JPH0314060U - - Google Patents
Info
- Publication number
- JPH0314060U JPH0314060U JP7121489U JP7121489U JPH0314060U JP H0314060 U JPH0314060 U JP H0314060U JP 7121489 U JP7121489 U JP 7121489U JP 7121489 U JP7121489 U JP 7121489U JP H0314060 U JPH0314060 U JP H0314060U
- Authority
- JP
- Japan
- Prior art keywords
- jet
- solder melt
- circuit board
- printed circuit
- tank
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 claims description 25
- 238000005476 soldering Methods 0.000 claims description 12
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図ａ，ｂはこの考案の一実施例を示すもの
で、第１図ａは側断面図、第１図ｂは、第１図ａ
の平面図、第２図はこの考案の他の実施例を示す
側断面図、第３図はこの考案のさらに他の実施例
を示す側断面図、第４図は従来のはんだ付け装置
の一例を示す側断面図である。
図中、１はプリント基板、４ははんだ融液、４
ａは噴流はんだ、４ｂは酸化物、１１ははんだ付
け装置、１２は外槽、１５は噴流槽、２１は噴流
口、２２は噴出口、２６は側板、２６ａは切欠部
である。
Figures 1a and 1b show an embodiment of this invention, with Figure 1a being a side sectional view and Figure 1b being Figure 1a.
FIG. 2 is a side sectional view showing another embodiment of this invention, FIG. 3 is a side sectional view showing still another embodiment of this invention, and FIG. 4 is an example of a conventional soldering device. FIG. In the figure, 1 is a printed circuit board, 4 is solder melt, 4
4b is a solder jet, 4b is an oxide, 11 is a soldering device, 12 is an outer tank, 15 is a jet tank, 21 is a jet port, 22 is a jet port, 26 is a side plate, and 26a is a notch.
補正 平２．７．６
考案の名称を次のように補正する。
考案の名称 はんだ付け装置
実用新案登録請求の範囲、図面の簡単な説明を
次のように補正する。Amendment 2.7.6 The name of the invention is amended as follows. Title of the invention: Soldering device The scope of the claims for utility model registration and the brief description of the drawings are amended as follows.
【実用新案登録請求の範囲】(1)
はんだ融液を噴出させてプリント基板には
んだ付けを行う噴流槽を備えたはんだ付け装置に
おいて、前記プリント基板の走行方向に対して前
方部分に前記噴流槽内のはんだ融液を噴出する噴
流口を前記噴流槽に設け、この噴流口から噴流す
るはんだ融液を前記プリント基板の走行方向と反
対方向へ流動させる側板を前記噴流槽に設け、前
記プリント基板の走行方向に対して後方部分に前
記噴流槽内のはんだ融液を噴出する噴出口を前記
噴流槽に設け、さらに前記噴流口から前記プリン
ト基板の走行方向と反対方向へ流動するはんだ融
液と、前記噴出口から噴出するはんだ融液とが合
流する部分に滞留するはんだ融液の酸化物を前記
プリント基板の走行方向に対して側方へ流出させ
る切欠部を前記側板に形成したことを特徴とする
はんだ付け装置。(2) はんだ融液を噴流して噴流はんだを形成す
る第１の噴流槽を設け、次段に、請求項(1)記載
のはんだ付け装置の噴流槽を第２の噴流槽として
設けたことを特徴とするはんだ付け装置。 (3) 切欠部を側板に形成した噴流槽の噴流口か
ら噴流する噴流はんだの流速を調整して設定する
調整手段を設けたものである請求項(1)または(2)
記載のはんだ付け装置。 [Claims for Utility Model Registration] (1) In a soldering device equipped with a jet tank for spouting solder melt to solder a printed circuit board, the jet flows in a forward portion with respect to the running direction of the printed circuit board. The jet tank is provided with a jet port that spouts out the solder melt in the tank, and the jet tank is provided with a side plate that allows the solder melt jetted from the jet port to flow in a direction opposite to the running direction of the printed circuit board. The jet tank is provided with a spout for spouting the solder melt in the jet tank at a rear portion with respect to the running direction of the board, and the solder melt flows from the jet jet in a direction opposite to the running direction of the printed circuit board. and a notch is formed in the side plate to allow the oxides of the solder melt remaining in the part where the solder melt spouted from the spout to flow out laterally with respect to the running direction of the printed circuit board. Features soldering equipment. (2) A first jet tank is provided in which a solder melt is jetted to form a solder jet, and the jet tank of the soldering device according to claim (1) is provided as a second jet tank. A soldering device featuring: (3) Claim (1) or (2) which is provided with an adjusting means for adjusting and setting the flow velocity of the jet solder jetted from the jet port of the jet tank having a notch formed in the side plate.
