material Substances 0.000 claims abstract description 13
- 238000000034 method Methods 0.000 claims abstract description 11
- 238000010438 heat treatment Methods 0.000 claims abstract description 9
- 238000010030 laminating Methods 0.000 claims abstract description 8
- 238000001816 cooling Methods 0.000 claims abstract description 7
- 239000011888 foil Substances 0.000 claims abstract description 7
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 238000005520 cutting process Methods 0.000 claims description 4
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 abstract description 9
- 239000011347 resin Substances 0.000 abstract description 8
- 229920005989 resin Polymers 0.000 abstract description 8
- 239000004744 fabric Substances 0.000 abstract description 6
- 239000011521 glass Substances 0.000 abstract description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 4
- 239000004642 Polyimide Substances 0.000 abstract description 4
- 239000000853 adhesive Substances 0.000 abstract description 4
- 230000001070 adhesive effect Effects 0.000 abstract description 4
- 239000011889 copper foil Substances 0.000 abstract description 3
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 abstract description 2
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 abstract 3
- -1 polyacrylic Substances 0.000 description 4
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 238000005470 impregnation Methods 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- 229930194542 Keto Natural products 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- KQNPFQTWMSNSAP-UHFFFAOYSA-N isobutyric acid Chemical compound CC(C)C(O)=O KQNPFQTWMSNSAP-UHFFFAOYSA-N 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は電子機器、電気機器、コンピューター、通信機
器等に用いられる積層板の製造方法に関するものである
。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a method for manufacturing a laminate used in electronic equipment, electrical equipment, computers, communication equipment, etc.
従来、電気機器等に用いられる積層板は樹脂含浸紙、樹
脂含浸ガラス布等と金属箔とからなる積層板金多段プレ
スを用L/%、1〜2時間とbう長時間の加熱加圧成形
によって得られるため、積層板中に成形歪が残留し、積
層板を印刷配線板に加工する際や印刷配線板に電子部品
を実装する際の熱によって反りを発生し、自動化工程に
支障を招来する欠点があった。特に高周波特性を充足す
るためのトリアリルイソシアヌレート変性ポリイミド樹
脂積層板につ(八ではその傾向が大であった。Conventionally, laminates used for electrical equipment, etc. are made using a multi-stage press of laminated sheet metal made of resin-impregnated paper, resin-impregnated glass cloth, etc. and metal foil. L/% is heated and pressed for a long time of 1 to 2 hours. As a result, molding distortion remains in the laminate, causing warping due to the heat generated when processing the laminate into a printed wiring board or mounting electronic components on the printed wiring board, causing problems in automated processes. There was a drawback. This tendency was particularly strong in triallylisocyanurate-modified polyimide resin laminates to satisfy high frequency characteristics (8).
従来の技術で述べたように、多段プレス方式によって得
られる積層板はその加工工程において反りを発生する。As described in the related art section, the laminate obtained by the multi-stage press method warps during the processing process.
本発明は従来の技術における上述の問題点に鑑みてなさ
れたもので、その目的とするところは反り発生のないト
リアリルイソシアヌレート変性ポリイミド樹脂積層板の
製造方法を提供することにある。The present invention has been made in view of the above-mentioned problems in the prior art, and its object is to provide a method for producing a triallylisocyanurate-modified polyimide resin laminate that does not cause warpage.
本発明は所要枚数の長尺トリアリルイソシアヌレート変
性ポリイミド樹脂含浸乾燥基材の上面及び又は下面に長
尺金騙箔を重ね、上下に配設したラミネートロール間を
通しラミネートした長尺帯状積層体を連続的に移行させ
つつ硬化後、所要寸法に切断し、更に熱変形温度以上に
加熱後、熱変形温度以下に冷却することを特徴とする積
層板の製造方法のため加圧することがなくな、るか又は
最少限にすることができ、残留歪をなくすることができ
たもので、以下本発明の詳細な説明する。The present invention is a long strip-shaped laminate in which a required number of long gold foils are stacked on the upper and/or lower surfaces of a dried substrate impregnated with a triallyl isocyanurate-modified polyimide resin, and then passed between laminating rolls disposed above and below and laminated. The laminate manufacturing method is characterized by curing the material while continuously transferring it, cutting it to the required size, heating it above the heat distortion temperature, and then cooling it below the heat distortion temperature, which eliminates the need for pressurization. The present invention will be described below in detail.
本発明にm−る長尺トリアリルイソシアヌレート変性ポ
リイミド樹脂含浸乾燥基材としては、ガラス、アスベス
ト等の無機繊維やポリエステル、ポリアクリル、ポリビ
ニルアルコール、ポリアミド、ポリイミド、ポリフェニ
レンサルファイド。Examples of the long triallyl isocyanurate-modified polyimide resin-impregnated dry substrate used in the present invention include inorganic fibers such as glass and asbestos, polyester, polyacrylic, polyvinyl alcohol, polyamide, polyimide, and polyphenylene sulfide.
