JPS646038U - - Google Patents

Info

Publication number
JPS646038U
JPS646038U JP1987100847U JP10084787U JPS646038U JP S646038 U JPS646038 U JP S646038U JP 1987100847 U JP1987100847 U JP 1987100847U JP 10084787 U JP10084787 U JP 10084787U JP S646038 U JPS646038 U JP S646038U
Authority
JP
Japan
Prior art keywords
wire bonding
conductive pattern
chip
chip mount
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987100847U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987100847U priority Critical patent/JPS646038U/ja
Publication of JPS646038U publication Critical patent/JPS646038U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案に係る半導体素子の一実施例を
示すパツケージ樹脂除去状態の正面図、第２図は
同断面図、第３図は従来例を示す斜視図である。 １……絶縁基板、２……チツプマウント部、３
……ワイヤボンデイング部、４Ａ及び４Ｂ……外
部接続部、５Ａ及び５Ｂ……連絡部、６……半導
体チツプ、７……金線、８……樹脂パツケージ。

Claims (1)

    【実用新案登録請求の範囲】
  1. 絶縁基板に、チツプマウント部、ワイヤボンデ
    イング部、外部接続部、連絡部を有するように導
    電パターンを形成し、そのチツプマウント部に半
    導体チツプを搭載して、その電極部と前記ワイヤ
    ボンデイング部の間をワイヤボンデイングによつ
    て接続し、前記半導体チツプなどの周りに樹脂モ
    ールドによりパツケージを形成するようにしたミ
    ニサイズの半導体素子において、前記導電パター
    ンにおける外部接続部とチツプマウント部、ワイ
    ヤボンデイング部との間を結ぶ連絡部をチツプマ
    ウント部、ワイヤボンデイング部の周辺に回廊状
    に形成したことを特徴とする半導体素子。
JP1987100847U 1987-06-30 1987-06-30 Pending JPS646038U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987100847U JPS646038U (ja) 1987-06-30 1987-06-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987100847U JPS646038U (ja) 1987-06-30 1987-06-30

Publications (1)

Publication Number Publication Date
JPS646038U true JPS646038U (ja) 1989-01-13

Family

ID=31329295

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987100847U Pending JPS646038U (ja) 1987-06-30 1987-06-30

Country Status (1)

Country Link
JP (1) JPS646038U (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0922961A (ja) * 1995-07-06 1997-01-21 Nec Corp Ｂｇａ型半導体装置
JP2007059837A (ja) * 2005-08-26 2007-03-08 Stanley Electric Co Ltd 表面実装型ｌｅｄ

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0922961A (ja) * 1995-07-06 1997-01-21 Nec Corp Ｂｇａ型半導体装置
JP2007059837A (ja) * 2005-08-26 2007-03-08 Stanley Electric Co Ltd 表面実装型ｌｅｄ

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