JPH0317007U - - Google Patents

Info

Publication number
JPH0317007U
JPH0317007U JP7756389U JP7756389U JPH0317007U JP H0317007 U JPH0317007 U JP H0317007U JP 7756389 U JP7756389 U JP 7756389U JP 7756389 U JP7756389 U JP 7756389U JP H0317007 U JPH0317007 U JP H0317007U
Authority
JP
Japan
Prior art keywords
semiconductor element
pasting
taping apparatus
view
showing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7756389U
Other languages
English (en)
Other versions
JPH0613042Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP7756389U priority Critical patent/JPH0613042Y2/ja
Publication of JPH0317007U publication Critical patent/JPH0317007U/ja
Application granted granted Critical
Publication of JPH0613042Y2 publication Critical patent/JPH0613042Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Description

【図面の簡単な説明】
第１図は本考案の実施例１を示す断面図、第２
図は第１図の貼付けヘツド下降状態を示す断面図
、第３図は本考案の実施例２を示す断面図、第４
図は半導体素子テーピング状態を示す斜視図、第
５図は従来の半導体素子テーピング装置を示す断
面図である。 １……半導体素子、２……貼付けヘツド、３…
…吸着孔、４……キヤリアテープ、５……粘着テ
ープ、６……ラベラベース、７……貼付けパツト
、８……スプリング、９……圧力調整ネジ、１０
……継手、１１……圧力調整弁、１２……エアー
源。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体素子をキヤリアテープ上に複数個同時に
    貼付けるテーピング装置において、ラベラベース
    部に、貼付け圧力を個々に設定する機構を有する
    ことを特徴とする半導体素子テーピング装置。
JP7756389U 1989-06-30 1989-06-30 半導体素子テーピング装置 Expired - Lifetime JPH0613042Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7756389U JPH0613042Y2 (ja) 1989-06-30 1989-06-30 半導体素子テーピング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7756389U JPH0613042Y2 (ja) 1989-06-30 1989-06-30 半導体素子テーピング装置

Publications (2)

Publication Number Publication Date
JPH0317007U true JPH0317007U (ja) 1991-02-20
JPH0613042Y2 JPH0613042Y2 (ja) 1994-04-06

Family

ID=31620068

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7756389U Expired - Lifetime JPH0613042Y2 (ja) 1989-06-30 1989-06-30 半導体素子テーピング装置

Country Status (1)

Country Link
JP (1) JPH0613042Y2 (ja)

Also Published As

Publication number Publication date
JPH0613042Y2 (ja) 1994-04-06

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term