ポリウレタン等の有機合成繊維や木綿等の天然繊維から
なる織布、不織布、マット戒は紙又はこれ等の組合せ基
材にポリイミド樹脂100重量部C以下単に部と記す)
に対しトリアリルイソシアヌレ−) 10〜200部、
イミダゾール類、有機過酸化物等の触媒、ジメチルホル
ムアミド、ジオキサン、ジメチルアセテート、メチルエ
チルケトν等の溶媒を加えてなるトリアリルイソVアヌ
レート変性ポリイミド樹脂を乾燥後樹脂量が40〜60
重i%(以下単に係と記す)になるように含浸させたも
ので、樹脂含浸は1次含浸を同系樹脂又は異系樹脂の低
粘度樹脂で行なうことがより均一含浸ができるので好ま
しいことである。ポリイミド樹脂、トリアリルイソシア
ヌレートの種類、分子量につhては特に限定するもので
はない。又樹脂には必要に応じて水酸化アルミニウム、
タルク、シリカ、アルミナ等の充填剤を添加することも
で舎る。更に樹脂はそのまま用すでもよりが好ましくは
減圧脱泡してから用Aることが樹脂含浸布内の気泡発生
を抑える上で望ましいことである。金属箔としては銅、
アルミニウム、鉄、ニーJケル、亜鉛等の単独、合金、
り金箔が用−られ、必要に応じて金属箔の片面に接着剤
層を設けておき、より接着性を向上させることもできる
。ラミネートロールとしては金属製、ゴム類、合成樹脂
製成力は金属ロール表面にゴムや合成樹脂をライニング
したものでもよく任意である。長尺帯状積層体の硬化は
樹脂の種類によって硬化温度、硬化時間を選択すること
ができるが硬化は無圧乃至20KQ/dであることが重
要である。切断後の加熱、冷却については用Aた樹脂の
熱変形温度以上、以下にできるものであれば特に限定し
な−か、冷却につ−では急冷できるものであることが望
ましb0
以下本発明の一実施例を図示5J!施例にもとづ−で説
明すれば次のようである。Woven fabrics, non-woven fabrics, and matte fabrics made of organic synthetic fibers such as polyurethane or natural fibers such as cotton are paper or a combination of these materials and a polyimide resin of 100 parts by weight or less (simply written as parts).
10 to 200 parts of triallyl isocyanurate,
After drying a triallyliso V anulate-modified polyimide resin prepared by adding a catalyst such as imidazoles, organic peroxides, etc., and a solvent such as dimethylformamide, dioxane, dimethyl acetate, methyl ethyl keto ν, etc., the resin amount is 40 to 60.
It is impregnated to give a weight i% (hereinafter simply referred to as %), and it is preferable to perform the primary impregnation with a low-viscosity resin of the same type or a different type because more uniform impregnation can be achieved. be. The types and molecular weights of the polyimide resin and triallyl isocyanurate are not particularly limited. In addition, aluminum hydroxide is added to the resin as necessary.
It is also possible to add fillers such as talc, silica, and alumina. Furthermore, it is preferable to use the resin as it is, preferably after degassing it under reduced pressure, in order to suppress the generation of bubbles in the resin-impregnated cloth. Copper as metal foil,
Aluminum, iron, NiJKEL, zinc, etc. alone, alloys,
Gold foil is used, and if necessary, an adhesive layer can be provided on one side of the metal foil to further improve adhesiveness. The laminating roll may be made of metal, rubber, or synthetic resin, and may be one in which the surface of the metal roll is lined with rubber or synthetic resin. The curing temperature and curing time for curing the long strip-shaped laminate can be selected depending on the type of resin, but it is important that the curing is performed under no pressure or at 20 KQ/d. Heating and cooling after cutting are not particularly limited as long as they can be heated to temperatures above or below the heat deformation temperature of the resin used, but it is preferable that the heating and cooling can be rapidly cooled. Illustrated example of 5J! The explanation will be as follows based on an example.
実施例
第1図は本発明の積層板の製造方法の一1!施例を示す
簡略工程図である。Embodiment FIG. 1 shows part 1 of the method for manufacturing a laminate of the present invention! It is a simplified process diagram showing an example.
第1図に示すように巾1050all、厚さ0.21n
lO長尺ガラス布に、ポリイミド樹脂100部に対しト
リアリルイソシアヌレート100部、2エチル4メチル
イミダゾール0.1部、ジメチルホルムアミド130部
からなるトリアリルイソシアメレート変性ポリイミド樹
脂を乾燥後樹脂量が45壬になるように含浸乾燥した長
尺樹脂含浸乾燥基材1の4枚の上下面に厚さ0.035
flの接着剤付銅箔2の接着剤を樹脂含浸基材と対向さ
せて重ね、上下に配設したラミネートロール3間を通し
ラミネートした長尺帯状積層体4を硬化炉5に送り26
0℃、接触圧で加熱硬化させた。この硬化物の熱変形温
度は240℃であった。次に該硬化物を1000 X
1100(1毎にカーlター6で切断後、加熱炉7で2
50℃に加熱後、冷却炉8で60℃に急冷して厚さ0.
