JPS6441145U - - Google Patents

Info

Publication number
JPS6441145U
JPS6441145U JP1987136177U JP13617787U JPS6441145U JP S6441145 U JPS6441145 U JP S6441145U JP 1987136177 U JP1987136177 U JP 1987136177U JP 13617787 U JP13617787 U JP 13617787U JP S6441145 U JPS6441145 U JP S6441145U
Authority
JP
Japan
Prior art keywords
lead
pair
positioning
positioning lead
notches
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1987136177U
Other languages
English (en)
Other versions
JPH0739241Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987136177U priority Critical patent/JPH0739241Y2/ja
Publication of JPS6441145U publication Critical patent/JPS6441145U/ja
Application granted granted Critical
Publication of JPH0739241Y2 publication Critical patent/JPH0739241Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】
第１図は本考案による樹脂封止型半導体装置用
リードフレームの位置決めリードの裏面を拡大し
て示す部分的斜視図、第２図はこのリードフレー
ムの平面図、第３図は第２図の―線に沿う断
面図、第４図はこのリードフレームに封止樹脂体
を形成した状態を示す斜視図、第５図は従来の樹
脂封止型半導体装置用リードフレームの平面図で
、第６図は第５図の―線に沿う断面図である
。 １……支持板、２，４……外部リード、３……
位置決めリード、２０……リードフレーム、２１
……小断面積部、３ａ……主面、３ｂ，３ｃ……
縁部、２２，２３……切欠部、２４……孔、２５
……溝、２６……溝。

Claims (1)

    【実用新案登録請求の範囲】
  1. 放熱板を兼ねる複数の支持板と、該支持板の各
    々の一端から導出された外部リードと、前記支持
    板の他端から導出された位置決めリードとを有し
    、該位置決めリードには引張りによる破断が可能
    な小断面積部が形成された樹脂封止型半導体装置
    用リードフレームにおいて、前記小断面積部は、
    前記位置決めリードの対向する両縁部に設けられ
    た一対の切欠部と、該一対の切欠部が対面する領
    域において、前記位置決めリードの厚さ方向に貫
    通した孔と、該孔の端部と前記一対の切欠部間を
    連絡して前記位置決めリードの少なくとも一方の
    主面側に形成された溝とを有することを特徴とす
    る樹脂封止型半導体装置用リードフレーム。
JP1987136177U 1987-09-08 1987-09-08 樹脂封止型半導体装置用リードフレーム Expired - Lifetime JPH0739241Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987136177U JPH0739241Y2 (ja) 1987-09-08 1987-09-08 樹脂封止型半導体装置用リードフレーム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987136177U JPH0739241Y2 (ja) 1987-09-08 1987-09-08 樹脂封止型半導体装置用リードフレーム

Publications (2)

Publication Number Publication Date
JPS6441145U true JPS6441145U (ja) 1989-03-13
JPH0739241Y2 JPH0739241Y2 (ja) 1995-09-06

Family

ID=31396440

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987136177U Expired - Lifetime JPH0739241Y2 (ja) 1987-09-08 1987-09-08 樹脂封止型半導体装置用リードフレーム

Country Status (1)

Country Link
JP (1) JPH0739241Y2 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04162550A (ja) * 1990-10-26 1992-06-08 Nec Corp 樹脂封止型半導体装置およびその製造方法
JPH0547975A (ja) * 1990-09-25 1993-02-26 Sanyo Electric Co Ltd リードフレームおよび表面実装型半導体装置
JP2012247336A (ja) * 2011-05-30 2012-12-13 Seiko Epson Corp 物理量検出器の製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5653556U (ja) * 1979-10-01 1981-05-11
JPS6156420A (ja) * 1984-07-31 1986-03-22 Sanken Electric Co Ltd 樹脂封止形半導体装置の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5653556U (ja) * 1979-10-01 1981-05-11
JPS6156420A (ja) * 1984-07-31 1986-03-22 Sanken Electric Co Ltd 樹脂封止形半導体装置の製造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0547975A (ja) * 1990-09-25 1993-02-26 Sanyo Electric Co Ltd リードフレームおよび表面実装型半導体装置
JPH04162550A (ja) * 1990-10-26 1992-06-08 Nec Corp 樹脂封止型半導体装置およびその製造方法
JP2012247336A (ja) * 2011-05-30 2012-12-13 Seiko Epson Corp 物理量検出器の製造方法
US9188600B2 (en) 2011-05-30 2015-11-17 Seiko Epson Corporation Method for manufacturing physical quantity detector, and physical quantity detector

Also Published As

Publication number Publication date
JPH0739241Y2 (ja) 1995-09-06

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