JPH0316335U - - Google Patents

Info

Publication number
JPH0316335U
JPH0316335U JP1989076959U JP7695989U JPH0316335U JP H0316335 U JPH0316335 U JP H0316335U JP 1989076959 U JP1989076959 U JP 1989076959U JP 7695989 U JP7695989 U JP 7695989U JP H0316335 U JPH0316335 U JP H0316335U
Authority
JP
Japan
Prior art keywords
spot light
wire bonding
diagram showing
bonding position
bonding device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989076959U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989076959U priority Critical patent/JPH0316335U/ja
Publication of JPH0316335U publication Critical patent/JPH0316335U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07168—Means for storing or moving the material for the connector
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図はこの考案においてスポツトライト照射
角度が切換わる場合の実施例によるワイヤボンデ
イング装置を示す構成図、第２図は複数のスポト
ライトのＯＮ−ＯＦＦを切換える場合の他の実施
例を示す構成図、第３図は高さ検出機能を備えた
場合の他の実施例を示す図、第４図はスポツトラ
イトが無い場合の従来のワイヤボンデイング装置
を示す図、第５図はスポツロライトがある場合の
従来のワイヤボンデイング装置を示す図である。 図中、１はキヤピラリ、２はワイヤ、３はクラ
ンパ、４はワイヤシユプール、５は顕微鏡、６は
基板、７はチツプ部品、８はボンデイングパツド
、９は加熱台（固定台）、１０はスポツトライト
、１１は高さ検出センンサ、１２はコントローラ
。なお、図中同一符号は同一又は相当部分を示す
。

Claims (1)

    【実用新案登録請求の範囲】
  1. ワイアボンデイング位置を示すためのスポツト
    ライト、このスポツトライトがボンデイング面の
    高さが変化しても正確にボンデイング位置を示す
    機構を備えたことを特徴とするワイヤボンデイン
    グ装置。
JP1989076959U 1989-06-28 1989-06-28 Pending JPH0316335U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989076959U JPH0316335U (ja) 1989-06-28 1989-06-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989076959U JPH0316335U (ja) 1989-06-28 1989-06-28

Publications (1)

Publication Number Publication Date
JPH0316335U true JPH0316335U (ja) 1991-02-19

Family

ID=31618898

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989076959U Pending JPH0316335U (ja) 1989-06-28 1989-06-28

Country Status (1)

Country Link
JP (1) JPH0316335U (ja)

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