8 flの両面銅張積層板9を得た。As shown in Figure 1, width 1050all, thickness 0.21n
A triallylisocyanurate-modified polyimide resin consisting of 100 parts of polyimide resin, 0.1 part of 2-ethyl-4-methylimidazole, and 130 parts of dimethylformamide was applied to a long glass cloth of 1O, and after drying, the amount of resin was A film with a thickness of 0.035 cm was applied to the top and bottom surfaces of four sheets of the long resin-impregnated dried base material 1, which was impregnated and dried to a thickness of 0.45 mm.
The adhesive of the adhesive-coated copper foil 2 of fl is stacked facing the resin-impregnated base material, and the laminated long strip-shaped laminate 4 is sent to the curing furnace 5 through laminating rolls 3 arranged above and below.
It was cured by heating at 0°C and contact pressure. The heat distortion temperature of this cured product was 240°C. Next, the cured product was heated at 1000
1100 (after cutting with carter 6 every 1, 2 in heating furnace 7
After heating to 50°C, it is rapidly cooled to 60°C in a cooling furnace 8 to a thickness of 0.
A double-sided copper-clad laminate 9 of 8 fl was obtained.
比較例
実施例と同じ長尺トリアリルイソシアヌレート瞠性ポリ
イミド樹脂含浸乾燥基材を1050 X1050朋角に
切断したもの4枚を重ね、更にその上下面に実施例と同
じ鋼箔と上記と同じ寸法に切断したものを配設し260
℃、50KQ/dで120分間加熱加圧して厚さQ、
g WMの両面銅張ff層板を得た。Comparative Example The same long triallylisocyanurate transparent polyimide resin-impregnated dry base material as in the example was cut into 1050 x 1050 square pieces and stacked, and the same steel foil as in the example and the same dimensions as above were placed on the top and bottom surfaces. Arrange the cut pieces at 260
℃, heat and pressurize for 120 minutes at 50KQ/d to obtain thickness Q,
A double-sided copper-clad FF laminate of g WM was obtained.
実施例及び比較例の積層板の性能は第1表のようである
。The performance of the laminates of Examples and Comparative Examples is shown in Table 1.
本発明は上述した如く構成されてbる。特許請求の範囲
に記載した構成を有する積層板の製造方法におりては反
りの少な一積層板が得られる効果がある。The present invention is constructed as described above. The method for manufacturing a laminate having the structure described in the claims has the effect of producing a laminate with less warpage.
第1図は本発明の積層板の製造方法の一実施例を示す簡
略工程図である。
1は長尺樹脂含浸乾燥基材、2は銅箔、3はラミネート
ロール、4は長尺帯状積層体、5は硬化炉、6はカッタ
ー 7は加熱炉、8は冷却炉、9は積層板である。FIG. 1 is a simplified process diagram showing an embodiment of the method for manufacturing a laminate according to the present invention. 1 is a long resin-impregnated dry base material, 2 is a copper foil, 3 is a laminating roll, 4 is a long strip-shaped laminate, 5 is a curing furnace, 6 is a cutter, 7 is a heating furnace, 8 is a cooling furnace, 9 is a laminate board It is.
Claims (1)
ポリイミド樹脂含浸乾燥基材の上面及び又は下面に長尺
金属箔を重ね、上下に配設したラミネートロール間を通
しラミネートした長尺帯状積層体を連続的に移行させつ
つ硬化後、所要寸法に切断し、更に熱変形温度以上に加
熱後、熱変形温度以下に冷却することを特徴とする積層
板の製造方法。(1) A long strip-shaped laminate made by stacking the required number of long metal foils on the upper and/or lower surfaces of a dried base material impregnated with a long triallyl isocyamelate-modified polyimide resin and laminating the sheets through laminating rolls arranged above and below. 1. A method for manufacturing a laminate, which comprises curing the laminate while continuously transferring the material, cutting into required dimensions, further heating above the heat distortion temperature, and cooling below the heat distortion temperature.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26734789A JPH03126544A (en) | 1989-10-12 | 1989-10-12 | Manufacture of laminated board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26734789A JPH03126544A (en) | 1989-10-12 | 1989-10-12 | Manufacture of laminated board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03126544A true JPH03126544A (en) | 1991-05-29 |
Family
ID=17443551
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26734789A Pending JPH03126544A (en) | 1989-10-12 | 1989-10-12 | Manufacture of laminated board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03126544A (en) |
-
1989
- 1989-10-12 JP JP26734789A patent/JPH03126544A/en active Pending
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