JPH0316159Y2 - - Google Patents

Description

[Detailed description of the invention] [Technical field of the invention] This invention relates to a connection structure between a memory pack and a small electronic device.

[Technical background of the invention and its problems] As a small electronic device loaded with a memory pack and used, it is possible to input words in the language of one country (e.g. Japanese) and input words in the language of another country (e.g. There are small electronic translators that translate words with the same meaning in English. With this small electronic translator,
Translation is performed by loading a word memory pack that stores word information of the language to be translated into the main body of the device, and by exchanging this memory pack, the language of the country to be translated can be changed.

Memory packs used in small electronic devices such as the above-mentioned small electronic translators have a storage element, such as a large-scale integrated circuit chip, built-in inside the case.
A plurality of terminal electrodes connected to each electrode of the memory element are exposed outside the case, and each terminal electrode is formed on the outer surface of the case, or inside the case through an opening provided in the case. It is installed so that it is exposed outside the case.

On the other hand, a small electronic device that is used with a memory pack loaded therein is provided with a memory pack storage section, and within this memory pack storage section, a plurality of memories are stored in correspondence with each terminal electrode of the memory pack. A terminal electrode for pack connection is provided.

The memory pack is stored in a memory pack storage part of a small electronic device and loaded into the small electronic device. When the memory pack is stored in the memory pack storage part, each terminal electrode of the memory pack contacts an elastic contact piece. It is electrically connected to each electrode terminal in the memory pack storage section through the memory pack storage section. Generally, a leaf spring is used as the elastic contact piece, and the elastic contact piece made of the leaf spring is attached to each terminal electrode in the memory pack housing or on each terminal electrode of the memory pack. .

However, as described above, in the conventional connection structure between a memory pack and a small electronic device, in which the terminal electrode of the memory pack and the terminal electrode of the small electronic device are electrically connected via an elastic contact piece made of a leaf spring, If a small electronic device is subjected to a shock (such as when the device is hit or placed on a desk) while it is in use, the elastic contact piece made of a leaf spring will break between the memory pack and the terminal electrode of the small electronic device. There has been a problem in that the elastic contact piece vibrates within a range of 1 to 30 degrees, causing the elastic contact piece to come into contact with and separate from the terminal electrode, resulting in abnormal operation of the small electronic device.

[Purpose of invention]

This idea was created in view of the above-mentioned circumstances, and its purpose is to prevent the terminal electrodes of small electronic devices and memory packs from coming into contact with each other due to impact. An object of the present invention is to provide a connection structure between a memory pack and a small electronic device, which can prevent abnormal operation of the small electronic device due to shock by making contact with the device.

[Summary of the idea]

That is, this invention engages the locking pawl of the pack fixing plate, which is slidably attached to the exterior panel of the memory pack, into the groove-shaped locking part provided on the side of the memory pack storage part of the small electronic device. Accordingly, the terminal electrodes of the memory pack and the terminal electrodes placed inside the memory pack housing of the small electronic device are connected by pressure-welding and clamping the interconnector interposed between both terminal electrodes. If an interconnector is used to electrically connect the terminal electrodes of the memory pack and the small electronic device, and the interconnector is sandwiched between the two terminal electrodes,
Since the interconnector does not separate from the terminal electrode even if a shock is applied to the small electronic device, malfunction of the small electronic device due to the shock can be prevented.

[Example of idea]

Hereinafter, one embodiment of this invention will be described with reference to the drawings, taking as an example the connection structure of a memory pack in a small electronic translator.

Figure 1 shows the connection structure between memory pack A and small electronic translator B, and Figures 2 to 5 show memory pack A used by being loaded into small electronic translator B. .

