JPH0314332Y2 - - Google Patents
Info
- Publication number
- JPH0314332Y2 JPH0314332Y2 JP1986133232U JP13323286U JPH0314332Y2 JP H0314332 Y2 JPH0314332 Y2 JP H0314332Y2 JP 1986133232 U JP1986133232 U JP 1986133232U JP 13323286 U JP13323286 U JP 13323286U JP H0314332 Y2 JPH0314332 Y2 JP H0314332Y2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- resin
- cull
- pot
- lower mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986133232U JPH0314332Y2 (bs) | 1986-08-29 | 1986-08-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986133232U JPH0314332Y2 (bs) | 1986-08-29 | 1986-08-29 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6339524U JPS6339524U (bs) | 1988-03-14 |
| JPH0314332Y2 true JPH0314332Y2 (bs) | 1991-03-29 |
Family
ID=31033356
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986133232U Expired JPH0314332Y2 (bs) | 1986-08-29 | 1986-08-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0314332Y2 (bs) |
-
1986
- 1986-08-29 JP JP1986133232U patent/JPH0314332Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6339524U (bs) | 1988-03-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6444157B1 (en) | Method of resin molding | |
| US5204122A (en) | Mold for use in resin encapsulation molding | |
| JPH03202327A (ja) | 樹脂成形用金型面のクリーニング方法とこの方法に用いられるクリーニング用シート部材及び連続自動樹脂成形方法 | |
| JPS622456B2 (bs) | ||
| JP2626971B2 (ja) | 電子部品の樹脂封止成形方法及び金型 | |
| US6682952B2 (en) | Method of forming the resin sealed semiconductor device using the lead frame | |
| JP2581113B2 (ja) | 半導体装置のモールド方法および装置 | |
| JP2857075B2 (ja) | 半導体パッケージの製造方法と、これに用いられるフィルムおよび金型 | |
| JP3139860B2 (ja) | 樹脂モールド装置 | |
| JPH0237856B2 (bs) | ||
| JPH06177191A (ja) | 樹脂モールド装置 | |
| JP2675417B2 (ja) | マトリクスフレームのディゲート方法 | |
| JP2666630B2 (ja) | 半導体装置の製造方法 | |
| JP2597010B2 (ja) | モールド用金型 | |
| JPH0430182B2 (bs) | ||
| JPH0213141Y2 (bs) | ||
| JPH0637129A (ja) | モールド金型、リードフレーム及び半導体装置の製造方法 | |
| JPH06166050A (ja) | 樹脂モールド装置 | |
| JPH0644105Y2 (ja) | 樹脂モ−ルド型半導体装置のリ−ドフレ−ム | |
| US6911719B1 (en) | Lead frame for resin sealed semiconductor device | |
| JPH0482236A (ja) | 電子部品の樹脂封止成形方法及び装置 | |
| JPH043770Y2 (bs) | ||
| JP2736554B2 (ja) | 樹脂封止成形方法及び樹脂注入ゲートの構成方法 | |
| JPH06204384A (ja) | 半導体用リードフレーム | |
| JPS59201429A (ja) | 半導体樹脂封止装置 |