JPH031440U - - Google Patents

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Publication number
JPH031440U
JPH031440U JP1989059574U JP5957489U JPH031440U JP H031440 U JPH031440 U JP H031440U JP 1989059574 U JP1989059574 U JP 1989059574U JP 5957489 U JP5957489 U JP 5957489U JP H031440 U JPH031440 U JP H031440U
Authority
JP
Japan
Prior art keywords
substrate
holes
semiconductor package
conductive circuit
band
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1989059574U
Other languages
English (en)
Other versions
JPH0727631Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989059574U priority Critical patent/JPH0727631Y2/ja
Publication of JPH031440U publication Critical patent/JPH031440U/ja
Application granted granted Critical
Publication of JPH0727631Y2 publication Critical patent/JPH0727631Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Packaging Frangible Articles (AREA)

Description

【図面の簡単な説明】
第１図は本考案の半導体パツケージ構造体の一
実施例を示す平面図、第２図および第３図はそれ
ぞれ第１図に示す実施例の正面図および右側面図
、第４図は実施例における帯状の凹溝の形成方法
を説明するための断面図、第５図および第６図は
それぞれ従来の半導体パツケージ構造体を示す平
面図および正面図、第７図は半導体パツケージ構
造体への半導体チツプの実装方法を示す要部断面
図、第８図は従来の基板と枠体との接着方法を示
す断面図である。 １１……基板、１２……導電回路、１３……ス
ルーホール、１５……枠体、１６……凹溝、１７
……成形型、１８……突起部分。

Claims (1)

    【実用新案登録請求の範囲】
  1. 表面に導電回路が形成され、かつ側部が端面に
    開口した複数のスルーホールを有する基板と、前
    記基板の上に、前記スルーホールが穿設されない
    側の両端面をそれぞれ包被するように重ねられ成
    形一体化された、中央に窓部が形成され、かつ裏
    面の前記スルーホールに対向する部分にそれぞれ
    帯状の凹溝が形成された樹脂製の枠体とからなる
    ことを特徴とする半導体パツケージ構造体。
JP1989059574U 1989-05-23 1989-05-23 半導体パッケージ構造体 Expired - Lifetime JPH0727631Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989059574U JPH0727631Y2 (ja) 1989-05-23 1989-05-23 半導体パッケージ構造体

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989059574U JPH0727631Y2 (ja) 1989-05-23 1989-05-23 半導体パッケージ構造体

Publications (2)

Publication Number Publication Date
JPH031440U true JPH031440U (ja) 1991-01-09
JPH0727631Y2 JPH0727631Y2 (ja) 1995-06-21

Family

ID=31586188

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989059574U Expired - Lifetime JPH0727631Y2 (ja) 1989-05-23 1989-05-23 半導体パッケージ構造体

Country Status (1)

Country Link
JP (1) JPH0727631Y2 (ja)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS628672U (ja) * 1985-07-02 1987-01-19
JPS63142659A (ja) * 1986-12-04 1988-06-15 Oki Electric Ind Co Ltd 半導体装置の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS628672U (ja) * 1985-07-02 1987-01-19
JPS63142659A (ja) * 1986-12-04 1988-06-15 Oki Electric Ind Co Ltd 半導体装置の製造方法

Also Published As

Publication number Publication date
JPH0727631Y2 (ja) 1995-06-21

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