First, the structure of memory pack A will be explained. The case of memory pack A has the following structure. That is, Figures 2 to 5
In the figure, reference numeral 1 denotes a resin frame in the form of a rectangular frame made of synthetic resin.A stepped portion 1a is formed around the upper part of the frame, and a groove 1a is formed inside the stepped portion 1a at the lower part. It is formed. Note that there is a terminal hole 2 at one end of the resin frame 1 that passes through it vertically.
are formed, and wedge-shaped stoppers 3, 3 protruding outward are formed at the center portions of both sides. Reference numeral 4 denotes an upper panel made of a metal plate, and the upper panel 4 has a rectangular plate shape with a peripheral wall 4a around its lower part, and a terminal hole 5 is opened at one end thereof. This upper panel 4 is provided to cover the resin frame 1, and is fixed to the resin frame 1 by fitting the peripheral wall portion 4a into the stepped portion 1a, for example, by adhesive. Note that an insulating sheet 6 is interposed between the resin frame 1 and the upper panel 4. On the other hand, 7 is a lower panel made of a metal plate, and this lower panel 7 has a peripheral wall portion 7 around the upper part.
It is in the shape of a rectangular plate having a diameter of 1.a, and locking claws 8, 8 are formed at the other end. This lower panel 7 is provided to cover under the resin frame 1, and the peripheral wall 7a is fitted into the groove 1b, and the locking claws 8 are connected to the locking portions (not shown) formed on the resin frame 1. It is locked and attached to the resin frame 1. The lower panel 7 is fixed to the resin frame 1 by passing screws 10, 10 through mounting holes 9, 9 formed therein and screw holes (not shown) formed in the resin frame 1.
Further, reference numeral 12 denotes a compression coil spring fitted into a through hole 11 formed in the resin frame 1, and this coil spring 12 causes the upper surface panel 4 and the lower surface panel 7 to
By establishing electrical continuity between the resin frame 1 and the resin frame 1, an electrostatic shield is provided to the memory element and the circuit board disposed within the resin frame 1.

As described above, the case of memory pack A is composed of a resin frame 1, an upper panel 4, and a lower panel 7. Therefore, unlike conventional cases where the entire case is made of synthetic resin, there is no need to increase the wall thickness to increase mechanical strength, and the thickness of the resin frame 1 (high Since case A only needs to have a size that can accommodate the memory element and circuit board, the overall thickness of case A is much thinner than conventional resin cases.

On the other hand, inside the case, there are housed a circuit board 13 on which a circuit pattern is formed, and memory elements 14, 14 made up of large-scale integrated circuit chips that store word information in the language of a predetermined country. The memory elements 14, 14 are connected to the circuit board 13 by connecting their respective lead terminals 15... to the circuit pattern on the circuit board 13.
In addition, the portion of the circuit board 13 facing the terminal hole 5 on the top surface of the case A is connected to each electrode (lead terminal 15...) of the memory elements 14, 14 via a circuit pattern. A plurality of terminal electrodes 16 are formed in an array.

Reference numeral 17 denotes an interconnector superimposed on the terminal electrode array portion of the circuit board 13. As is well known, the interconnector 17 is made by alternately laminating insulating rubber and conductive rubber, and is held between a pair of connector holders 18, 18. This interconnector 17 is
The terminal holes 2 and 5 formed in the resin frame 1 and the upper panel 4 of the case are penetrated to connect the lower surface of the connector to the terminal electrodes 16 on the circuit board 13, and the upper part of the connector projects to the outside of the case. It is held in the terminal holes 2 and 5 in this state.

Note that the circuit board 13 is fixed to the resin frame 1 with screws 10, 10.

Further, 19 is a pack fixing plate provided outside the memory pack A. This pack fixing plate 19
is made of a metal plate with both side edges bent upward. These rising walls 19a on both sides,
19a has locking claws 20, 20 and long holes 21, 21.
are formed respectively, and a positioning pawl 22 is formed at the center of one end of the pack fixing plate 19. Incidentally, long holes 23, 23 are formed in the pack fixing plate 19 to provide relief for the screws 10, 10. This pack fixing plate 19 is placed overlapping the lower surface of the lower panel 7 of the memory pack A, and is fitted into the memory pack A so that the resin frame 1 is held from both sides by the rising walls 19a, 19a on both sides. The pack fixing plate 19 is supported by the stoppers 3, 3 formed on both sides of the resin frame 1 by inserting the stoppers 3, 3 formed on both sides of the resin frame 1 into the elongated holes 21, 21 of the rising walls 19a, 19a. The memory pack A is provided so as to be slidable in the longitudinal direction of the memory pack A until the ends of the elongated holes 21, 21 come into contact with the stopper 3.