The soldering equipment described.
【図面の簡単な説明】
第１図ａ，ｂはこの考案の一実施例を示すもの
で、第１図ａは側断面図、第１図ｂは、第１図ａ
の平面図、第２図はこの考案の他の実施例を示す
側断面図、第３図はこの考案のさらに他の実施例
を示す側断面図、第４図は従来のはんだ付け装置
の一例を示す側断面図である。
図中、１はプリント基板、４ははんだ融液、４
ａは噴流はんだ、４ｂは酸化物、１１ははんだ付
け装置、１２は外槽、１５は噴流槽、２１は噴流
口、２２は噴出口、２６は側板、２６ａは切欠部
である。[BRIEF DESCRIPTION OF THE DRAWINGS] Figures 1a and 1b show an embodiment of this invention; Figure 1a is a side sectional view, and Figure 1b is a side sectional view of Figure 1a.
FIG. 2 is a side sectional view showing another embodiment of this invention, FIG. 3 is a side sectional view showing still another embodiment of this invention, and FIG. 4 is an example of a conventional soldering device. FIG. In the figure, 1 is a printed circuit board, 4 is solder melt, 4
4b is a solder jet, 4b is an oxide, 11 is a soldering device, 12 is an outer tank, 15 is a jet tank, 21 is a jet port, 22 is a jet port, 26 is a side plate, and 26a is a notch.
Claims (1)
付けを行う噴流槽を備えたはんだ付け装置におい
て、前記プリント基板の走行方向に対して前方部
分に前記噴流槽内のはんだ融液を噴出する噴流口
を前記噴流槽に設け、この噴流口から噴流するは
んだ融液を前記プリント基板の走行方向と反対方
向へ流動させる側板を前記噴流槽に設け、前記プ
リント基板の走行方向に対して後方部分に前記噴
流槽内のはんだ融液を噴出する噴出口を前記噴流
層に設け、さらに前記噴流口から前記プリント基
板の走行方向と反対方向へ流動するはんだ融液と
、前記噴出口から噴出するはんだ融液とが合流す
る部分に滞留するはんだ融液の酸化物を前記プリ
ント基板の走行方向に対して側方へ流出させる切
欠部を前記側板に形成したことを特徴とするはん
だ付け装置。 In a soldering device equipped with a jet tank for spouting solder melt to solder a printed circuit board, a jet port for spouting the solder melt in the jet tank is provided at a front portion with respect to the traveling direction of the printed circuit board. The jet tank is provided with a side plate that causes the solder melt jetted from the jet port to flow in a direction opposite to the running direction of the printed circuit board, and the jet tank is provided with a side plate that causes the solder melt jetted from the jet port to flow in a direction opposite to the running direction of the printed circuit board. A spout for spouting the solder melt in the tank is provided in the spout layer, and the solder melt flows from the spout in a direction opposite to the running direction of the printed circuit board, and the solder melt spouts from the spout. A soldering device characterized in that a notch is formed in the side plate to cause oxides of the solder melt that remain in the portion where the solder melt flows out laterally with respect to the running direction of the printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7121489U JPH0451022Y2 (en) | 1989-06-20 | 1989-06-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7121489U JPH0451022Y2 (en) | 1989-06-20 | 1989-06-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0314060U true JPH0314060U (en) | 1991-02-13 |
| JPH0451022Y2 JPH0451022Y2 (en) | 1992-12-01 |
Family
ID=31608045
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7121489U Expired JPH0451022Y2 (en) | 1989-06-20 | 1989-06-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0451022Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015104733A (en) * | 2013-11-28 | 2015-06-08 | 千住金属工業株式会社 | Jet nozzle and jet device |
-
1989
- 1989-06-20 JP JP7121489U patent/JPH0451022Y2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015104733A (en) * | 2013-11-28 | 2015-06-08 | 千住金属工業株式会社 | Jet nozzle and jet device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0451022Y2 (en) | 1992-12-01 |
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