Memory pack A configured in this way has the first
As shown in the figure, it is loaded into a small electronic translator B. To explain the configuration of this small electronic translator,
In Figure 1, 24 is the main body case of the translator, 2
5 is a back cover made of a metal plate that is combined with the main body case 24, 26 is a circuit board provided inside the main body case 24, and 27 is a circuit board 26 inside the main body case 24.
This is a board holder made of synthetic resin that is stacked on the underside of the board. A memory pack storage part 28 having a rectangular shape corresponding to the outer shape of the memory pack case is formed vertically through the board holder 27, and a riser of the pack fixing plate 19 is formed on both sides of the memory pack storage part 28. Recesses 29, 2 into which walls 19a, 19a and locking claws 20, 20 are movably inserted
9 are formed respectively, and these recesses 29, 29
At one end side, a locking claw 20 of the pack fixing plate 19,
Groove-shaped locking portions 30, 30 for locking 20 are formed, respectively. In addition, the memory pack storage section 28
An alignment recess 31 into which the alignment claw 22 of the memory pack fixing plate 19 is inserted is formed at the center of one end. Further, on the inner bottom surface of the pack storage portion 28, that is, on the lower surface of the circuit board 26, a plurality of memory pack connection terminal electrodes 32 corresponding to each terminal electrode 16 of the memory pack A are arranged in an array.

Memory pack A for the above small electronic translator B
To explain how to load memory pack A into translator B, first remove the back cover 25 from translator B to open the memory pack storage part 28, and then load the memory pack into this memory pack storage part 28. Insert and store pack A. In this way, store the memory pack A in the memory pack storage section 28.
When the terminal electrode 16 of memory pack A is stored,
...Interconnector 17 whose bottom surface is in contact with the top
are sandwiched between the terminal electrodes 16 of the memory pack A and the terminal electrodes 32 provided in the memory pack housing 28 of the translator B. After this, while pressing the memory pack A against the inner bottom surface of the memory pack storage section 28, press the pack fixing plate 19.
, and the locking pawls 20, 20 and the positioning pawl 22 of the pack fixing plate 19 are inserted and engaged with the locking portions 30, 30 and the positioning recess 31 of the memory pack storage portion. In this case, if the memory pack A is accidentally stored with the right and left sides reversed, the locking claws 20, 20 and the alignment claws 22 will come into contact with the inner wall of the memory pack storage section 28, causing the pack fixing plate 19 to move further. Because you won't be able to
Memory pack A can be prevented from being inserted in the wrong direction.

As described above, the locking claw 2 of the pack fixing plate 19 is
0,20 at the locking part 3 of the memory pack storage part 28.
When engaged with 0 and 30, memory pack A is
The terminal electrode 16... and the memory pack storage section 28
The interconnector 17 is connected between the terminal electrodes 32...
are compressed and clamped by the pack fixing plate 19, whereby the terminal electrodes 16 of the memory pack A and the terminal electrodes 32 of the translator B are securely connected via the interconnector 17. After this, all you have to do is attach the back cover 25 to the translator B again and cover the memory pack storage section 28. Note that the back cover 25 has a protrusion 3 protruding from its inner surface.
3 and 33 are formed protrudingly. This protrusion 3
3 and 33 are in contact with the rear edge of the pack fixing plate 19 to prevent the pack fixing plate 19 from moving toward the rear end.If these protrusions 33 and 33 are provided on the back cover 25, vibrations can be prevented. This can prevent the pack fixing plate 19 from shifting and the locking claws 20, 20 coming off from the locking portions 30, 30. Furthermore, the memory pack A is fixed to the memory pack storage section 28 by the pack fixing plate 19 provided on the memory pack, not by the back cover 25 of the translator B. Even if you remove the back cover 25 of the pack fixing plate 19,
The memory pack will not lift up unless it is removed from the memory pack. Therefore, even if you accidentally remove the back cover 25 while using the translator B, the terminal electrodes 16 of the memory pack A will be connected to the terminal electrodes 32 of the memory pack housing. ...It will not cause any abnormality in the operation of the translator.

In addition, when removing memory pack A from translator B, remove the back cover 25 and then remove the pack fixing plate 19.
The memory pack A can be removed by moving the memory pack A to release it from the locking parts 30, 30.

Therefore, in the above connection structure, the terminal electrodes 16 of the memory pack A and the small electronic translator B
Since the terminal electrodes 32 of the memory pack A and the translator B are connected in contact with each other through the interconnector 17 sandwiched between the two terminal electrodes, even if an impact is applied to the translator, the interconnector 17 will protect the memory pack A and the translator B.
The terminal electrodes 16 . . . , 32 . . . That is, in the above connection structure, the interconnector 17 is used instead of the conventional elastic contact piece made of a leaf spring for the electrical connection of the terminal electrodes 16..., 32... between the memory pack A and the translator B. 17 is sandwiched between the terminal electrodes 16..., 32..., so that when the translator B is in use, the translator B
Even if a shock is applied to the translator, the interconnector 17 will not separate from the terminal electrodes 16, 32, etc., and the translator will not malfunction.

In addition, in the above embodiment, the connection of the memory pack in a small electronic translator was explained.
This invention can also be applied to the connection of memory packs in small electronic devices other than small electronic translators, and the types of memory packs can be ROM (read only memory), RAM (random access memory), It may be either ROM or RAM.

Further, in the above embodiments, the interconnector is provided in the memory pack, but this interconnector may be provided in the memory pack housing portion of a small electronic device.

[Effect of idea]

This idea was developed by engaging the locking pawl of the pack fixing plate, which is slidably attached to the exterior panel of the memory pack, into the groove-shaped locking part provided on the side of the memory pack storage part of the small electronic device. , the terminal electrodes of the memory pack and the terminal electrodes placed inside the memory pack housing of the small electronic device are connected by pressure-welding and clamping the interconnector interposed between both terminal electrodes. The terminal electrodes of the device and the terminal electrodes of the memory pack can be connected in contact with each other so that they will not come into contact with each other due to impact, and therefore it is possible to prevent abnormal operation of the small electronic device due to impact.

[Brief explanation of the drawing]

The drawings show one embodiment of this invention. Figure 1 is an exploded perspective view showing the connection structure between the memory pack and a small electronic translator, and Figures 2 and 3 are a front view and side view of the memory pack. 4 is an enlarged sectional view taken along the - line in FIG. 2, and FIG. 5 is an exploded perspective view of the memory pack. A...Memory pack, 14...Memory element, 1
6...Terminal electrode, 17...Interconnector, B...
...Small electronic translator, 28...Memory pack storage section, 32...Terminal electrode.

Claims (1)

[Scope of utility model registration request] A memory pack in which a pack fixing plate having locking claws projecting laterally from a pair of sides is slidably attached to an exterior panel of a memory pack having terminal electrodes, and the memory pack is housed in a small electronic device. A memory pack storage part is provided, and a plurality of terminal electrodes corresponding to each terminal electrode of the memory pack are arranged in the memory pack storage part, and each locking plate of the pack fixing plate is arranged on the side of the memory pack storage part. A recess into which a pawl is inserted and a groove-shaped locking portion whose one end is inserted into the recess and into which each of the locking pawls can be engaged are provided, and the terminal electrode of the memory pack and the terminal electrode of the small electronic device are connected to each other. When the locking claws are locked to the locking portions of the memory pack storage section of the small electronic device by sliding movement of a pack fixing plate interposed between both terminal electrodes and attached to the memory pack, the both ends A connection structure between a memory pack and a small electronic device, characterized in that they are connected by an interconnector compressed and clamped between child electrodes.